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Via Inductance Calculator

Via Inductance Calculator

Estimate PCB via inductance, parallel via reduction, high-frequency reactance, and edge-induced voltage from via length, diameter, frequency, and current slew.

Input Parameters

Effective barrel length through the PCB.
Finished hole or barrel diameter used for inductance estimate.
Parallel vias reduce equivalent inductance.
Used to calculate inductive reactance.
A
Used for L × di/dt voltage estimate.
Current transition time for edge-induced voltage.

Results

Single Via Inductance
1.29929 nH
Parallel Via Inductance
1.29929 nH
Inductive Reactance
8.16366 Ω
L × di/dt Voltage
1.29929 V
Design Note
Good for first-pass via estimate

For fast edges, L × di/dt can be more important than the small DC resistance.

Equations Used

Via Inductance:

L(nH) ≈ 5.08 × h(in) × [ln(4h/d) + 1]

Parallel Vias:

Leq ≈ Lsingle / number of vias

Reactance:

XL = 2πfL

Edge Voltage:

V = L × di/dt

Frequently Asked Questions (FAQ)

Q1: Why does via inductance matter?
Via inductance can cause voltage spikes, RF discontinuities, decoupling degradation, and switching noise.

Q2: How do parallel vias help?
Multiple vias in parallel reduce equivalent inductance and spread current.

Q3: Is via diameter important?
Yes. Larger diameter generally reduces inductance, but via length and return path also matter.

Q4: Does this include via pad capacitance?
No. This calculator focuses on inductance and reactance, not full via impedance modeling.

Q5: How should decoupling vias be placed?
Use short, wide, multiple vias close to capacitor pads and planes.

Q6: Do RF vias need special treatment?
Yes. RF vias often require via fences, anti-pad control, and EM simulation.

Disclaimer: This calculator uses a common empirical via inductance approximation. Actual via impedance depends on pads, anti-pads, planes, return vias, via stubs, plating, frequency, and 3D field effects. Use EM extraction for high-speed or RF-critical vias.
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