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Cypress Semiconductor Corp CY62147GE30-45BVXI

Part No.:
CY62147GE30-45BVXI
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
48-VFBGA
Datasheet:
AetrixCY62147GE30-45BVXI.pdf
Description:
IC SRAM 4MBIT PARALLEL 48VFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:150

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Product details

Overview

CY62147GE30-45BVXI from Infineon Technologies (formerly Cypress) is a 4-Mbit MoBL® SRAM with embedded single-bit error-correcting code (ECC), 256K × 16-bit organization, 45 ns access time, 1.65–2.2 V / 2.2–3.6 V / 4.5–5.5 V triple-voltage operation, and ERR output pin for real-time error indication. It serves as a fault-tolerant memory buffer in industrial controllers requiring data integrity under radiation-prone or long-life field conditions.

For engineers reviewing the CY62147GE30-45BVXI datasheet, CY62147GE30-45BVXI pinout, CY62147GE30-45BVXI application, or CY62147GE30-45BVXI equivalent, key selection criteria include ECC-enabled read reliability, dual-chip-enable support for banked memory systems, 3.5 µA typical standby current, and 48-ball VFBGA package compatibility with high-density PCB layouts.

Technical Context

This SRAM implements on-die ECC encoding/decoding logic that detects and corrects single-bit errors during every read cycle without external logic. The ERR pin asserts HIGH only when correction occurs - no automatic write-back is performed, preserving deterministic timing.

It supports three distinct VCC ranges with voltage-specific timing and drive strength: 1.65–2.2 V (1.8 V typical), 2.2–3.6 V (3.0 V typical), and 4.5–5.5 V (5.0 V typical). Byte Power Down mode activates automatically when both BHE and BLE are deasserted, enabling sub-µA power state independent of CE status.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Size4 Mbit (256K words × 16-bit); enables compact 512 KB data buffers with full word-wide I/O
Access Time45 ns at VCC = 3.0 V; meets real-time response requirements for PLC scan cycles & sensor fusion pipelines
ECC FunctionSingle-bit error detection and correction per read; reduces uncorrectable failure rate to <0.1 FIT/Mb
Standby CurrentTypical 3.5 µA, max 8.7 µA at 2.2–3.6 V; supports battery-backed retention in always-on edge nodes
Voltage Ranges1.65–2.2 V, 2.2–3.6 V, and 4.5–5.5 V; allows direct interface with 1.8 V, 3.3 V, and 5 V system domains
ERR PinDedicated open-drain output signaling correction event; enables host firmware logging without polling overhead
Data Retention1.0 V minimum VCC; maintains memory state during brown-out or backup switching

Pinout & Package

Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 mm × 8 mm, 0.5 mm pitch, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
A0–A17Address Inputs18-bit address bus supporting full 256K-word addressing; A12–A17 used for row decode, A0–A11 for column
I/O0–I/O15Bidirectional Data Bus16-bit parallel interface; supports byte-level reads/writes via BHE/ BLE control
CE1, CE2Dual Chip Enable InputsActive-low CE1 and active-high CE2 enable bank-select memory mapping; CE1 HIGH / CE2 LOW deselects device
WEWrite EnableActive-low signal initiating write cycle; latches data on rising edge of WE when OE is HIGH
OEOutput EnableActive-low signal enabling I/O drivers; places outputs in HI-Z when deasserted
BHE, BLEByte Enable ControlsBHE enables upper byte (I/O8–I/O15); BLE enables lower byte (I/O0–I/O7); both LOW triggers Byte Power Down
ERRError Indication OutputOpen-drain output asserted HIGH only during successful single-bit correction; requires external pull-up
VCC, VSSPower & GroundDual VCC pins (Balls A16, D1) and multiple VSS balls (C1, E1, F2, G2, H1) reduce IR drop and noise coupling

Key Features

FeatureDesign Value
Embedded ECC EngineOn-die Hamming-code encoder/decoder corrects single-bit errors per 16-bit word without CPU intervention
Triple-Voltage OperationSingle part supports 1.8 V, 3.3 V, and 5 V system rails - eliminates need for level shifters or multiple SKUs
Byte Power Down ModeAutomatic transition to ultra-low-power state when BHE and BLE are both inactive - no software or timing overhead
TTL-Compatible I/OInput thresholds and output drive meet TTL logic levels across all VCC ranges, easing integration with legacy microcontrollers
ERR Pin Assertion LogicERR goes HIGH only during correction - provides precise, low-overhead fault telemetry for diagnostics and logging

Applications

Industrial PLC Memory BufferMedical Diagnostic Imaging Cache

Use Scenario: Storing real-time I/O scan data and ladder logic state tables in programmable logic controllers operating continuously in factory environments.

IC Role / Device Role / Timing Role: Fault-resilient SRAM buffer holding volatile process variables; ECC prevents silent data corruption from cosmic rays or EMI.

Use Value: Eliminates need for periodic memory scrubbing or external parity logic, reducing firmware complexity and improving MTBF.

Use Scenario: Caching raw pixel frames during ultrasound or MRI image acquisition where data integrity must be guaranteed before compression and storage.

IC Role / Device Role / Timing Role: High-speed, low-latency frame buffer interfacing directly with ADC/DAC controllers and DMA engines.

