Cypress Semiconductor Corp CY7C1145KV18-450BZXC
- Part No.:
- CY7C1145KV18-450BZXC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1145KV18-450BZXC.pdf
- Description:
- IC SRAM 18MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:333
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Product details
Overview
CY7C1145KV18-450BZXC from Cypress Semiconductor is a 512K × 36-bit, 18-Mbit QDR® II+ synchronous SRAM with separate read/write ports, 450 MHz clock operation (900 Mbps DDR data rate), 2.0-cycle read latency, and HSTL I/O interface. It delivers full data coherency and concurrent read/write transactions for high-bandwidth packet buffering in network line cards.
For engineers reviewing the CY7C1145KV18-450BZXC datasheet, CY7C1145KV18-450BZXC pinout, CY7C1145KV18-450BZXC application, or CY7C1145KV18-450BZXC equivalent, key selection criteria include burst depth (four-word), DOFF-controlled latency mode (QDR I vs. QDR II+), echo clock timing (CQ/CQ), byte write select granularity (BWS[3:0]), and 165-ball FBGA package compatibility with high-speed PCB layout constraints.
Technical Context
The CY7C1145KV18 implements a true dual-port architecture with independent K/K clocks driving separate read and write pipelines-no bus turnaround required. Its four-word burst transfers 144 bits per read cycle (36-bit × 4) and supports depth expansion via RPS/WPS and BWS[3:0] controls.
Internal PLL enables precise 2.0-cycle read latency when DOFF = HIGH; disabling PLL (DOFF = LOW) reverts to QDR I mode (1-cycle latency, ≤167 MHz). Echo clocks CQ/CQ align with output data edges, and QVLD provides explicit valid-data indication synchronized to CQ/CQ.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 512K × 36-bit (18 Mbit total); enables 144-bit wide burst transfers per access |
| Max Clock Frequency | 450 MHz (K/K); sustains 900 MT/s effective data rate on both ports |
| Read Latency | 2.0 clock cycles (DOFF = HIGH); deterministic timing critical for pipeline-synchronized systems |
| I/O Voltage | VDDQ = 1.4 V to 1.8 V; supports 1.5 V or 1.8 V HSTL-compatible signaling |
| Core Supply | VDD = 1.8 V ± 0.1 V; low-voltage core reduces dynamic power in high-frequency operation |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm); optimized for controlled-impedance routing and thermal dissipation |
| Interface Standard | HSTL Class I inputs / variable-drive HSTL outputs; ensures signal integrity at 450 MHz |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant Pb-free option available.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[35:0] | Synchronous write data inputs | Latched on rising edges of K/K; 36-bit parallel input path for burst writes |
| Q[35:0] | Synchronous read data outputs | Driven on rising edges of K/K; 36-bit parallel output with QVLD synchronization |
| RPS, WPS | Port select controls | Active-LOW enables independent read/write port activation; enables depth expansion |
| BWS[3:0] | Byte write select inputs | Four independent 9-bit byte masks; allows partial-word writes without read-modify-write |
| K, K | Dual-phase input clocks | Rising edges drive all synchronous operations; eliminates single-clock skew limitations |
| CQ, CQ | Echo clock outputs | Free-running, edge-aligned copies of K/K; simplify high-speed data capture in FPGA/ASIC receivers |
| QVLD | Valid data indicator | Asserted coincident with first valid Q[35:0] word; eliminates setup/hold uncertainty in receiver logic |
| DOFF | PLL disable control | LOW disables internal PLL, reverting to QDR I timing (≤167 MHz, 1-cycle latency) |
| ZQ | Output impedance calibration | Connects to external resistor to ground; tunes CQ/CQ/Q[35:0] drive strength to match PCB trace Z₀ |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write data paths | Eliminates bus turnaround overhead and contention; enables true concurrent access in packet-forwarding engines |
| Four-word burst architecture | Reduces address bus frequency by 4× versus single-word access; lowers routing complexity and timing closure burden |
| 2.0-cycle read latency (DOFF = HIGH) | Guaranteed deterministic response for time-critical buffer reads in telecom PHY layers |
| HSTL I/O with variable drive | Matches industry-standard memory interfaces; drive strength tunable via ZQ for optimal signal integrity |
| JTAG 1149.1 test access port | Enables boundary scan testing and in-system programming without additional debug hardware |
Applications
| Network Packet Buffering | High-Speed Test Equipment Memory |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and payloads in 10G/25G Ethernet line cards. IC Role / Device Role / Timing Role: Dual-port SRAM acting as zero-latency shared buffer between MAC and switch fabric controllers. Use Value: Concurrent read/write avoids arbitration delays; 900 MT/s bandwidth meets full-duplex wire-rate requirements. |
