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RFI and EMI - Contacts, Fingerstock and Gaskets
| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Packaging | Product Status | Type | Shape | Width | Length | Height | Material | Plating | Plating - Thickness | Attachment Method | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
67SLH050050050PI00RFI FILM OVER FOAM PU SOLDER Laird Technologies EMI |
14,639 | 0.22 |
|
Datasheet |
SMD Grounding Metallized | Tape & Reel (TR) | Active | Film Over Foam | Hourglass | 0.197" (5.00mm) | 0.197" (5.00mm) | 0.197" (5.00mm) | Polyurethane Foam, Tin-Copper Polyester (SN/CU) | - | - | Solder | -40°C ~ 70°C |
|
67SLG050060050PI00RFI FILM OVER FOAM PU SOLDER Laird Technologies EMI |
753 | 0.00 |
|
Datasheet |
SMD Grounding Metallized | Tape & Reel (TR) | Active | Film Over Foam | Rectangle | 0.197" (5.00mm) | 0.197" (5.00mm) | 0.236" (6.00mm) | Polyurethane Foam, Tin-Copper Polyester (SN/CU) | - | - | Solder | -40°C ~ 70°C |
|
|
67SLH060100050PI00RFI FILM OVER FOAM PU SOLDER Laird Technologies EMI |
7,783 | 0.74 |
|
Datasheet |
SMD Grounding Metallized | Tape & Reel (TR) | Active | Film Over Foam | Hourglass | 0.236" (6.00mm) | 0.197" (5.00mm) | 0.394" (10.00mm) | Polyurethane Foam, Tin-Copper Polyester (SN/CU) | - | - | Solder | -40°C ~ 70°C |
|
67B6G2007503015R00RFI FINGERSTOCK BECU GOLD SOLDER Laird Technologies EMI |
886 | 0.59 |
|
Datasheet |
B6G | Tape & Reel (TR) | Active | Fingerstock | - | 0.079" (2.00mm) | 0.295" (7.50mm) | 0.118" (3.00mm) | Beryllium Copper | Gold | - | Solder | - |
|
BMI-C-004RFI FINGERSTOCK BECU GOLD SOLDER Laird Technologies EMI |
5,411 | 1.57 |
|
Datasheet |
BMI-C | Tape & Reel (TR) | Active | Fingerstock | - | 0.170" (4.32mm) | 0.235" (5.97mm) | 0.204" (5.17mm) | Beryllium Copper | Gold | - | Solder | - |
|
67B3G2504810010R00RFI FINGERSTOCK BECU GOLD SOLDER Laird Technologies EMI |
2,085 | 1.53 |
|
Datasheet |
B3G | Tape & Reel (TR) | Active | Fingerstock | - | 0.098" (2.50mm) | 0.189" (4.80mm) | 0.394" (10.00mm) | Beryllium Copper | Gold | - | Solder | - |
|
0097072802GASKET BECU 15.88X11.35MM Laird Technologies EMI |
1,840 | 3.10 |
|
Datasheet |
USB Connector | Bulk | Active | - | - | 0.625" (15.88mm) | 0.447" (11.35mm) | - | - | - | - | - | - |
|
4223PA51H01800RFI FOF GASKET PU ADH Laird Technologies EMI |
448 | 5.29 |
|
Datasheet |
51H | Bulk | Active | Fabric Over Foam | Rectangle | 0.157" (4.00mm) | 18.000" (457.20mm) | 0.039" (1.00mm) | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | - | - | Adhesive | - |
|
4688PA51H01800RFI FOF GASKET PU ADH Laird Technologies EMI |
1,255 | 5.60 |
|
Datasheet |
51H | Bulk | Active | Fabric Over Foam | Rectangle | 0.118" (3.00mm) | 18.000" (457.20mm) | 0.079" (2.00mm) | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | - | - | Adhesive | - |
|
4220PA51H01800RFI FOF GASKET PU ADH Laird Technologies EMI |
979 | 5.60 |
|
Datasheet |
51H | Bulk | Active | Fabric Over Foam | Rectangle | 0.201" (5.10mm) | 18.000" (457.20mm) | 0.039" (1.00mm) | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | - | - | Adhesive | - |
