Cypress Semiconductor Corp CY621282BNLL-70SXET
- Part No.:
- CY621282BNLL-70SXET
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 32-SOIC (0.445", 11.30mm Width)
- Datasheet:
-
CY621282BNLL-70SXET.pdf
- Description:
- IC SRAM 1MBIT PARALLEL 32SOIC
- Quantity:
- Payment:

- Shipping:

Inventory:9,000
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Product details
Overview
CY621282BNLL-70SXET from Cypress Semiconductor is an automotive-grade 1-Mbit (128 K × 8) CMOS static RAM with -40 °C to +125 °C operation, 70 ns access time, 4.5–5.5 V supply range, and automatic CE-controlled power-down. It serves as nonvolatile data buffer in engine control units, ADAS domain controllers, and infotainment memory subsystems requiring deterministic timing and low standby current.
For engineers reviewing the CY621282BNLL-70SXET datasheet, CY621282BNLL-70SXET pinout, CY621282BNLL-70SXET application, or CY621282BNLL-70SXET equivalent, key selection criteria include its dual chip enable architecture (CE1 active-low / CE2 active-high), TTL-compatible I/O, 25 µA max ISB2 standby current at 5.5 V, and Pb-free 32-pin SOIC package with 450-mil width.
Technical Context
The CY621282BNLL-70SXET implements a fully static 128K × 8 memory array with asynchronous parallel interface. Its dual CE logic enables flexible hierarchical memory expansion-CE1 and CE2 jointly determine chip select state, while OE controls output tristate independently of WE.
Power management relies on automatic hardware power-down: when CE1 is HIGH or CE2 is LOW, ICC drops to ≤25 µA (ISB2) without external control. Read/write timing is defined by overlapping CE, OE, and WE transitions, with tRC = 70 ns, tDOE = 35 ns, and tPD = 70 ns for full deselect-to-power-down latency.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128 K × 8 bits - supports byte-wide data bus interfacing without external data multiplexing |
| Access Time (tRC) | 70 ns - guarantees deterministic read/write cycle timing for 14.3 MHz burst operation |
| VCC Range | 4.5 V to 5.5 V - compatible with automotive 5 V rail tolerances including load dump transients |
| Standby Current (ISB2) | 25 µA max at 5.5 V - enables >10-year data retention in always-on vehicle modules |
| Operating Temperature | –40 °C to +125 °C (Automotive-E grade) - qualified for under-hood ECU deployment |
| I/O Interface | TTL-compatible inputs/outputs - interoperable with legacy 5 V microcontrollers and FPGAs |
| Data Retention Voltage | 2.0 V min - maintains stored data during brown-out or battery disconnect events |
Pinout & Package
Package: 32-pin Small Outline Integrated Circuit (SOIC), 450 mil width, Pb-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address inputs | 17-bit address bus supporting full 128K-word addressing; no internal latching |
| I/O0–I/O7 | Bidirectional data lines | Tri-state capable; high-impedance when CE1 HIGH, CE2 LOW, OE HIGH, or during write |
| CE1 | Active-low chip enable | Primary chip select; must be LOW with CE2 HIGH to enable device operation |
| CE2 | Active-high chip enable | Secondary chip select; complements CE1 for multi-chip decode schemes |
| OE | Active-low output enable | Controls I/O direction only; does not affect write functionality when WE is active |
| WE | Active-low write enable | Initiates write when CE1 LOW and CE2 HIGH; overrides OE state during write cycles |
| VCC | Power supply | 4.5–5.5 V nominal; decoupling required within 10 mm of pin per automotive EMC standards |
| GND | Ground reference | Dual ground pins (pins 16 and 32) reduce ground bounce in high-speed access |
Key Features
| Feature | Design Value |
|---|---|
| Dual Chip Enable Logic | CE1 (active-low) + CE2 (active-high) enables hierarchical memory mapping in multi-SRAM systems without external logic |
| Automatic Power-Down | Hardware-triggered <75% power reduction when deselected; no software or external control needed |
| Low Standby Current | 25 µA max ISB2 at 5.5 V ensures minimal battery drain in always-on automotive modules |
| Robust Data Retention | Maintains valid data down to 2.0 V VCC with ≤25 µA ICCDR - critical for cold-cranking scenarios |
| TTL-Compatible I/O | Direct interface with legacy 5 V MCUs/FPGAs; eliminates level-shifter components and BOM cost |
Applications
| Engine Control Unit (ECU) | Advanced Driver Assistance Systems (ADAS) |
|---|---|
|
Use Scenario: Real-time sensor fusion buffer storing radar pre-processing results and CAN message queues during transient voltage conditions. IC Role / Device Role / Timing Role: Asynchronous SRAM providing zero-wait-state data staging between DSP and microcontroller under ISO 7637-2 pulse 5a load dump stress. Use Value: 70 ns tRC and 2.0 V data retention ensure uninterrupted operation during 24 V system dips to 6 V for up to 100 ms. |
Use Scenario: Camera image pipeline frame buffer in surround-view processing unit, holding uncompressed YUV422 frames before JPEG compression. IC Role / Device Role / Timing Role: Byte-accessible memory with independent OE/WE control enabling concurrent read (display path) and write (sensor path) via time-multiplexed I/O0–I/O7. Use Value: Dual CE architecture allows seamless bank switching between front/rear camera buffers without CPU intervention. |
| Infotainment Head Unit | Telematics Control Unit (TCU) |
|
Use Scenario: Audio codec parameter storage and real-time equalizer coefficient swapping during Bluetooth A2DP streaming. IC Role / Device Role / Timing Role: Low-latency SRAM acting as configuration register shadow memory, updated via SPI-to-parallel bridge with deterministic 70 ns access. Use Value: 25 µA ISB2 enables continuous audio metadata caching during display sleep mode without draining backup battery. |
