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Cypress Semiconductor Corp CY7C1145KV18-400BZXC

Part No.:
CY7C1145KV18-400BZXC
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1145KV18-400BZXC.pdf
Description:
IC SRAM 18MBIT PARALLEL 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,058

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Product details

Overview

CY7C1145KV18-400BZXC from Cypress Semiconductor is a 18-Mbit QDR® II+ SRAM with 512K × 36 organization, 2.0-cycle read latency, and 400 MHz clock operation (800 Mbps DDR data rate per port). It features separate synchronous read/write ports, echo clocks (CQ/CQ), QVLD data-valid indicator, and programmable output impedance via ZQ pin. Used in high-bandwidth packet buffering for network switches and routers.

For engineers reviewing the CY7C1145KV18-400BZXC datasheet, CY7C1145KV18-400BZXC pinout, CY7C1145KV18-400BZXC application, or CY7C1145KV18-400BZXC equivalent, key selection criteria include 400 MHz K/K clock support, 36-bit DDR I/O with HSTL compatibility, DOFF-controlled PLL mode switching, and 165-ball FBGA (13 × 15 mm) package constraints.

Technical Context

The CY7C1145KV18 implements QDR II+ architecture with fully independent read and write ports sharing one multiplexed address bus (A[16:0]), enabling concurrent transactions without bus turnaround. Each port uses double-data-rate interfaces synchronized to complementary K and K clocks, delivering four 36-bit words per access cycle.

Internal PLL enables precise 2.0-cycle read latency when DOFF = HIGH; disabling PLL via DOFF = LOW reverts device to QDR I timing (max 167 MHz). Echo clocks CQ/CQ align with K/K edges to simplify high-speed capture, while QVLD provides edge-aligned validity indication for all four burst words.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 18 Mbit (512K × 36 configuration)
Max Clock Frequency 400 MHz - supports 800 Mbps DDR bandwidth per port
Read Latency 2.0 clock cycles - fixed pipeline depth when DOFF = HIGH
I/O Voltage VDDQ = 1.4 V to 1.8 V - compatible with both 1.5 V and 1.8 V HSTL systems
Core Supply VDD = 1.8 V ± 0.1 V - defines internal logic and array operating margin
Burst Length Four 36-bit words per access - reduces address bus toggling frequency by 4×
Package 165-ball FBGA (13 × 15 × 1.4 mm) - standard footprint for high-pin-count memory

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm body, 1.4 mm height, RoHS-compliant Pb-free finish (BZXC suffix).

Pin/Terminal Circuit Role Design Meaning
K / K Complementary input clocks Rising edges sample all synchronous inputs (A, D, RPS, WPS, BWS); drive DDR outputs on Q[x:0]
CQ / CQ Echo clock outputs Free-running, edge-aligned copies of K/K - used for source-synchronous data capture at receiver
Q[35:0] Synchronous read data outputs 36-bit DDR outputs delivering four sequential words per read transaction; tristated when RPS inactive
D[35:0] Synchronous write data inputs 36-bit DDR inputs accepting four sequential words per write; ignored unless WPS active
RPS / WPS Port select controls Active-low enables read/write port independently - enables depth expansion and concurrent access control
BWS[3:0] Byte write select inputs Four independent 9-bit byte masks - allows partial-word writes without read-modify-write overhead
DOFF PLL enable/disable LOW disables PLL, forcing QDR I mode (≤167 MHz); HIGH enables QDR II+ 2.0-cycle latency mode
QVLD Data validity indicator Asserted synchronously with first valid word of burst - eliminates need for fixed delay-based capture windows
ZQ Output impedance calibration Connects to external resistor to ground to tune CQ/CQ/Q[35:0] output drive strength to match PCB trace impedance

Key Features

Feature Design Value
Separate read/write ports Eliminates data bus turnaround delays and contention - enables true simultaneous read+write at full bandwidth
Four-word burst architecture Reduces required address bus frequency by 75% versus single-word access - lowers routing complexity and EMI
HSTL-compatible I/O Supports 1.4–1.8 V VDDQ - interoperable with FPGA/ASIC memory controllers using HSTL Class I or III
Programmable output impedance ZQ pin calibrates driver strength to system trace impedance - improves signal integrity without external termination
JTAG 1149.1 test access Enables boundary scan testing and in-system programming - supports production test and debug workflows

Applications

Network Packet Buffering Telecom Line Card Memory

Use Scenario: Storing ingress/egress packet headers and payloads in multi-gigabit Ethernet switches.

IC Role / Device Role / Timing Role: High-throughput dual-port SRAM acting as shared buffer between ingress parser and egress scheduler pipelines.

Use Value: 400 MHz K/K clocks deliver 28.8 Gbps aggregate bandwidth (14.4 Gbps per port), matching 10G/40G line rates without bottleneck.

Use Scenario: Frame buffering in OC-192/STM-64 SONET/SDH line cards requiring deterministic latency.

IC Role / Device Role / Timing Role: Synchronous burst memory providing jitter-free data staging between framer and switch fabric interfaces.

