Cypress Semiconductor Corp CY62167GE18-55BVXI
- Part No.:
- CY62167GE18-55BVXI
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 48-VFBGA
- Datasheet:
-
CY62167GE18-55BVXI.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 48VFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:440
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY62167GE18-55BVXI from Infineon Technologies (formerly Cypress) is a 16-Mbit MoBL® SRAM with embedded single-bit error-correcting code (ECC), configurable as 1M × 16 or 2M × 8, operating at 55 ns access time, 1.65–2.2 V or 4.5–5.5 V supply, and featuring an ERR output pin for real-time ECC event indication - deployed in industrial control memory buffers requiring data integrity under voltage fluctuation or radiation-prone environments.
For engineers reviewing the CY62167GE18-55BVXI datasheet, CY62167GE18-55BVXI pinout, CY62167GE18-55BVXI application, or CY62167GE18-55BVXI equivalent, key selection criteria include dual-voltage support, byte-selectable power-down, TTL-compatible I/Os, ECC status signaling via dedicated ERR pin, and 48-pin TSOP I package compatibility with legacy board layouts.
Technical Context
This SRAM integrates on-die ECC encoding/decoding logic that detects and corrects single-bit errors during read cycles without external circuitry. The ERR pin asserts high only when a correctable error is found and corrected in the accessed word - no automatic write-back occurs, preserving deterministic timing.
It supports two chip-enable configurations (single CE or dual CE1/CE2), byte-level write control via BHE/ BLE, and a unique Byte Power-down mode: asserting both BHE and BLE low forces immediate standby regardless of CE state, reducing ISB2 to ≤16 µA at 2.2 V or ≤5.5 µA at 5 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (configurable as 1M × 16 or 2M × 8) |
| Access Time | 55 ns max at 1.65–2.2 V; enables synchronous interface timing up to ~18 MHz |
| ECC Function | On-the-fly single-bit error detection and correction per 16-bit word; ERR pin signals correction event |
| Supply Voltage Ranges | 1.65–2.2 V (low-power embedded) and 4.5–5.5 V (legacy 5 V systems); no level-shifting required |
| Standby Current | Max 16 µA at 2.2 V / 85 °C; enables battery-backed retention in power-constrained nodes |
| Data Retention | 1.0 V minimum VCC for data hold; supports ultra-low-power sleep modes without full power loss |
| I/O Compatibility | TTL-compatible inputs/outputs; eliminates need for external bus interface logic in mixed-voltage designs |
Pinout & Package
The CY62167GE18-55BVXI is supplied in a 48-pin Thin Small Outline Package (TSOP I), RoHS-compliant, with 0.5 mm pitch and standard JEDEC MO-143AC footprint. Pin 45 serves as A20 in 2M × 8 mode; BYTE pin selects configuration (VCC = 1M × 16, VSS = 2M × 8).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | 20-bit address bus; A20 derived from BYTE pin state in 2M × 8 mode |
| I/O0–I/O15 | Bidirectional Data Bus | 16-bit parallel interface; BHE/ BLE enable byte-select writes/reads |
| CE1, CE2 | Dual Chip Enable Inputs | Active-low CE1 and active-high CE2 required for device selection in dual-CE mode |
| WE, OE, BHE, BLE | Control Inputs | Standard SRAM control set; BHE/ BLE jointly trigger Byte Power-down mode when both low |
| ERR | Open-drain Error Output | Asserted high only during successful single-bit correction; requires external pull-up |
| VCC, VSS | Power Supply Terminals | Separate 1.65–2.2 V or 4.5–5.5 V supply and ground; no internal regulation |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC Engine | Hardware-accelerated single-bit error correction per 16-bit word with zero software overhead |
| Byte Power-down Mode | Automatic transition to ultra-low standby (≤16 µA) when both BHE and BLE are deasserted |
| Dual-Voltage Operation | Single device supports 1.8 V and 5 V system rails - eliminates need for separate SRAM families |
| Configurable Organization | Pin-strapped 1M × 16 or 2M × 8 mode using BYTE pin; maintains PCB layout reuse across memory sizes |
| ERR Status Signaling | Dedicated open-drain output indicates correction events without interrupting memory cycle timing |
Applications
| Industrial PLC Memory Buffer | Medical Imaging Frame Store |
|---|---|
|
Use Scenario: Storing real-time I/O scan data in programmable logic controllers where transient voltage dips risk bit flips. IC Role / Device Role / Timing Role: Primary volatile memory buffer with ECC-enabled word-level integrity verification on every read. Use Value: Prevents undetected data corruption in safety-critical control loops without adding latency or external ECC logic. |
Use Scenario: Holding uncompressed grayscale image frames in portable ultrasound devices with limited battery capacity. IC Role / Device Role / Timing Role: Low-power frame buffer supporting burst reads at 18 MHz while maintaining 1.0 V data retention during sleep. Use Value: Enables 55 ns access + 16 µA standby to extend battery life without compromising image fidelity or acquisition speed. |
| Avionics Sensor Data Cache | Smart Grid RTU Event Log |
|
Use Scenario: Caching accelerometer and gyroscope telemetry in UAV flight controllers exposed to ionizing radiation. IC Role / Device Role / Timing Role: Radiation-tolerant SRAM with on-die ECC correcting single-event upsets (SEUs) in-flight. Use Value: Eliminates need for triple-modular redundancy or periodic scrubbing, reducing FPGA resource usage and firmware complexity. |
