JCET

JCET is a global leader in semiconductor packaging and testing, offering advanced solutions including SiP (System-in-Package), WLP (Wafer-Level Packaging), and Flip Chip technologies. With 8 production bases and 2 R&D centers across China, South Korea, and Singapore, JCET provides end-to-end services from chip design to final testing. Its SiC and GaN packaging technologies support next-gen applications in EVs, 5G, and AI servers. JCET ranks among the top 3 global OSAT providers, serving customers like Qualcomm and Tesla