Samsung Semiconductor, Inc. K4B4G1646E-BCNB
- Part No.:
- K4B4G1646E-BCNB
- Manufacturer:
- Samsung Semiconductor, Inc.
- Category:
- Memory
- Package:
- 96‑ball FBGA
- Description:
- SDRAM DDR3 E-die 4Gb 256Mx16 1.5V 1066MHz
- Quantity:
- Payment:

- Shipping:

Inventory:5,000
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Product details
Overview
Samsung K4B4G1646E-BCNB is a 4Gb DDR3 SDRAM device designed for high-performance computing, embedded systems, networking equipment, and industrial applications. The memory offers high-speed data transfer, low power consumption, and reliable system operation. Its x16 bus configuration provides a total of 512 MB storage capacity, organized internally as 256M × 16-bit.
Engineers referencing the Samsung K4B4G1646E-BCNB datasheet, pinout, or equivalent devices can leverage this DDR3 memory for servers, embedded platforms, graphics systems, and high-bandwidth industrial applications.
Technical Context
K4B4G1646E-BCNB operates as a DDR3 synchronous DRAM, interfacing with memory controllers through differential clocking and burst transfer operations. It supports standard DDR3 timing, programmable CAS latency, auto-refresh, and self-refresh functions. The device ensures data integrity and signal stability across a range of operating temperatures, making it suitable for servers, embedded boards, graphics processing units, and network systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Type | DDR3 SDRAM for high-speed system memory applications |
| Density | 4 Gb total capacity organized as 256M × 16-bit; x16 bus width, 512 MB effective storage |
| Data Rate | Standard DDR3 rates, e.g., DDR3‑1333/1600 MT/s, supporting high-bandwidth systems |
| Voltage | 1.5 V nominal supply for DDR3 compatibility |
| Package | BGA package suitable for high-density PCB integration |
| Operating Temperature Range | Commercial and industrial options available, e.g., 0°C to 85°C or -40°C to 85°C |
| CAS Latency | Programmable CAS latency for system timing optimization |
| Refresh | Auto-refresh and self-refresh support for data integrity |
| Data Width | 16-bit memory bus supporting x16 configuration |
Pinout & Package
The K4B4G1646E-BCNB pinout includes standard DDR3 address, command, data, clock, and control signals. Proper PCB routing should include matched-length data and strobe lines, differential clock pairs, controlled impedance, and power/ground decoupling for high-speed operation.
| Pin / Function | PCB Design and Circuit Role |
|---|---|
| DQ[0:15] | Data input/output lines forming a 16-bit bus; matched timing and impedance critical for signal integrity |
| DQS / DQS# | Data strobe and complementary strobe for synchronized read/write operations |
| CK / CK# | Differential clock input for synchronous operation |
| Address / Command Pins | Transmit memory addresses, bank select, and control commands to the DRAM |
| VDD / VSS / VDDQ / VSSQ | Power and ground connections; require decoupling for high-speed performance |
Key Features
- 4 Gb DDR3 SDRAM memory for high-speed applications
- x16 bus width, 256M × 16-bit internal organization
- Supports DDR3 data rates up to 1600 MT/s
- Programmable CAS latency and burst lengths
- Auto-refresh and self-refresh support
- 1.5 V nominal supply voltage
- BGA package suitable for compact PCB integration
- Industrial and commercial operating temperature variants
Applications
| Servers and Computing | Networking Equipment |
|---|---|
|
Use Scenario: Memory expansion in servers, workstations, and embedded computing platforms IC Role: Provides high-speed data storage for operating systems and applications Use Value: Ensures high bandwidth and low-latency memory access |
Use Scenario: Routers, switches, and communication modules IC Role: Supplies buffer and temporary storage for data packets Use Value: Improves system throughput and network performance |
| Embedded Systems | Graphics & Multimedia |
|
Use Scenario: Embedded controllers, FPGA boards, and DSP platforms IC Role: Provides temporary memory for computation and buffering Use Value: Supports high-speed data processing and real-time operations |
Use Scenario: Graphics cards and video-processing modules IC Role: Acts as frame buffer and temporary image storage Use Value: Enhances graphics rendering and video processing performance |
Equivalent & Alternatives
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| K4B4G1646E-BCMB | Similar 4 Gb DDR3 memory with different speed grade | Used where a slightly lower or higher memory speed is acceptable | Choose based on memory controller timing and system frequency requirements |
| MT41J256M8HX-125 | 4 Gb DDR3 from Micron with similar density and interface | High-performance server and embedded applications | Verify timing and voltage compatibility before substitution |
| IS42S16400J | 4 Gb DDR3 from ISSI with comparable interface | Memory buffer and system memory applications | Ensure matching data rate and latency for system stability |
Quality
K4B4G1646E-BCNB should be sourced as original Samsung components through traceable distribution channels. Quality verification includes electrical parameter testing, timing verification, package integrity checks, and traceability audits for long-term reliability.
