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Cypress Semiconductor Corp CY62147G30-45ZSXI

Part No.:
CY62147G30-45ZSXI
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
44-TSOP (0.400", 10.16mm Width)
Datasheet:
AetrixCY62147G30-45ZSXI.pdf
Description:
IC SRAM 4MBIT PARALLEL 44TSOP II
Quantity:
Payment:
Payment
Shipping:
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Inventory:182

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Product details

Overview

CY62147G30-45ZSXI from Infineon Technologies (formerly Cypress) is a 4-Mbit MoBL® SRAM with embedded single-bit error-correcting code (ECC), organized as 256K × 16, operating at 45 ns access time across 2.2 V–3.6 V supply. It features TTL-compatible I/Os, ERR output for ECC event indication, and dual chip enable (CE1/CE2) logic. Used in industrial control modules requiring data integrity under extended temperature operation.

For engineers reviewing the CY62147G30-45ZSXI datasheet, CY62147G30-45ZSXI pinout, CY62147G30-45ZSXI application, or CY62147G30-45ZSXI equivalent, key selection criteria include ECC-enabled reliability, 45 ns timing at 3.0 V, ultra-low standby current (≤8.7 µA), and compatibility with 44-pin TSOP II footprint in industrial-grade environments.

Technical Context

This SRAM implements on-die ECC encoding/decoding logic that detects and corrects single-bit errors during read cycles, with ERR pin assertion indicating correction events. The device supports byte-level write control via BHE/ BLE and enters seamless standby when both byte enables are deasserted - independent of CE state.

It operates across three voltage ranges (1.65–2.2 V, 2.2–3.6 V, 4.5–5.5 V); the "30" suffix denotes the 2.2–3.6 V range and 45 ns speed grade. Pin configuration includes dual CE inputs (CE1 low / CE2 high), OE, WE, and 18 address lines (A0–A17) for 256K-word addressing.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Size 4 Mbit (256K words × 16-bit) - supports 32 KB of wide-data buffer storage with ECC protection per word.
Access Time 45 ns at VCC = 3.0 V - enables interface with 22.22 MHz bus clocks in real-time control systems.
Supply Voltage 2.2 V to 3.6 V - compatible with 3.3 V industrial logic families and low-power microcontroller buses.
Standby Current Max 8.7 µA - allows battery-backed retention in always-on monitoring nodes without significant drain.
ECC Function Single-bit error correction with ERR output - provides hardware-level data integrity without software overhead.
Operating Temp –40 °C to +85 °C - qualified for industrial ambient conditions without derating.
Data Retention 1.0 V minimum - maintains stored data during brown-out or controlled power-down sequences.

Pinout & Package

Package: 44-pin TSOP II (Type II, 400 mil width), RoHS-compliant, surface-mountable with standard reflow profile.

Pin/Terminal Circuit Role Design Meaning
A0–A17 Address Inputs 18-bit address bus supporting full 256K-word decoding; A12–A17 used for row selection, A0–A11 for column.
I/O0–I/O15 Bidirectional Data Bus 16-bit parallel interface; supports byte-wide reads/writes via BHE/ BLE control signals.
CE1, CE2 Dual Chip Enable Inputs Active-Low CE1 and Active-High CE2 required simultaneously for device selection - enhances noise immunity in multi-SRAM systems.
OE Output Enable Controls data output drivers; HI-Z state when deasserted prevents bus contention during shared-memory arbitration.
WE Write Enable Active-Low signal initiating write cycle; synchronized with address and data setup/hold timing per AC specs.
BHE, BLE Byte Enable Controls BHE enables upper byte (I/O8–I/O15); BLE enables lower byte (I/O0–I/O7); both low forces automatic standby mode.
ERR Error Indication Output Open-drain HIGH pulse indicates successful single-bit correction occurred during last read - requires external pull-up.
VCC, VSS Power Supply Pins Separate VCC (pin 34) and VSS (pin 33) pairs reduce switching noise; dual VCC/VSS layout improves signal integrity.

Key Features

Feature Design Value
Embedded ECC engine Hardware-based single-bit error detection and correction per 16-bit word - eliminates need for external ECC logic or software routines.
Byte Power Down Automatic transition to ultra-low-power standby when BHE and BLE are both inactive - reduces idle power without CPU intervention.
TTL-compatible I/O VIH/VIL thresholds match legacy 3.3 V logic families - enables drop-in replacement in existing designs without level-shifting.
Multi-voltage support Single part supports 2.2–3.6 V operation - simplifies BOM management across 3.3 V and mixed-voltage system designs.
Industrial temperature grade Rated –40 °C to +85 °C - validated for use in programmable logic controllers, motor drives, and remote I/O modules.

Applications

Programmable Logic Controller (PLC) Data Buffer Industrial HMI Local Memory

Use Scenario: Stores real-time I/O status, register values, and firmware variables in PLC backplane modules where bit flips from EMI or radiation must be mitigated.

IC Role / Device Role / Timing Role: Primary 16-bit SRAM buffer with ECC-enabled read/write path; 45 ns access synchronizes with 20 MHz controller bus.

Use Value: Prevents silent data corruption in safety-critical control loops by correcting single-bit errors before they propagate to output stages.

Use Scenario: Holds display frame buffers and touch-screen coordinate history in ruggedized human-machine interface terminals deployed in factory environments.

IC Role / Device Role / Timing Role: Offloads graphics processor memory bandwidth; ERR pin alerts host MCU of corrected errors for diagnostic logging.

