Cypress Semiconductor Corp CY7C1062DV33-10BGI

Overview

CY7C1062DV33-10BGI from Cypress Semiconductor is a 16-Mbit (512K × 32) high-speed CMOS static RAM with 10 ns access time, 3.3 V ±0.3 V operation, and automatic CE power-down mode. It supports byte-selectable 32-bit I/O via four independent byte enables (BA–BD), operates across –40°C to +85°C, and retains data at 2.0 V for low-power hold states - used in industrial control memory buffers and FPGA configuration storage.

For engineers reviewing the CY7C1062DV33-10BGI datasheet, CY7C1062DV33-10BGI pinout, CY7C1062DV33-10BGI application, or CY7C1062DV33-10BGI equivalent, key selection criteria include tAA = 10 ns read timing, ISB2 = 25 µA standby current, 119-ball PBGA package compatibility, and quad-byte enable control logic for partial-word writes in embedded memory subsystems.

Technical Context

The device implements a synchronous, address-decoded 512K × 32 SRAM array with independent row/column decoders and sense amplifiers. Read and write operations are controlled by three chip enables (CE1/CE2/CE3), WE, OE, and four byte enable inputs (BA–BD), enabling fine-grained 8-bit access within each 32-bit word.

Power management is handled through automatic CE-driven power-down: when any CE is HIGH, ICC drops to ISB2 = 25 µA (CMOS mode) or ISB1 = 30 µA (TTL mode). Data retention at 2.0 V is guaranteed with no clock or external refresh required, supporting fail-safe memory hold during brownout conditions.

Key Specifications

Pinout & Package

Package: 119-ball plastic ball grid array (PBGA), RoHS-compliant, 15 mm × 15 mm footprint with 1.0 mm ball pitch.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed parallel SRAM applications.

Compared with IS61LV51232AL-10BLI and AS6C4008-10BIN, CY7C1062DV33-10BGI delivers integrated quad-byte control and automatic CE power-down in a single 119-ball PBGA, reducing component count and enabling lower-power, faster partial-word writes in space-constrained industrial and avionics systems.

Availability

CY7C1062DV33-10BGI is available at Aetrix Electronics and suitable for industrial PLC memory buffers, FPGA configuration storage, and medical imaging frame buffers requiring stable component supply and long-term obsolescence management.

Supply support for CY7C1062DV33-10BGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and microcontroller solutions for industrial, automotive, and communications applications.

The CY7C1062DV33 belongs to Cypress's high-speed parallel SRAM product line, engineered for deterministic timing, low-power hold, and robust industrial temperature operation in mission-critical embedded memory subsystems.

FAQ

What is the minimum VCC required for valid read/write operation?

The device requires VCC ≥ 3.0 V for normal operation. Valid SRAM access begins 100 µs after VCC reaches typical value (3.3 V). Below 3.0 V, only data retention at 2.0 V is guaranteed - no read/write functionality is supported in the sub-3.0 V range.

How does automatic power-down activate, and what is its impact on timing?

Automatic power-down activates when any of CE1, CE2, or CE3 transitions HIGH. ICC drops to 25 µA (ISB2) within 10 ns (tPD). Recovery to active mode requires tPU = 0 ns - meaning valid access may begin immediately upon CE reassertion, provided tPOWER (100 µs) has elapsed since initial power-up.

Can CY7C1062DV33-10BGI interface directly with a 32-bit microprocessor bus?

Yes - it features fully compatible 32-bit bidirectional I/O (I/O0–I/O31), TTL-level inputs, and synchronous timing with tAA = 10 ns and tRC = 10 ns. Address lines A0–A18, CE1–CE3, WE, OE, and BA–BD align with standard microprocessor bus protocols requiring no glue logic for width or timing adaptation.

Are NC pins electrically isolated, and can they be left unconnected on PCB?

Yes - NC (No Connect) pins are not bonded to the die and have no internal connection. They may be left floating or tied to ground for mechanical stability, but must not be driven or connected to active signals. The datasheet explicitly states "NC pins are not connected on the die" (Page 3, Note 1).