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Planar Spiral Inductor Calculator

Planar Spiral Inductor Calculator

Estimate PCB planar spiral inductance, copper resistance, Q factor, inner dimension, and trace length from spiral geometry.

Input Parameters

Outer side length or diameter of the spiral footprint.
Integer number of spiral turns.
Copper trace width.
Spacing between adjacent turns.
µm
Nominal copper thickness.
Used for Q factor estimation.

Results

Estimated Inductance
106.385 nH
DC Copper Resistance
0.207537 Ω
Approximate Q Factor
322.082
Inner Dimension
2.9 mm
Approximate Trace Length
63.2 mm
Design Note
Good for first-pass spiral estimate

For RF spirals, treat Q and high-frequency behavior as approximate.

Equations Used

Inductance Model:

Uses the modified Wheeler/Mohan-style planar spiral approximation.

Fill Ratio:

ρ = (Dout - Din) / (Dout + Din)

Copper Resistance:

R = ρCu × length / area

Q Factor:

Q ≈ 2πfL / R for a simplified copper-loss estimate.

Frequently Asked Questions (FAQ)

Q1: What does this spiral inductor calculator estimate?
It estimates inductance, copper resistance, Q factor, inner dimension, and approximate trace length for a PCB planar spiral.

Q2: Is this accurate for RF IC or microwave spiral inductors?
It is a first-pass estimate. RF inductors require EM simulation because substrate loss, parasitic capacitance, and metal thickness matter.

Q3: Why does spacing affect inductance?
Spacing changes the average diameter and magnetic coupling between turns.

Q4: Why is Q only approximate?
The Q estimate uses simple copper resistance and does not include skin effect, proximity effect, substrate loss, or parasitic capacitance.

Q5: When should I use EM simulation?
Use EM simulation for RF, high-Q, high-frequency, or production-critical spiral inductors.

Q6: Can this be used for PCB power inductors?
No. It is for planar spiral geometry, not wound power inductors with magnetic cores.

Disclaimer: This tool is intended for first-pass engineering estimates only. Planar spiral inductance and Q depend on copper thickness, skin effect, proximity effect, substrate loss, solder mask, parasitic capacitance, and layout environment. Verify RF spiral inductors with EM simulation and measurement.
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