AMD XCDAISY-FF1924

Overview

XCDAISY-FF1924 from Xilinx is a daisy-chain test sample device in FF1924 flip-chip BGA package, designed for board-level signal integrity validation, PCB trace routing verification, and solder joint reliability assessment during prototype development. It contains no active silicon die, provides electrically continuous interconnect paths between adjacent balls, and supports 1924-ball fine-pitch (0.8 mm) BGA layout evaluation under JEDEC-compliant reflow conditions.

For engineers reviewing the XCDAISY-FF1924 datasheet, pinout, applications, or equivalent options, this part enables high-fidelity validation of fanout routing, thermal pad via placement, ball coplanarity tolerance, and moisture sensitivity level (MSL 3) handling prior to FPGA deployment.

Technical Context

The XCDAISY-FF1924 implements a passive, open-loop daisy-chain topology across all I/O balls in the FF1924 package footprint, with no internal logic, power regulation, or clock circuitry. Its electrical continuity path follows JEDEC-standard FF1924 ball map ordering and maintains identical mechanical dimensions, solder ball composition (SnAgCu), and thermal expansion profile as production Virtex-7 or Kintex-7 FPGAs in the same package.

It is constructed using the same cavity-down flip-chip substrate, copper pillar interconnects, and molded epoxy encapsulation as functional FF1924 devices, enabling accurate simulation of assembly-induced stress, warpage behavior, and post-reflow coplanarity shift during SMT process qualification.

Key Specifications

Availability

XCDAISY-FF1924 is available at Aetrix Electronics and suitable for high-density FPGA prototyping, PCB fabrication validation, and SMT process development requiring stable component supply, MSL-3 handling compliance, and exact FF1924 mechanical footprint replication.

Supply support for XCDAISY-FF1924 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, designs programmable logic devices and adaptive SoCs for high-performance computing, aerospace, and communications infrastructure.

The XCDAISY series belongs to Xilinx's mechanical and electrical validation toolset, developed specifically to de-risk PCB layout, assembly, and test for advanced flip-chip BGA packages used in Virtex, Kintex, and Zynq families.

FAQ

What is the primary function of XCDAISY-FF1924?

XCDAISY-FF1924 is a passive daisy-chain test vehicle with no active silicon. Its sole purpose is to replicate the mechanical, thermal, and electrical interface characteristics of the FF1924 package for PCB design verification, solder joint inspection, and SMT process qualification. XCDAISY-FF1924 enables pre-silicon validation without risking functional FPGA units.

Does XCDAISY-FF1924 contain an operational FPGA die?

No. XCDAISY-FF1924 contains no semiconductor die or logic functionality. It is a mechanical and electrical dummy device with conductive traces connecting adjacent solder balls in daisy-chain fashion. XCDAISY-FF1924 is explicitly intended for physical layer validation-not logic execution, configuration, or system bring-up.

Can XCDAISY-FF1924 be used for signal integrity testing?

Yes-XCDAISY-FF1924 supports TDR/TDT-based channel characterization because its internal trace lengths, impedance profiles, and ball-to-ball parasitics match those of production FF1924 FPGAs. Engineers use XCDAISY-FF1924 to measure insertion loss, crosstalk, and return loss on actual PCBs before committing to costly FPGA prototypes.

What is the moisture sensitivity rating for XCDAISY-FF1924?

XCDAISY-FF1924 is rated MSL 3 per JEDEC J-STD-020. This means it must be stored in sealed dry bags with desiccant and humidity indicator, and used within 168 hours of bag opening under ≤30°C/60% RH ambient conditions. XCDAISY-FF1924 shares the same moisture absorption behavior as functional FF1924 devices due to identical packaging materials.

Is XCDAISY-FF1924 compatible with standard FF1924 reflow profiles?

Yes. XCDAISY-FF1924 is qualified for the same Pb-free reflow profile as production FF1924 FPGAs: peak temperature of 260 °C, time above liquidus (TAL) of 40–80 seconds, and ramp rates conforming to JEDEC J-STD-020. XCDAISY-FF1924 withstands these conditions without delamination or ball shear failure, validating thermal robustness of the assembly process.