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Infineon Introduces TDM24745T Quad-Phase Power Module for AI Data Centers
Article Details
Infineon Technologies AG has launched the TDM24745T, a high-current-density quad-phase power module with integrated TLVR (trans-inductor voltage regulator) inductors designed for next-generation AI accelerators and GPU platforms. The new OptiMOS™ power module integrates four power stages, TLVR inductors, and decoupling capacitors inside a compact 9 × 10 × 5 mm³ package.
Delivering an industry-leading current density of more than 2 A/mm², the module is optimized for advanced AI server power delivery architectures, supporting both lateral and vertical power delivery configurations. The solution is designed to improve transient response, reduce output capacitance requirements, and enhance overall system efficiency in AI data center environments.
Key Features
| Feature | Description |
|---|---|
| Quad-Phase Integrated Design | Integrates four power stages, TLVR inductors, and decoupling capacitors into a single compact module. |
| High Current Density | Delivers current density exceeding 2 A/mm² for space-constrained AI server applications. |
| Peak Current Capability | Supports up to 320 A peak current for high-performance AI processors and GPU core rails. |
| TLVR Architecture | Improves transient response while reducing output capacitance requirements by up to 50%. |
| Compact Package | Small 9 × 10 × 5 mm³ form factor enables higher PCB power density. |
| OptiMOS™-6 MOSFET Technology | Provides enhanced efficiency and thermal performance for dense AI server designs. |
| Scalable Power Architecture | Compatible with Infineon digital multiphase controllers for flexible AI platform deployment. |
| Advanced Integration | Utilizes chip-embedded integration and proprietary magnetics for improved power delivery efficiency. |
Target Applications
| Application | Description |
|---|---|
| AI Accelerators | Optimized for powering next-generation AI accelerator chips requiring high transient current response. |
| GPU Core Power Rails | Supports high-current GPU voltage regulation in AI training and inference systems. |
| AI Servers | Designed for high-density AI server power architectures in hyperscale data centers. |
| Multi-Processor Platforms | Suitable for systems with multiple high-performance processors operating simultaneously. |
| Cloud Computing Infrastructure | Helps improve power efficiency and thermal management in cloud AI computing environments. |
| High-Performance Computing (HPC) | Supports advanced computing workloads requiring compact and efficient power delivery solutions. |
| AI Factories | Contributes to energy-efficient AI factory deployments with reduced total cost of ownership (TCO). |
AI Server Power Delivery Ecosystem
The TDM24745T integrates into Infineon's end-to-end AI server power delivery ecosystem, covering everything from grid-level power conversion to processor core voltage regulation. By combining silicon (Si), silicon carbide (SiC), and gallium nitride (GaN) technologies, Infineon aims to deliver scalable, efficient, and robust power architectures for AI-optimized data centers.
The module's TLVR-based design enables faster transient response and reduces PCB area requirements, helping system designers free up valuable board space for additional compute resources while improving overall system efficiency and thermal performance.