Use Scenario: Cellular modem firmware overlay memory and OTA update staging area in LTE-A TCU with dual-SIM support. IC Role / Device Role / Timing Role: Nonvolatile buffer retaining critical connection state during modem reset sequences triggered by network handover. Use Value: Automatic CE power-down reduces idle current by >75% during LTE discontinuous reception (DRX) cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61LV12816AL-10TLI | 128K × 16 organization, 10 ns faster access (60 ns), 3.3 V only, commercial temp range (0–70 °C) | Requires data bus width adaptation; unsuitable for under-hood placement due to temperature rating | Select only for non-automotive 3.3 V systems where 16-bit data path and higher speed justify redesign |
| AS6C1008-70TIN | 128K × 8, 70 ns, 2.7–5.5 V, industrial temp (–40 to +85 °C), higher ISB2 (50 µA) | Lacks Automotive-E qualification; insufficient for powertrain or ADAS use cases | Acceptable for cabin-domain modules (e.g., HVAC controller) where extended temperature is not required |
Compared with IS61LV12816AL-10TLI and AS6C1008-70TIN, the CY621282BNLL-70SXET uniquely delivers automotive-grade reliability (-40 to +125 °C), dual-voltage CE logic for scalable memory maps, and sub-30 µA standby current-making it the only option qualified for safety-critical ECU and ADAS memory buffering.
Availability
CY621282BNLL-70SXET is available at Aetrix Electronics and suitable for engine control units, ADAS domain controllers, and telematics control units requiring stable component supply across automotive production lifecycles.
Supply support for CY621282BNLL-70SXET includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability semiconductor solutions for automotive, industrial, and IoT applications, with emphasis on functional safety and long-term supply stability.
The MoBL® Automotive SRAM product line targets mission-critical automotive subsystems requiring guaranteed data integrity, extended temperature operation, and AEC-Q100 compliance-specifically engineered for ECU, ADAS, and body electronics memory buffering.
FAQ
Is CY621282BNLL-70SXET AEC-Q100 qualified?
Yes. The CY621282BNLL-70SXET is AEC-Q100 qualified for Automotive Grade E (–40 °C to +125 °C ambient), with full qualification testing including HTOL, TC, UHAST, and ESD per AEC-Q100 Rev-H requirements. Test reports are available under NDA from Infineon.
What is the maximum clock frequency supported for burst reads?
The CY621282BNLL-70SXET is an asynchronous SRAM with no internal clock. Its 70 ns tRC limits sustained random-access throughput to approximately 14.3 MHz. For burst transfers, consecutive address accesses achieve effective bandwidth up to 114 MB/s (8 bits × 14.3 MHz), constrained only by external controller timing margins.
Can CE1 and CE2 be tied together for simplified interface?
No. CE1 is active-low and CE2 is active-high; tying them directly creates a permanent deselect condition. To simplify decoding, CE2 may be hardwired HIGH (via pull-up) and CE1 used as sole chip enable-but this forfeits the hierarchical expansion capability and requires external pull-up resistor design per automotive reliability standards.
Does the device retain data during cold cranking (battery drop to 6 V)?
Yes. At VCC ≥ 2.0 V, the CY621282BNLL-70SXET guarantees data retention with ICCDR ≤ 25 µA. During cold cranking where battery voltage dips to 6 V for ≤100 ms, the device remains powered above retention threshold and preserves all stored contents without corruption.
CY621282BNLL-70SXET Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- MOBL™
- Package/Case:
- 32-SOIC (0.445", 11.30mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 1Mbit
- Memory Organization:
- 128K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 70ns
- Access Time:
- 70 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-SOIC
CY621282BNLL-70SXET FAQ
1.How can I place an order for CY621282BNLL-70SXET through Aetrix?
Please submit a Request for Quotation (RFQ) for CY621282BNLL-70SXET on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY621282BNLL-70SXET reliable?
The price and inventory of CY621282BNLL-70SXET are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY621282BNLL-70SXET is usually 5 days.
3.What payment methods are accepted for CY621282BNLL-70SXET?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY621282BNLL-70SXET transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY621282BNLL-70SXET?
CY621282BNLL-70SXET orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY621282BNLL-70SXET order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY621282BNLL-70SXET?
For technical support, including CY621282BNLL-70SXET datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY621282BNLL-70SXET requirements.
6.How does Aetrix verify that CY621282BNLL-70SXET is sourced from the original manufacturer or authorized distributors?
All CY621282BNLL-70SXET products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY621282BNLL-70SXET meets industry standards.
7.What is the process for return or replacement of CY621282BNLL-70SXET?
All CY621282BNLL-70SXET units undergo pre-shipment inspection (PSI). If there is an issue with CY621282BNLL-70SXET, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY621282BNLL-70SXET part is unused and in its original packaging.
Return procedure for CY621282BNLL-70SXET:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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