Use Value: 45 ns access time and 16-bit bus width enable real-time streaming at >20 MB/s; ERR pin alerts host on first detected bit-flip.

Railway Signaling Controller MemoryAvionics Data Recorder Buffer

Use Scenario: Holding safety-critical interlocking logic states and sensor inputs in EN 5012x-certified railway signaling systems with 20+ year service life.

IC Role / Device Role / Timing Role: Radiation-tolerant SRAM providing persistent memory state during transient voltage sags and thermal cycling.

Use Value: 1.0 V data retention and <0.1 FIT/Mb SER ensure functional safety compliance without redundant memory mirroring.

Use Scenario: Capturing flight telemetry and sensor logs in black box recorders where power loss may occur mid-write.

IC Role / Device Role / Timing Role: Nonvolatile-capable buffer using low-VCC retention mode to preserve last valid data segment during brown-out.

Use Value: Sub-µA standby current extends backup battery life; ERR flag identifies corrupted sectors for post-event forensic analysis.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ECC SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IS61WV25616EDBLL-10MLINo embedded ECC; requires external error-checking logic or software-based Hamming implementationLacks hardware-level error indication; increases firmware validation burden for safety-critical useSelect only if cost sensitivity outweighs reliability requirements and ECC can be implemented externally
AS6C4008-55ZIN4-Mbit × 8-bit organization; no ECC; 55 ns access; 3.3 V only; TSOP-44 packageHalf the data bus width; incompatible pinout and timing; no ERR signal or multi-voltage supportConsider only for space-constrained designs where 8-bit interface suffices and ECC is not required

Compared with IS61WV25616EDBLL-10MLI and AS6C4008-55ZIN, CY62147GE30-45BVXI uniquely delivers integrated ECC with real-time ERR feedback, triple-voltage flexibility, and 45 ns performance - making it the sole choice for applications demanding hardware-enforced data integrity without design-level trade-offs.

Availability

CY62147GE30-45BVXI is available at Aetrix Electronics and suitable for industrial PLCs, medical imaging subsystems, railway signaling controllers, and avionics data loggers requiring stable component supply across extended product lifecycles.

Supply support for CY62147GE30-45BVXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive ICs, and memory solutions with strong industrial and safety-critical focus.

CY62147GE belongs to Infineon's MoBL® (Mobile Low-power) SRAM product line, engineered for high-reliability embedded systems where data integrity, ultra-low standby power, and multi-rail compatibility are mandatory design constraints.

FAQ

Does CY62147GE30-45BVXI support automatic error correction write-back?

No. The device performs single-bit error correction during read cycles and asserts the ERR pin, but does not automatically rewrite corrected data back to the memory array. Host firmware must manage any required write-back operations based on ERR assertion, preserving deterministic timing and avoiding unintended side effects.

What is the function of the Byte Power Down mode?

When both BHE and BLE are deasserted (HIGH), the device enters ultra-low-power standby mode regardless of CE1/CE2 state. This feature reduces current to ≤8.7 µA without requiring changes to chip-enable sequencing, enabling dynamic power gating in burst-mode memory access patterns.

Can CY62147GE30-45BVXI operate at 2.5 V?

Yes. The 2.2–3.6 V VCC range explicitly includes 2.5 V operation. At this voltage, timing parameters are specified for 45 ns access (CY62147GE30), and DC characteristics such as VOH/VOL and VIH/VIL remain fully compliant per datasheet Table "DC Electrical Characteristics".

Is the ERR pin open-drain or push-pull?

The ERR pin is open-drain, requiring an external pull-up resistor to VCC. Its output is HIGH only during active single-bit correction events; otherwise, it remains in high-impedance state. This allows wired-OR connection with other fault indicators and simplifies level-shifting in mixed-voltage systems.

CY62147GE30-45BVXI Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
MOBL™
Package/Case:
48-VFBGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
4Mbit
Memory Organization:
256K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
45ns
Access Time:
45 ns
Voltage - Supply:
2.2V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-VFBGA (6x8)

CY62147GE30-45BVXI FAQ

1.How can I place an order for CY62147GE30-45BVXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY62147GE30-45BVXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY62147GE30-45BVXI reliable?

The price and inventory of CY62147GE30-45BVXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62147GE30-45BVXI is usually 5 days.

3.What payment methods are accepted for CY62147GE30-45BVXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62147GE30-45BVXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY62147GE30-45BVXI?

CY62147GE30-45BVXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY62147GE30-45BVXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY62147GE30-45BVXI?

For technical support, including CY62147GE30-45BVXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62147GE30-45BVXI requirements.

6.How does Aetrix verify that CY62147GE30-45BVXI is sourced from the original manufacturer or authorized distributors?

All CY62147GE30-45BVXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62147GE30-45BVXI meets industry standards.

7.What is the process for return or replacement of CY62147GE30-45BVXI?

All CY62147GE30-45BVXI units undergo pre-shipment inspection (PSI). If there is an issue with CY62147GE30-45BVXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY62147GE30-45BVXI part is unused and in its original packaging.

Return procedure for CY62147GE30-45BVXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY62147GE30-45BVXI Tags

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