Use Value: Fixed 2.0-cycle read latency ensures predictable timing closure across temperature and voltage corners.

Baseband Processing Memory High-Speed Test Equipment Buffer

Use Scenario: Temporary storage of IQ samples between ADC/DAC and DSP in LTE/5G radio units.

IC Role / Device Role / Timing Role: Low-latency, burst-capable memory interfacing directly with FPGA-based digital front-end logic.

Use Value: Independent RPS/WPS enables interleaved read/write scheduling - avoids pipeline stalls during real-time processing.

Use Scenario: Capturing high-speed serial data streams in automated test equipment for protocol analysis.

IC Role / Device Role / Timing Role: Dual-port SRAM serving as acquisition buffer between sampling ASIC and host processor interface.

Use Value: QVLD and echo clocks (CQ/CQ) allow reliable source-synchronous capture at 800 Mbps DDR - eliminates setup/hold violations.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72T36120L10BG 10 ns access time, asynchronous interface, no PLL or echo clocks Used in legacy systems requiring simple address/data strobe timing - lacks burst efficiency and DDR bandwidth Select when system clocking is asynchronous or when JESD204B-like source-synchronous capture is not required
ISSI IS61WV102432BLL-10BLI 10 ns async access, 32-bit width, no separate ports or burst mode Suitable for general-purpose buffering where concurrency and bandwidth are secondary to cost and density Choose for cost-sensitive industrial controllers where 400 MHz QDR II+ performance is unnecessary

Compared with IDT72T36120L10BG and IS61WV102432BLL-10BLI, CY7C1145KV18-400BZXC delivers 2.8× higher effective bandwidth via DDR + burst, eliminates bus turnaround overhead, and provides deterministic 2-cycle latency - critical for real-time packet processing and telecom infrastructure.

Availability

CY7C1145KV18-400BZXC is available at Aetrix Electronics and suitable for network switches, telecom line cards, baseband processors, and high-speed test equipment requiring stable component supply and long-term obsolescence management.

Supply support for CY7C1145KV18-400BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications.

The QDR® II+ SRAM product line targets high-speed packet buffering and deterministic latency applications in communications infrastructure, where concurrent read/write throughput and precise timing control are essential.

FAQ

What is the function of the DOFF pin on CY7C1145KV18-400BZXC?

The DOFF pin controls the internal PLL: when pulled HIGH (via 10 kΩ or lower pull-up), the device operates in QDR II+ mode with 2.0-cycle read latency and supports up to 400 MHz clocking. When pulled LOW, the PLL is disabled and the device reverts to QDR I timing, limiting maximum frequency to 167 MHz with 1-cycle latency. This pin must never be left floating or tied directly to ground.

How does the ZQ pin affect signal integrity in high-speed designs?

The ZQ pin connects to an external resistor to ground (typically 100 Ω) to calibrate the output driver impedance of Q[35:0], CQ, and CQ pins to 0.2 × RQ (e.g., 20 Ω). This matches typical PCB trace impedances, reducing reflections and improving eye diagram margins. Leaving ZQ unconnected or tying it to VSS violates specification and degrades output waveform fidelity.

Can CY7C1145KV18-400BZXC perform concurrent read and write operations to the same memory location?

Yes - the device supports true concurrent read and write operations to the same address due to its physically separate read and write data paths and pipelined architecture. However, writing to an address currently being read may return stale data for that burst if the write completes after the read has latched the address but before data is driven out; coherency is maintained only for subsequent reads.

What is the role of BWS[3:0] in byte-level write control?

BWS[3:0] are active-low byte write select signals that mask individual 9-bit segments of the 36-bit D[35:0] bus: BWS0 covers D[8:0], BWS1 covers D[17:9], BWS2 covers D[26:18], and BWS3 covers D[35:27]. When a BWS bit is HIGH, the corresponding byte is ignored during write; when LOW, that byte is written. This enables partial-word updates without requiring read-modify-write sequences.

CY7C1145KV18-400BZXC Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II+
Memory Size:
18Mbit
Memory Organization:
512K x 36
Memory Interface:
Parallel
Clock Frequency:
400 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1145KV18-400BZXC FAQ

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Please submit a Request for Quotation (RFQ) for CY7C1145KV18-400BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1145KV18-400BZXC reliable?

The price and inventory of CY7C1145KV18-400BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1145KV18-400BZXC is usually 5 days.

3.What payment methods are accepted for CY7C1145KV18-400BZXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1145KV18-400BZXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1145KV18-400BZXC?

CY7C1145KV18-400BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1145KV18-400BZXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1145KV18-400BZXC?

For technical support, including CY7C1145KV18-400BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1145KV18-400BZXC requirements.

6.How does Aetrix verify that CY7C1145KV18-400BZXC is sourced from the original manufacturer or authorized distributors?

All CY7C1145KV18-400BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1145KV18-400BZXC meets industry standards.

7.What is the process for return or replacement of CY7C1145KV18-400BZXC?

All CY7C1145KV18-400BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1145KV18-400BZXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1145KV18-400BZXC part is unused and in its original packaging.

Return procedure for CY7C1145KV18-400BZXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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