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Cypress Semiconductor Corp CY7C1143KV18-450BZC

Part No.:
CY7C1143KV18-450BZC
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1143KV18-450BZC.pdf
Description:
IC SRAM 18MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,917

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Product details

Overview

CY7C1143KV18 from Cypress Semiconductor is a 18-Mbit QDR® II+ SRAM with 1M × 18 organization, 450 MHz clock frequency, 2.0-cycle read latency, and separate read/write DDR ports operating at 900 Mbps effective data rate. It features HSTL I/O, echo clocks (CQ/CQ), QVLD data-valid indicator, and PLL-based timing alignment-designed for high-bandwidth packet buffering in network line cards and telecom switching fabric.

For engineers reviewing the CY7C1143KV18 datasheet, CY7C1143KV18 pinout, CY7C1143KV18 application, or CY7C1143KV18 equivalent, key selection criteria include its 450 MHz operation with 2.0-cycle latency, dual-clock DDR interface, 165-ball FBGA package, 1.8 V core / 1.4–1.8 V I/O supply range, and JTAG 1149.1 compliance for boundary-scan testability.

Technical Context

The CY7C1143KV18 implements a synchronous pipelined QDR II+ architecture with physically independent read and write data paths, eliminating bus turnaround overhead. Its four-word burst transfers 72 bits per read cycle (Q[17:0] × 4) and supports concurrent read/write operations on shared address bus latched by K/K rising edges.

Timing is governed by an internal PLL that aligns output data to echo clocks CQ/CQ, enabling reliable capture at 900 Mbps. The DOFF pin selects between QDR II+ mode (DOFF = HIGH, 2.0-cycle latency, up to 450 MHz) and legacy QDR I mode (DOFF = LOW, 1-cycle latency, ≤167 MHz).

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 18 Mbit (1M × 18 organization)
Max Clock Frequency 450 MHz - enables 900 Mbps DDR data rate per port
Read Latency 2.0 clock cycles - fixed pipeline delay for deterministic timing in switch fabric
Core Supply 1.8 V ± 0.1 V - low-power 1.8 V core compatible with modern ASIC/FPGA I/O domains
I/O Supply Range 1.4 V to 1.8 V - supports both 1.5 V and 1.8 V HSTL-15/18 interfaces
Package 165-ball FBGA (13 × 15 × 1.4 mm) - high-density interconnect for space-constrained line cards
Interface Standard HSTL Class I inputs / variable-drive HSTL outputs - ensures signal integrity at 450 MHz

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, 0.8 mm ball pitch.

Pin/Terminal Circuit Role Design Meaning
K / K Input clocks Rising edges latch all synchronous inputs (address, data, control); define DDR timing boundaries
CQ / CQ Echo clocks Free-running, phase-aligned copies of K/K used by FPGA/ASIC to sample Q[x:0] with zero setup/hold margin
Q[17:0] Read data outputs DDR outputs delivering four 18-bit words per read burst; tristated when RPS deasserted
D[17:0] Write data inputs DDR inputs accepting four 18-bit words per write burst; sampled on K/K rising edges
RPS / WPS Port select controls Active-low enables read/write transactions independently; allows concurrent access arbitration
BWS[1:0] Byte write selects Two active-low signals controlling D[8:0] and D[17:9]; enable partial-word writes without read-modify-write
QVLD Data validity indicator Edge-aligned with CQ/CQ; asserts only during valid output windows-critical for FIFO synchronization
DOFF PLL disable input LOW disables PLL, reverts device to QDR I timing (1-cycle latency, ≤167 MHz); HIGH enables full QDR II+ mode

Key Features

Feature Design Value
Separate read/write DDR ports Eliminates bus turnaround delays and contention-enables sustained 900 MB/s bidirectional throughput
Four-word burst architecture Reduces address bus toggling by 75% vs. single-word access-lowers system EMI and routing complexity
Integrated PLL + echo clocks Enables source-synchronous data capture at 450 MHz without external delay compensation circuits
Programmable output impedance (ZQ) Matches 50 Ω data bus via external resistor-reduces reflections and improves signal integrity at 900 Mbps
JTAG 1149.1 test access port Supports IEEE-compliant boundary scan for production testing and in-system debug of high-speed memory interfaces

Applications

Telecom Line Card Buffering Network Packet Switching Fabric

Use Scenario: Storing ingress/egress packet headers and metadata in OC-192/STM-64 line interface modules.

IC Role / Device Role / Timing Role: High-throughput, low-latency buffer between SerDes PHY and traffic manager ASIC.

Use Value: 450 MHz operation and 2.0-cycle latency ensure deterministic header processing within 4.4 ns per word-meeting SONET/SDH jitter budgets.

Use Scenario: Acting as shared memory for crossbar scheduler in multi-gigabit Ethernet switches.

IC Role / Device Role / Timing Role: Concurrent read/write SRAM enabling simultaneous lookup and update of forwarding tables.

Use Value: Independent ports eliminate arbitration stalls-sustains 1.8 GB/s aggregate bandwidth across 10-Gbps ports.

