Cypress Semiconductor Corp CY7C1062AV33-10BGC

Overview

CY7C1062AV33-10BGC from Cypress Semiconductor is a 524,288 × 32-bit (16-Mbit) asynchronous CMOS static RAM with 10 ns access time, 3.3 V ±0.3 V supply, and 119-ball PBGA packaging. It supports byte-selectable read/write via four independent byte enables (BA–BD), operates across –40°C to +85°C industrial temperature range, and delivers automatic power-down when deselected - used in high-speed embedded control buffers and FPGA co-processor memory subsystems.

For engineers reviewing the CY7C1062AV33-10BGC datasheet, CY7C1062AV33-10BGC pinout, CY7C1062AV33-10BGC application, or CY7C1062AV33-10BGC equivalent, key selection criteria include tAA = 10 ns timing compliance, 4-byte I/O partitioning for burst-aligned data transfers, industrial-grade thermal stability, and PBGA package compatibility with dense PCB layouts requiring low-inductance grounding.

Technical Context

The CY7C1062AV33-10BGC implements a fully decoded 512K × 32 SRAM array with separate row/column decoders and sense amplifiers. Its triple chip enable (CE1/CE2/CE3) architecture allows hierarchical memory banking, while independent byte enables (BA–BD) enable concurrent 8-bit writes to distinct 32-bit words without bus contention.

It features TTL-compatible input thresholds (VIH = 2.0 V min, VIL = 0.8 V max), 5 pF output capacitance, and dual power-down modes: ISB1 (70 mA, TTL inputs) and ISB2 (50 mA, CMOS inputs). Data retention at 2.0 V ensures operation during brown-out conditions without external backup.

Key Specifications

Pinout & Package

Package: 119-ball PBGA (14 mm × 22 mm × 2.4 mm, ball pitch 1.0 mm), top view with VDD on perimeter rows and dedicated ground planes for noise suppression.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed parallel SRAM applications.

Compared with AS7C3256A-10TIN and IS61WV102432BLL-10MLI, the CY7C1062AV33-10BGC offers optimal balance of industrial temperature support, 4-byte write flexibility, and proven PBGA reliability in high-vibration environments - making it preferred for avionics and motion-control systems.

Availability

CY7C1062AV33-10BGC is available at Aetrix Electronics and suitable for industrial PLC memory buffers, FPGA co-processor caches, and avionics display controllers requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for CY7C1062AV33-10BGC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for industrial, automotive, and communications markets.

The CY7C1062AV33 belongs to Cypress's high-speed parallel SRAM product line, engineered specifically for deterministic, low-latency memory interfacing in FPGA- and microcontroller-based real-time systems.

FAQ

What is the maximum clock frequency supported for continuous read/write cycling?

The CY7C1062AV33-10BGC does not use a clock; it is an asynchronous SRAM. Maximum sustained operation is governed by tRC = 10 ns (100 MHz effective cycle rate). Continuous operation at this rate requires strict adherence to setup/hold times for address, CE, WE, and OE, and proper PCB layout to manage signal skew and ground bounce.

Can CE1, CE2, and CE3 be tied together for simplified interface?

Yes - CE1, CE2, and CE3 may be externally wired together and driven by a single chip select signal. The device activates only when all three are LOW; tying them simplifies logic design but forfeits hierarchical bank selection capability used in multi-SRAM systems.

Is the 119-ball PBGA package RoHS-compliant?

No - per the datasheet and ordering information, the CY7C1062AV33-10BGC is specified as "non Pb-free" and uses leaded solder balls. For RoHS-compliant alternatives, consult Infineon's CY7C1062DV33 series or equivalent qualified replacements.

How does automatic power-down behave when only one CE is HIGH?

Automatic power-down activates immediately when any of CE1, CE2, or CE3 transitions HIGH - regardless of the state of the other two. This triggers ISB2 mode (50 mA max), placing all I/Os in high-impedance and halting internal array activity until all CEs return LOW.