Use Value: Enables reliable local memory operation without periodic scrubbing routines - reducing MCU overhead and improving UI responsiveness.

Motor Drive Parameter Storage Remote I/O Module Configuration Memory

Use Scenario: Retains calibrated PID coefficients, fault logs, and encoder offset tables in servo drive electronics subject to thermal cycling and vibration.

IC Role / Device Role / Timing Role: Nonvolatile-equivalent storage using 1.0 V data retention mode during power loss; ECC ensures parameter integrity after brown-out recovery.

Use Value: Eliminates need for external EEPROM or battery-backed SRAM while maintaining deterministic startup behavior after power interruption.

Use Scenario: Stores node ID, communication settings, and sensor calibration data in distributed I/O modules connected via RS-485 or CAN bus.

IC Role / Device Role / Timing Role: Configurable memory accessed during boot sequence; dual CE inputs allow sharing with other peripherals on same bus segment.

Use Value: Provides tamper-resistant configuration storage with hardware-level error resilience - critical for field-deployed devices with limited service access.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SRAM-with-ECC applications.

Alternative Part Technical Difference Application Difference Selection Advice
ISSI IS61WV25616BLL-10MLI No embedded ECC; requires external error handling or software correction; 10 ns faster (10 ns access), but higher ICC (30 mA typical). Lacks hardware ECC reporting; unsuitable where uncorrected errors must be logged or acted upon in real time. Select only if speed >45 ns is mandatory and ECC can be implemented externally or omitted.
ON Semiconductor NVSRAM N25S80-45G1I Nonvolatile SRAM with auto-store; no ECC; 45 ns access; retains data without backup power. Provides nonvolatility but no error correction - trade-off between data persistence and integrity assurance. Choose when power-loss data retention outweighs bit-error resilience requirements.

Compared with IS61WV25616BLL-10MLI and N25S80-45G1I, CY62147G30-45ZSXI uniquely delivers hardware ECC with ERR signaling in a standard SRAM interface - enabling deterministic error recovery without performance penalty or added design complexity.

Availability

CY62147G30-45ZSXI is available at Aetrix Electronics and suitable for industrial automation, motor control, and rugged HMI applications requiring stable component supply, long-term lifecycle support, and guaranteed ECC functionality.

Supply support for CY62147G30-45ZSXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power systems, automotive ICs, and memory solutions acquired from Cypress Semiconductor.

CY62147G30-45ZSXI belongs to the MoBL® (Mobile Low-power) SRAM product line, designed specifically for industrial and embedded systems demanding low static power, wide voltage operation, and built-in data reliability - not general-purpose computing memory.

FAQ

Does CY62147G30-45ZSXI support automatic error correction without host intervention?

Yes. The device performs single-bit error detection and correction autonomously during every read cycle using on-die ECC logic. When correction occurs, the ERR pin asserts HIGH for one clock cycle. No host software or external circuitry is required to initiate or manage correction - it is fully transparent to the memory controller.

What is the function of the dual chip enable (CE1/CE2) interface?

CE1 is active-low and CE2 is active-high; both must be asserted simultaneously (CE1 = LOW, CE2 = HIGH) to enable the device. This dual-signal scheme improves noise immunity over single CE designs and allows hierarchical memory decoding in multi-chip systems - for example, using CE2 as a bank select and CE1 as a chip select within the bank.

Can CY62147G30-45ZSXI operate at 1.8 V?

No. The "30" suffix specifies the 2.2 V–3.6 V operating range. For 1.65 V–2.2 V operation, the correct part is CY62147G18-55ZSXI (55 ns grade). Attempting to power CY62147G30-45ZSXI below 2.2 V may result in timing violations, data corruption, or failure to meet AC specifications.

Is the ERR pin open-drain, and what pull-up value is recommended?

Yes, ERR is an open-drain output requiring an external pull-up resistor. Infineon recommends a 4.7 kΩ resistor to VCC (3.3 V) for reliable signal rise time and noise margin. The pin drives LOW only during error-correction events and remains high-impedance otherwise - allowing multiple ERR outputs to be wire-OR'd for system-level error monitoring.

CY62147G30-45ZSXI Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
MOBL™
Package/Case:
44-TSOP (0.400", 10.16mm Width)
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
4Mbit
Memory Organization:
256K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
45ns
Access Time:
45 ns
Voltage - Supply:
2.2V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
44-TSOP II

CY62147G30-45ZSXI FAQ

1.How can I place an order for CY62147G30-45ZSXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY62147G30-45ZSXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY62147G30-45ZSXI reliable?

The price and inventory of CY62147G30-45ZSXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62147G30-45ZSXI is usually 5 days.

3.What payment methods are accepted for CY62147G30-45ZSXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62147G30-45ZSXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY62147G30-45ZSXI?

CY62147G30-45ZSXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY62147G30-45ZSXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY62147G30-45ZSXI?

For technical support, including CY62147G30-45ZSXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62147G30-45ZSXI requirements.

6.How does Aetrix verify that CY62147G30-45ZSXI is sourced from the original manufacturer or authorized distributors?

All CY62147G30-45ZSXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62147G30-45ZSXI meets industry standards.

7.What is the process for return or replacement of CY62147G30-45ZSXI?

All CY62147G30-45ZSXI units undergo pre-shipment inspection (PSI). If there is an issue with CY62147G30-45ZSXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY62147G30-45ZSXI part is unused and in its original packaging.

Return procedure for CY62147G30-45ZSXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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