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Home > Products > RF and Wireless > RFI and EMI - Contacts, Fingerstock and Gaskets

RFI and EMI - Contacts, Fingerstock and Gaskets

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Shape	Width	Length	Height	Material	Plating	Plating - Thickness	Attachment Method	Operating Temperature
8409016854 RFI GASKET BECU Laird Technologies EMI	1,936	9.37	RFQ	-	Electronit	Bulk	Active	Gasket	Rectangle	1.035" (26.30mm)	-	0.283" (7.20mm)	Beryllium Copper	-	-	-	-31°C ~ 100°C
4096PAX1R03937 RFI FOF GASKET PU ADH Laird Technologies EMI	2,152	15.07	RFQ	Datasheet	EcoTemp™ 85 X1R	Bulk	Active	Fabric Over Foam	Rectangle	0.275" (6.99mm)	39.370" (1.00m)	0.080" (2.03mm)	Polyurethane Foam, Nickel-Copper Taffeta (NI/CU)	-	-	Adhesive	-40°C ~ 85°C
4295PAX1R03937 RFI FOF GASKET PU ADH Laird Technologies EMI	1,006	15.10	RFQ	Datasheet	EcoTemp™ 85 X1R	Bulk	Active	Fabric Over Foam	D-Shape	0.250" (6.35mm)	39.370" (1.00m)	0.170" (4.32mm)	Polyurethane Foam, Nickel-Copper Taffeta (NI/CU)	-	-	Adhesive	-40°C ~ 85°C
0C97043817 RFI FINGERSTOCK BECU TIN HARDWR Laird Technologies EMI	1,576	12.21	RFQ	-	Large Enclosure	Bulk	Active	Fingerstock	-	1.090" (27.69mm)	25.00' (7.60m)	0.250" (6.35mm)	Beryllium Copper	Tin	299.99µin (7.62µm)	Hardware, Rivet, Solder	121°C
0C97043819 RFI FINGERSTOCK BECU NICK HARDWR Laird Technologies EMI	3,864	12.21	RFQ	-	Large Enclosure	Bulk	Active	Fingerstock	-	1.090" (27.69mm)	25.00' (7.60m)	0.250" (6.35mm)	Beryllium Copper	Nickel	299.99µin (7.62µm)	Hardware, Rivet, Solder	121°C
4105PA51H03937 RFI FOF GASKET PU ADH Laird Technologies EMI	3,364	15.17	RFQ	Datasheet	51H	Bulk	Active	Fabric Over Foam	D-Shape	0.500" (12.70mm)	39.370" (1.00m)	0.375" (9.53mm)	Polyurethane Foam, Nickel-Copper Taffeta (NI/CU)	-	-	Adhesive	-40°C ~ 70°C
4788PAX1R03937 RFI FOF GASKET PU ADH Laird Technologies EMI	3,046	15.20	RFQ	Datasheet	EcoTemp™ 85 X1R	Bulk	Active	Fabric Over Foam	Rectangle	0.250" (6.35mm)	39.370" (1.00m)	0.125" (3.18mm)	Polyurethane Foam, Nickel-Copper Taffeta (NI/CU)	-	-	Adhesive	-40°C ~ 85°C
8011-2007 ECMR,NEOSP,MON,RL 11.1MM Laird Technologies EMI	4,137	12.36	RFQ	-	-	Bulk	Active	-	-	-	-	-	-	-	-	-	-
4206PA51H03937 RFI FOF GASKET PU ADH Laird Technologies EMI	3,343	15.33	RFQ	Datasheet	51H	Bulk	Active	Fabric Over Foam	Square	0.395" (10.03mm)	39.370" (1.00m)	0.395" (10.03mm)	Polyurethane Foam, Nickel-Copper Taffeta (NI/CU)	-	-	Adhesive	-40°C ~ 70°C
0C97052019 RFI FINGERSTOCK BECU NICKEL ADH Laird Technologies EMI	4,061	12.46	RFQ	-	All-Purpose	Bulk	Active	Fingerstock	-	0.370" (9.40mm)	16.000" (406.40mm)	0.140" (3.56mm)	Beryllium Copper	Nickel	299.21µin (7.60µm)	Adhesive	121°C

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