Cypress Semiconductor Corp CY7C1069AV33-10ZXI

Overview

CY7C1069AV33-10ZXI from Cypress Semiconductor is a 2,097,152 × 8-bit (2 M × 8) high-speed CMOS static RAM with 10 ns access time, 3.3 V ±0.3 V operation, and automatic CE-based power-down. It features TTL-compatible I/O, dual chip enables (CE1/CE2), and supports memory expansion in industrial embedded systems requiring deterministic timing and data retention down to 2.0 V.

For engineers reviewing the CY7C1069AV33-10ZXI datasheet, CY7C1069AV33-10ZXI pinout, CY7C1069AV33-10ZXI application, or CY7C1069AV33-10ZXI equivalent, key selection criteria include tAA = 10 ns read timing, ISB2 = 50 µA standby current under CMOS input conditions, dual CE control logic, and TSOP II package compatibility with legacy PCB layouts.

Technical Context

This SRAM implements a fully decoded 21-bit address space (A0–A20) driving a 2 M × 8 memory array with separate column and row decoders, sense amplifiers, and data-in drivers. Read and write operations are controlled by synchronous assertion of CE1 (LOW), CE2 (HIGH), OE (LOW for read), and WE (LOW for write).

The device uses a center-power/ground TSOP II pinout with dedicated VCC/VSS pairs across the package to minimize noise coupling. Power-down is triggered automatically when CE1 is HIGH or CE2 is LOW, reducing ICC to ≤50 µA without external control logic.

Key Specifications

Pinout & Package

Package: 54-pin Thin Small Outline Package Type II (TSOP II), Pb-free, with center power (VCC) and ground (VSS) pins for reduced supply noise and improved thermal dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar static RAM applications.

Compared with IS61LV25616AL-10TQLI and MC14LC51200FN, the CY7C1069AV33-10ZXI uniquely delivers 2 M × 8 density at 10 ns in a Pb-free TSOP II package with industrial temperature range and dual CE architecture-enabling direct replacement in space-constrained, byte-oriented embedded controllers without redesign.

Availability

CY7C1069AV33-10ZXI is available at Aetrix Electronics and suitable for industrial PLCs, medical imaging subsystems, and avionics display controllers requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.

Supply support for CY7C1069AV33-10ZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies since 2020) is a fabless semiconductor company specializing in high-performance memory, PSoC mixed-signal arrays, and USB/USB-C solutions.

The CY7C1069AV33 belongs to Cypress's legacy high-speed asynchronous SRAM product line, engineered specifically for deterministic, low-latency data buffering in industrial and aerospace systems where refresh-free operation and wide temperature tolerance are mandatory.

FAQ

What is the maximum clock frequency supported for read/write cycles?

The CY7C1069AV33-10ZXI does not use a clock; it is an asynchronous SRAM. Its maximum effective interface speed is determined by tRC = 10 ns, enabling up to 100 MHz burst throughput when interfaced with controllers supporting cycle-accurate timing. No internal clock circuitry exists - all operations are edge-triggered by CE, OE, and WE signals.

Can CE1 and CE2 be tied together for simplified control?

No - CE1 and CE2 implement complementary logic: the device enables only when CE1 = LOW AND CE2 = HIGH. Tying them together forces either disable (both LOW) or invalid state (both HIGH). This dual-CE architecture is designed for hierarchical memory decoding, not simplification; use discrete logic or FPGA outputs to generate the required CE1/CE2 pair.

Is the 2.0 V data retention voltage tested or guaranteed?

Yes - data retention at 2.0 V is a guaranteed parameter (VCCDR) over the full –40°C to +85°C temperature range, verified per JEDEC JESD22-A107. The device maintains stored data indefinitely at 2.0 V with CE1 HIGH or CE2 LOW, consuming ≤50 µA, and resumes normal operation within 1 ms after VCC rises to ≥3.0 V.

Are NC and DNU pins safe to leave unconnected on PCB?

NC (No Connect) pins are unbonded and may be left floating or tied to GND/VCC without effect. DNU (Do Not Use) pins must be tied to VSS (GND) per datasheet Page 2 Note 2 - leaving them floating risks undefined internal node biasing and potential functional failure during temperature cycling or ESD events.