Use Scenario: Logging fault timestamps and grid parameter anomalies in remote distribution automation units. IC Role / Device Role / Timing Role: Nonvolatile-capable cache retaining logs during brownouts via 1.0 V data hold capability. Use Value: Ensures critical event records survive >10 s power interruption without backup capacitors or supercaps. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ECC SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61WV102416BLL-10MLI | No integrated ECC; requires external error-checking logic or software parity handling | Lacks hardware-level error correction; suitable only where SEU rate is negligible and firmware can manage parity | Select only if cost sensitivity outweighs reliability requirements and system has spare MCU cycles for parity checks |
| Renesas R1EX24128ASAS0I#U0 | Serial EEPROM with built-in ECC; 400 kHz I²C interface; 128 Kbit density | Non-volatile but orders-of-magnitude slower access (ms vs. ns); unsuitable for real-time buffering | Use only for persistent configuration storage - not as drop-in replacement for SRAM-based frame or buffer memory |
Compared with IS61WV102416BLL-10MLI and R1EX24128ASAS0I#U0, CY62167GE18-55BVXI uniquely delivers parallel-interface speed, on-die ECC, and dual-voltage operation in one package - essential for deterministic, low-latency, radiation-aware memory subsystems.
Availability
CY62167GE18-55BVXI is available at Aetrix Electronics and suitable for industrial PLCs, medical imaging subsystems, avionics sensor interfaces, and smart grid RTUs requiring stable component supply across extended temperature and voltage ranges.
Supply support for CY62167GE18-55BVXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains its high-reliability memory portfolio, emphasizing automotive-grade robustness, industrial longevity, and functional safety readiness.
CY62167GE belongs to the MoBL® (Mobile Bit-Low-power) SRAM product line, engineered for battery-sensitive and mission-critical embedded systems needing ECC assurance without performance penalty.
FAQ
Does CY62167GE18-55BVXI support automatic error correction write-back?
No. The device performs single-bit error correction on read cycles only and does not automatically rewrite corrected data to memory. The ERR pin signals correction occurrence, but the corrected value remains latched on the I/O bus for the host to optionally capture or ignore. Write-back must be implemented externally if persistent correction is required.
Can CY62167GE18-55BVXI operate in 2M × 8 mode using the 48-pin TSOP I package?
Yes. Tie the BYTE pin to VSS to configure the device as 2M × 8. In this mode, pin 45 becomes address line A20, while BHE, BLE, and I/O8–I/O14 are unused and may be left floating. All other control and data pins retain defined functionality per the 2M × 8 timing and addressing map.
What is the role of the ERR pin during normal operation without errors?
The ERR pin remains in high-impedance (open-drain) state when no correctable error is detected. It requires an external pull-up resistor to VCC. Only during a read cycle where a single-bit error is both detected and corrected does ERR assert high for the duration of that read access - it does not latch or remain asserted after the cycle completes.
Is CY62167GE18-55BVXI compatible with 5 V TTL logic without level shifters?
Yes. When operated at 4.5–5.5 V VCC, its inputs meet TTL voltage thresholds (VIH ≥ 2.2 V, VIL ≤ 0.8 V), and outputs drive VOH ≥ 2.4 V (at –1 mA) and VOL ≤ 0.4 V (at 2.1 mA), satisfying standard TTL fan-out and noise margin requirements without translation circuitry.
CY62167GE18-55BVXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- MOBL™
- Package/Case:
- 48-VFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 2M x 8, 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 55ns
- Access Time:
- 55 ns
- Voltage - Supply:
- 1.65V ~ 2.2V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-VFBGA (6x8)
CY62167GE18-55BVXI FAQ
1.How can I place an order for CY62167GE18-55BVXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY62167GE18-55BVXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY62167GE18-55BVXI reliable?
The price and inventory of CY62167GE18-55BVXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY62167GE18-55BVXI is usually 5 days.
3.What payment methods are accepted for CY62167GE18-55BVXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY62167GE18-55BVXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY62167GE18-55BVXI?
CY62167GE18-55BVXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY62167GE18-55BVXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY62167GE18-55BVXI?
For technical support, including CY62167GE18-55BVXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY62167GE18-55BVXI requirements.
6.How does Aetrix verify that CY62167GE18-55BVXI is sourced from the original manufacturer or authorized distributors?
All CY62167GE18-55BVXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY62167GE18-55BVXI meets industry standards.
7.What is the process for return or replacement of CY62167GE18-55BVXI?
All CY62167GE18-55BVXI units undergo pre-shipment inspection (PSI). If there is an issue with CY62167GE18-55BVXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY62167GE18-55BVXI part is unused and in its original packaging.
Return procedure for CY62167GE18-55BVXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY62167GE18-55BVXI Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

