Cypress Semiconductor Corp CY62137FV30LL-45ZSXAT
- Part No.:
- CY62137FV30LL-45ZSXAT
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY62137FV30LL-45ZSXAT.pdf
- Description:
- IC SRAM 2MBIT PARALLEL 44TSOP II
- Quantity:
- Payment:

- Shipping:

Inventory:1,000
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Product details
Overview
CY62137FV30LL-45ZSXAT from Cypress Semiconductor is a 2-Mbit (128 K × 16) automotive-grade CMOS static RAM with 45 ns access time, 2.2–3.6 V supply range, and –40 °C to +85 °C operating temperature (Automotive-A grade). It features byte power down, automatic power-down on deselect, and ultra-low standby current (1 µA typical). Used in infotainment head units for fast, low-power buffer memory.
For engineers reviewing the CY62137FV30LL-45ZSXAT datasheet, CY62137FV30LL-45ZSXAT pinout, CY62137FV30LL-45ZSXAT application, or CY62137FV30LL-45ZSXAT equivalent, key selection criteria include TSOP II pin compatibility with legacy CY62137 series, MoBL® low-power architecture for battery-sensitive systems, and dual-byte enable (BHE/ BLE) support for 16-bit data bus partitioning.
Technical Context
This SRAM implements a 128K × 16 asynchronous memory array with independent high- and low-byte control via BHE and BLE inputs. Its CMOS design enables deterministic timing across voltage (2.2–3.6 V) and temperature (–40 °C to +85 °C), with guaranteed tAA ≤ 45 ns and tRC = 45 ns under Automotive-A conditions.
The device uses automatic power-down logic triggered by CE HIGH or simultaneous BHE/BLE HIGH, reducing ICC to ≤5 µA max. Output drivers enter high-impedance state during deselect, OE HIGH, or write cycles - supporting clean bus sharing in multi-peripheral automotive microcontroller systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128 K × 16 bits - supports full 16-bit parallel data interface without external multiplexing |
| Access Time (tAA) | 45 ns max - ensures real-time response for MCU read bursts in ADAS sensor preprocessing |
| Supply Voltage Range | 2.2 V–3.6 V - compatible with automotive 3.3 V rails and brown-out tolerant operation |
| Standby Current (ISB2) | 5 µA max at +85 °C - enables >1-year battery backup retention in always-on telematics modules |
| Operating Temperature | –40 °C to +85 °C (Automotive-A) - qualified per AEC-Q100 Grade 2 for under-hood ECU use |
| Package | 44-pin TSOP II (10.16 mm × 18.42 mm) - surface-mount compatible with automated SMT lines and thermal pad-free PCB layout |
| Byte Enable Control | BHE and BLE inputs - allow independent 8-bit writes to upper/lower bytes, reducing bus contention in shared-memory architectures |
Pinout & Package
44-pin Thin Small Outline Package (TSOP II), 0.8 mm pitch, body size 10.16 mm × 18.42 mm, lead count 44, RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address Inputs | 17-bit address bus supporting full 128K-word addressing; A16 enables 256K total space with bank select |
| I/O0–I/O7 | Data Bus (Low Byte) | Bi-directional 8-bit data path enabled only when BLE = LOW; isolated during high-byte operations |
| I/O8–I/O15 | Data Bus (High Byte) | Bi-directional 8-bit data path enabled only when BHE = LOW; operates independently of low-byte path |
| CE | Chip Enable | Active-LOW global select; forces full device into standby (≤5 µA) when HIGH, regardless of OE/WE state |
| OE | Output Enable | Active-LOW read control; disables outputs (high-Z) when HIGH, preserving bus integrity during writes |
| WE | Write Enable | Active-LOW write strobe; initiates write cycle only when CE and corresponding byte enable are also LOW |
| BHE / BLE | Byte High/Low Enable | Independent active-LOW controls for 16-bit data bus partitioning; both HIGH places I/Os in high-Z |
| VCC / VSS | Power / Ground | Dual VCC pins (pins 31, 32) and dual VSS pins (pins 35, 36) reduce IR drop and improve noise immunity |
Key Features
| Feature | Design Value |
|---|---|
| MoBL® Ultra-Low Power Architecture | 1 µA typical standby current at +25 °C enables >10-year shelf life in sealed automotive modules |
| Automatic Power-Down Logic | Reduces active-to-standby transition time to ≤45 ns (tPD), eliminating software-controlled sleep states |
| Pin Compatibility with CY62137CV/CV25/CV30/CV33 | Drop-in replacement for legacy designs without PCB redesign or firmware changes |
| Byte Power Down | Independent BHE/BLE control allows selective disabling of high/low byte paths, cutting dynamic power by up to 50% |
| CMOS Input/Output Levels | VIH/VIL thresholds scale with VCC (e.g., VIH ≥ 2.2 V at 2.7–3.6 V), ensuring robust noise margin in noisy vehicle harness environments |
Applications
| Infotainment Head Unit Buffer Memory | ADAS Camera Preprocessing Cache |
|---|---|
Use Scenario: Stores decoded UI assets and audio buffers in automotive infotainment systems requiring zero-latency display updates and continuous background audio playback. IC Role / Device Role / Timing Role: Asynchronous SRAM providing deterministic 45 ns read latency for GPU texture fetches and DSP audio frame buffering. Use Value: Eliminates wait states in ARM Cortex-A7/A53-based SoCs, sustaining >120 MB/s sustained bandwidth at 3.3 V/85 °C. | Use Scenario: Caches raw image frames from 1–2 MP automotive cameras before FPGA or ASIC-based ISP processing in lane-departure warning systems. IC Role / Device Role / Timing Role: High-reliability, low-power buffer enabling burst-mode capture at 30 fps with minimal thermal drift. Use Value: 5 µA max ISB2 ensures <1 mW standby power in always-on camera modules, extending system-level battery runtime. |
| Telematics Control Unit (TCU) Message Queue | Body Control Module (BCM) Event Log Storage |