Availability
K4B4G1646E-BCNB available at Aetrix Electronics and suitable for industrial, embedded, computing, and graphics platforms requiring stable memory supply and repeatable production support.
Manufacturer
Samsung Semiconductor provides memory and storage solutions, including DRAM, NAND, LPDDR, GDDR, and specialty memory for computing, embedded, mobile, and industrial applications.
FAQ
What is K4B4G1646E-BCNB used for?
It is used as high-speed DRAM memory for servers, embedded systems, networking equipment, and graphics platforms.
What is the memory organization?
Internally organized as 256M × 16-bit, providing 512 MB effective storage across a x16 bus.
What supply voltage does K4B4G1646E-BCNB require?
Standard DDR3 supply voltage of 1.5 V is required.
What should be considered in PCB design?
Matched-length DQ/DQS traces, controlled impedance routing, proper termination, and decoupling networks are critical for high-speed DDR3 operation.
K4B4G1646E-BCNB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Samsung Semiconductor, Inc.
- Series:
- Package/Case:
- 96‑ball FBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- -
- Memory Type:
- DDR3 SDRAM
- Memory Format:
- Synchronous DRAM
- Technology:
- DRAM
- Memory Size:
- 4 Gb
- Memory Organization:
- 256M ×16‑bit
- Memory Interface:
- DDR3 SDRAM 16‑bit bus
- Clock Frequency:
- 1066 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.5 V
- Operating Temperature:
- 0°C to +95°C
- Grade:
- Commercial
- Qualification:
- RoHS compliant
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 96‑ball FBGA
K4B4G1646E-BCNB FAQ
1.How can I place an order for K4B4G1646E-BCNB through Aetrix?
Please submit a Request for Quotation (RFQ) for K4B4G1646E-BCNB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for K4B4G1646E-BCNB reliable?
The price and inventory of K4B4G1646E-BCNB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for K4B4G1646E-BCNB is usually 5 days.
3.What payment methods are accepted for K4B4G1646E-BCNB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for K4B4G1646E-BCNB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for K4B4G1646E-BCNB?
K4B4G1646E-BCNB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your K4B4G1646E-BCNB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for K4B4G1646E-BCNB?
For technical support, including K4B4G1646E-BCNB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your K4B4G1646E-BCNB requirements.
6.How does Aetrix verify that K4B4G1646E-BCNB is sourced from the original manufacturer or authorized distributors?
All K4B4G1646E-BCNB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that K4B4G1646E-BCNB meets industry standards.
7.What is the process for return or replacement of K4B4G1646E-BCNB?
All K4B4G1646E-BCNB units undergo pre-shipment inspection (PSI). If there is an issue with K4B4G1646E-BCNB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The K4B4G1646E-BCNB part is unused and in its original packaging.
Return procedure for K4B4G1646E-BCNB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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