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- 2026.08.10 Analog Devices Price Increase September 2026: What Buyers Need to Know Analog Devices will raise prices on September 13, 2026 as demand, manufacturing costs and capacity needs increase. With selected lead times already reaching six months, buyers should review backlog pri…
- 2026.08.09 MaxLinear Price Increase 2026: MPP Pricing, Foundry Costs and Buyer Impact MaxLinear’s MPP price adjustment took effect Aug. 7, 2026. This report explains foundry, OSAT and wafer cost pressure, backlog repricing, rising production commitments and H2 buyer risks.
- 2026.08.05 Semiconductor Market Split 2026: Analog and MCU Recovery vs Smartphone SoC Decline Analog, MCU and power chip suppliers are recovering as inventories fall and AI infrastructure grows, while smartphone SoC demand declines under memory-cost pressure and weaker handset production.
- 2026.08.04 What ST's Q2 2026 Results Reveal About MCU Supply, Channel Inventory and Spot-Market Risk ST's Q2 2026 results show low channel inventory, strong MCU orders and selective tightness. This report examines STM32 spot-market volatility, AI optical demand, industrial replenishment and buyer acti…
- 2026.07.31 Renesas Takasaki Factory Closure: Product Risks Behind the 6-Inch Fab Exit Renesas will phase out its Takasaki 6-inch wafer factory over two to three years. This report explains product-level risks for legacy power, diode and analog devices, confirmed PCN evidence, lifecycle …
- 2026.07.30 Taiyo Yuden's Second MLCC Price Increase Signals Broader Supply Pressure Taiyo Yuden’s second 2026 MLCC notice expands pressure from selected series to broader MLCC coverage. The report explains September pricing, delivery risk, AI and automotive demand, 2018 differences, …
- 2026.07.29 Japan's 2026 Kumamoto Earthquake: Chip Supply Risks and Lessons from 2016 The 2026 Kumamoto earthquake disrupted Japan’s semiconductor hub. This report compares the event with 2016, assesses risks to Sony, Renesas and JASM, and outlines recovery scenarios and buyer actions.
- 2026.07.29 Murata’s Large-Case MLCC Withdrawal: Capacity Shift, Replacement Risk and Buyer Actions Murata’s withdrawal of selected large-case MLCCs reflects a shift toward smaller, higher-capacitance and higher-value products. The report explains affected sizes, replacement risks, supply impacts an…
- 2026.07.28 Qualcomm's Price Increase: What It Reveals About AI Capacity, Android Costs and Pricing Power Qualcomm’s September 2026 price increase extends beyond a routine adjustment. The report analyzes advanced-node costs, AI resource reallocation, Android pricing power, lead-time risks, wider semicondu…
- 2026.07.27 How TI's Direct-Sales Strategy Amplified a 23% Revenue Surge Texas Instruments’ Q2 2026 results show a broad recovery across industrial, automotive and data-center markets. The article explains how TI’s direct-sales model improved demand visibility, pricing co…
- 2026.07.23 Diodes Incorporated Lead Times Reach 74 Weeks as MOSFET and Logic Supply Tightens Diodes Incorporated is facing extended lead times across MOSFETs, rectifiers, protection devices, logic ICs and power products. The article examines 40–74 week supply signals, demand drivers, manufact…
- 2026.07.16 BCD Chip Supply Tightens as AI Power Demand Competes With Automotive and Industrial Markets AI server, automotive and industrial demand is tightening selected BCD and smart-power IC supply, especially PMICs, smart switches, drivers and battery-management devices, increasing lead-time and sour…
- 2026.07.14 Nomura's Semiconductor Renaissance: Nine Shifts Reshaping Chipmakers Through 2030 Nomura's 2026–2030 semiconductor outlook identifies nine technology shifts reshaping chipmakers, memory, power devices and optical ICs, while raising material, packaging, capacity and sourcing risks …
- 2026.07.11 STMicroelectronics MCU Lead Times Extend to 52 Weeks as Distributors Seek Full-Year 2027 Orders STMicroelectronics has extended lead times across multiple MCU families, with several 90nm STM32 products reaching 52 weeks. The notice also calls for full-year 2027 orders and migration toward 40nm ST…
- 2026.07.10 Can CXMT Break the DRAM Triopoly as AI Reshapes the Memory Market? CXMT is emerging as a fourth DRAM supply variable as AI shifts Samsung, SK hynix and Micron toward HBM, with early impact likely in commodity DRAM, DDR5 and LPDDR5X rather than near-term HBM leadership…
- 2026.07.08 MLCC Spot Market Diverges as Commodity Prices Soften and AI Demand Stays Tight The MLCC spot market is diverging as low-cap commodity prices soften while AI server and automotive MLCCs stay tight, pushing buyers to separate spot savings from high-end supply risk.
- 2026.07.06 PCB Material Price Hikes Enter New Phase as CCL, FR-4 and Resin Costs Rise PCB material price hikes are spreading across CCL, FR-4, prepreg, copper foil and resins, forcing buyers to review PCB quotes, open orders, backlog coverage and approved laminate alternatives.
- 2026.07.05 Intel CPU Price Increase Puts PC and Server BOM Costs Back in Focus Intel has raised prices on selected Core Ultra 200S Plus and Xeon processors, adding cost pressure to PC, workstation and server BOM planning as buyers review quotes, backlog coverage and platform budg…
- 2026.07.03 Analog Devices Lead Time Update 2026: Why ADI Buyers Are Being Asked to Order Six Months Ahead Analog Devices has warned customers that supply is tightening across part of its portfolio, with lead times extending up to six months.
- 2026.07.02 Memory Chip Prices May Fall, But AI Has Changed the Old DRAM Cycle The memory market is still cyclical, but this cycle is no longer driven mainly by short consumer electronics demand. AI infrastructure has changed the demand base, while HBM and server DDR5 are reshapi…
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