High-Speed Test Equipment Memory Baseband Processing in Wireless Infrastructure

Use Scenario: Capturing real-time waveform samples in digital storage oscilloscopes and bit-error-rate testers.

IC Role / Device Role / Timing Role: Deep buffer staging data between ADC/DAC and FPGA-based analysis engine.

Use Value: QVLD + CQ synchronization guarantees precise sample alignment-critical for sub-nanosecond time-domain measurements.

Use Scenario: Storing channel estimation coefficients and FFT buffers in LTE-Advanced eNodeB baseband units.

IC Role / Device Role / Timing Role: Low-jitter memory for real-time OFDM symbol processing pipelines.

Use Value: HSTL I/O and 1.4–1.8 V VDDQ compatibility allow direct interfacing with 1.5 V FPGA transceivers-reducing level-shifting overhead.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72T3615L10BG 18-Mbit QDR II, 333 MHz max, no PLL, 1.8 V only I/O, 165-ball FBGA Lacks echo clocks and programmable impedance; requires external timing margining Select when cost sensitivity outweighs need for 450 MHz bandwidth or simplified capture timing
ISSI IS61WV102418B 18-Mbit sync SRAM, 167 MHz, single-port, no DDR, 100-pin TQFP No concurrent access, no burst, no echo clocks-lower bandwidth, simpler interface Choose for legacy designs requiring pin-compatible drop-in replacement without QDR complexity

Compared with IDT72T3615L10BG and IS61WV102418B, the CY7C1143KV18 delivers 35% higher bandwidth and eliminates external timing calibration via integrated PLL and echo clocks-making it optimal for new 10G+ infrastructure where deterministic latency and signal integrity are critical.

Availability

CY7C1143KV18 is available at Aetrix Electronics and suitable for telecom line card buffering, network packet switching fabric, and high-speed test equipment requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for CY7C1143KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial systems, with focus on signal integrity and timing-critical applications.

The QDR® II+ SRAM product line targets high-bandwidth, low-latency buffering in packet-switched networks-specifically engineered to replace DRAM and standard SRAM in applications demanding concurrent read/write and deterministic 2-cycle latency.

FAQ

What is the function of the DOFF pin on CY7C1143KV18?

The DOFF pin controls the internal PLL: when pulled HIGH (via 10 kΩ resistor to VDDQ), the device operates in QDR II+ mode with 2.0-cycle read latency and up to 450 MHz clock rate; when pulled LOW to VSS, the PLL is disabled and the device reverts to QDR I timing with 1-cycle latency and maximum 167 MHz operation. This provides backward compatibility while enabling performance scaling.

How does the ZQ pin affect signal integrity?

The ZQ pin connects to an external resistor (typically 50 Ω to ground) to calibrate the output driver impedance of Q[x:0], CQ, and CQ pins to 0.2 × RQ (i.e., 10 Ω). This matches standard 50 Ω transmission lines, minimizing reflections and ensuring clean eye diagrams at 900 Mbps-critical for maintaining timing margins in high-speed backplane interfaces.

Can CY7C1143KV18 perform byte-level writes without read-modify-write?

Yes. The device supports true byte-selective writes using BWS0 and BWS1 pins, each controlling nine bits (D[8:0] and D[17:9]). When a BWS signal is deasserted (HIGH), the corresponding byte remains unaltered during the write burst-enabling efficient partial updates of packet headers or control structures without CPU intervention or additional memory cycles.

Is the CY7C1143KV18 JTAG boundary-scan compliant?

Yes. The device implements IEEE Std. 1149.1 (JTAG) with TDI, TDO, TCK, and TMS pins fully functional. It supports instruction register loading, boundary-scan register access, and IDCODE readback-enabling automated PCB test, interconnect verification, and in-system programming of adjacent devices in dense, high-speed memory subsystems.

CY7C1143KV18-450BZC Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II+
Memory Size:
18Mbit
Memory Organization:
1M x 18
Memory Interface:
Parallel
Clock Frequency:
450 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1143KV18-450BZC FAQ

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Please submit a Request for Quotation (RFQ) for CY7C1143KV18-450BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1143KV18-450BZC reliable?

The price and inventory of CY7C1143KV18-450BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1143KV18-450BZC is usually 5 days.

3.What payment methods are accepted for CY7C1143KV18-450BZC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1143KV18-450BZC transactions.

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4.How is shipping managed for CY7C1143KV18-450BZC?

CY7C1143KV18-450BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1143KV18-450BZC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1143KV18-450BZC?

For technical support, including CY7C1143KV18-450BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1143KV18-450BZC requirements.

6.How does Aetrix verify that CY7C1143KV18-450BZC is sourced from the original manufacturer or authorized distributors?

All CY7C1143KV18-450BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1143KV18-450BZC meets industry standards.

7.What is the process for return or replacement of CY7C1143KV18-450BZC?

All CY7C1143KV18-450BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1143KV18-450BZC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1143KV18-450BZC part is unused and in its original packaging.

Return procedure for CY7C1143KV18-450BZC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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