Use Scenario: Temporarily stores CAN message payloads and cellular modem AT command responses in LTE-connected TCUs during network handshakes or signal loss. IC Role / Device Role / Timing Role: Dual-port-capable SRAM used as FIFO buffer between MCU and modem IC, managed via BHE/BLE byte steering. Use Value: Independent byte enables prevent partial-write corruption during concurrent CAN receive and LTE transmit operations. | Use Scenario: Logs door lock/unlock events, window position, and lighting status in BCMs for diagnostic retrieval and predictive maintenance. IC Role / Device Role / Timing Role: Non-volatile-retained SRAM (with external backup supply) storing timestamped fault codes and operational history. Use Value: 1.5 V data retention threshold (VDR) allows operation down to supercapacitor backup levels, preserving logs during main-battery disconnect. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 128K × 16 SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61LV12816AL-10TLI | 10 ns access time, 3.3 V only, commercial temp (0 °C to +70 °C), no automotive qualification | Lacks AEC-Q100 Grade 2 qualification and extended temperature support | Use only in non-automotive industrial or consumer applications where cost outweighs reliability requirements |
| AS6C1008-55PCN | 55 ns access time, 2.7–3.6 V, Industrial temp (–40 °C to +85 °C), no byte enable pins | Single 8-bit data bus; requires two devices for 16-bit interface; no BHE/BLE support | Select when board space permits dual-SRAM layout and byte-level granularity is unnecessary |
Compared with IS61LV12816AL-10TLI and AS6C1008-55PCN, CY62137FV30LL-45ZSXAT uniquely delivers automotive qualification, true 16-bit byte-selectable interface, and MoBL® sub-5 µA standby - making it the only option for space-constrained, safety-critical automotive buffer memory.
Availability
CY62137FV30LL-45ZSXAT is available at Aetrix Electronics and suitable for infotainment head units, ADAS camera preprocessing subsystems, and telematics control units requiring stable component supply across extended automotive lifecycles.
Supply support for CY62137FV30LL-45ZSXAT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for automotive, industrial, and IoT applications, with focus on low-power, AEC-Q100-qualified components.
This device belongs to the MoBL® (More Battery Life™) Automotive SRAM product line, engineered specifically for energy-constrained automotive ECUs requiring deterministic timing, extended temperature operation, and long-term supply stability.
FAQ
What is the maximum clock frequency supported by CY62137FV30LL-45ZSXAT?
CY62137FV30LL-45ZSXAT is an asynchronous SRAM and does not use a clock signal. Its performance is defined by access time (tAA ≤ 45 ns) and cycle time (tRC = 45 ns), enabling reliable operation with MCU bus frequencies up to ~22 MHz in worst-case timing scenarios. No external clock input is required or supported.
Does CY62137FV30LL-45ZSXAT support data retention during power loss?
Yes - the device supports data retention down to VCC = 1.5 V with ICCDR ≤ 4 µA (Automotive-A grade). When backed by a supercapacitor or small battery, it retains stored data for hours to days after main power removal, provided CE or both BHE/BLE remain asserted and VCC stays ≥1.5 V.
Can CY62137FV30LL-45ZSXAT be used in a 32-bit data bus configuration?
No - it is strictly a 16-bit-wide device (128K × 16). To interface with a 32-bit bus, two CY62137FV30LL-45ZSXAT devices must be used in parallel, with address lines shared and data lines interleaved (e.g., lower device for D0–D15, upper for D16–D31), requiring additional address decoding logic.
Is the 44-pin TSOP II package lead-free and RoHS compliant?
Yes - CY62137FV30LL-45ZSXAT uses a lead-free, RoHS-compliant TSOP II package (JEDEC MO-143AC), with matte tin-plated leads and halogen-free molding compound. The "Z" in the suffix explicitly denotes RoHS compliance per Cypress' ordering nomenclature.
CY62137FV30LL-45ZSXAT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- MOBL™
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 2Mbit
- Memory Organization:
- 128K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 45ns
- Access Time:
- 45 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
CY62137FV30LL-45ZSXAT FAQ
1.How can I place an order for CY62137FV30LL-45ZSXAT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62137FV30LL-45ZSXAT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62137FV30LL-45ZSXAT reliable?
The price and inventory of CY62137FV30LL-45ZSXAT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62137FV30LL-45ZSXAT is usually 5 days.
3.What payment methods are accepted for CY62137FV30LL-45ZSXAT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62137FV30LL-45ZSXAT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62137FV30LL-45ZSXAT?
CY62137FV30LL-45ZSXAT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62137FV30LL-45ZSXAT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62137FV30LL-45ZSXAT?
For technical support, including CY62137FV30LL-45ZSXAT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62137FV30LL-45ZSXAT requirements.
6.How does Aetrix verify that CY62137FV30LL-45ZSXAT is sourced from the original manufacturer or authorized distributors?
All CY62137FV30LL-45ZSXAT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62137FV30LL-45ZSXAT meets industry standards.
7.What is the process for return or replacement of CY62137FV30LL-45ZSXAT?
All CY62137FV30LL-45ZSXAT units undergo pre-shipment inspection (PSI). If there is an issue with CY62137FV30LL-45ZSXAT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62137FV30LL-45ZSXAT part is unused and in its original packaging.
Return procedure for CY62137FV30LL-45ZSXAT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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