Use Scenario: Capturing real-time waveform samples in automated test equipment (ATE) pattern generators. IC Role / Device Role / Timing Role: High-speed acquisition memory interfacing directly with FPGA-based sequencers and DACs. Use Value: Four-word burst reduces address generation logic; echo clocks (CQ/CQ) enable reliable sampling at 450 MHz. |
| Telecom Baseband Processing | Defense Radar Signal Processing |
|
Use Scenario: Temporary storage of OFDM symbol data between FFT and channel estimation blocks in LTE/5G baseband units. IC Role / Device Role / Timing Role: Low-latency, coherent memory for pipelined DSP data flow with strict timing deadlines. Use Value: Full data coherency ensures latest write is always read; 2.0-cycle latency fits within fixed pipeline stages. |
Use Scenario: Real-time pulse-Doppler processing buffers in airborne radar front-ends requiring radiation-tolerant timing. IC Role / Device Role / Timing Role: Deterministic-access memory supporting multi-channel ADC/DAC streaming with sub-nanosecond jitter tolerance. Use Value: PLL-derived echo clocks (CQ/CQ) and QVLD eliminate metastability risk in high-jitter environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-bandwidth synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T36120L10BG | 36-bit, 1M × 36, 100 MHz QDR II; no PLL, fixed 1-cycle latency | Lower bandwidth (200 MT/s); suited for cost-sensitive, non-pipelined control-plane buffers | Select when system clock ≤100 MHz and latency predictability outweighs bandwidth needs |
| ISSI IS61WV102436B | 36-bit, 1M × 36, 167 MHz QDR I; no echo clocks or QVLD | Lacks CQ/CQ and QVLD; requires external strobe generation and tighter timing margins | Choose for legacy QDR I designs where echo clock simplification is not required |
Compared with IDT72T36120L10BG and ISSI IS61WV102436B, CY7C1145KV18-450BZXC delivers 4.5× higher bandwidth and deterministic 2-cycle latency with integrated timing aids (CQ/CQ/QVLD), making it optimal for next-generation packet-processing pipelines where timing margin is constrained.
Availability
CY7C1145KV18-450BZXC is available at Aetrix Electronics and suitable for network line cards, high-speed test equipment, telecom baseband units, and defense radar subsystems requiring stable component supply across extended production lifecycles.
Supply support for CY7C1145KV18-450BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications.
CY7C1145KV18 belongs to the QDR® II+ SRAM product line, engineered specifically for deterministic, high-throughput data buffering in packet-switched infrastructure where concurrent read/write and precise timing alignment are mandatory.
FAQ
What is the function of the DOFF pin?
The DOFF pin controls internal PLL operation: when tied HIGH, the device operates in QDR II+ mode with 2.0-cycle read latency and 450 MHz capability; when tied LOW, the PLL is disabled and the device reverts to QDR I timing (1-cycle latency, max 167 MHz). This dual-mode flexibility allows backward compatibility while enabling peak performance in new designs.
How does the ZQ pin affect signal integrity?
ZQ connects to an external resistor to ground to calibrate output driver impedance for CQ, CQ, and Q[35:0] pins. Calibration sets output impedance to 0.2 × RQ, matching typical PCB trace impedances (e.g., 50 Ω with 250 Ω resistor). This minimizes reflections and ensures clean signal edges at 450 MHz, critical for reliable DDR data capture.
Can CY7C1145KV18-450BZXC perform partial writes without read-modify-write?
Yes-four independent Byte Write Select inputs (BWS[3:0]) allow masking of 9-bit byte lanes during write operations. Each BWS bit controls nine consecutive data bits (e.g., BWS0 → D[8:0]), enabling selective updates of sub-36-bit fields without disturbing other bytes in the same location, reducing latency and bus traffic.
What is the role of QVLD in system timing?
QVLD is asserted synchronously with the first valid word of each four-word burst on Q[35:0], edge-aligned to CQ/CQ. It eliminates ambiguity in data-valid window detection, allowing receivers to latch data without complex delay-chain tuning or eye-diagram margining-especially valuable in FPGA-based systems with limited IO timing resources.
CY7C1145KV18-450BZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II+
- Memory Size:
- 18Mbit
- Memory Organization:
- 512K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 450 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1145KV18-450BZXC FAQ
1.How can I place an order for CY7C1145KV18-450BZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1145KV18-450BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1145KV18-450BZXC reliable?
The price and inventory of CY7C1145KV18-450BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1145KV18-450BZXC is usually 5 days.
3.What payment methods are accepted for CY7C1145KV18-450BZXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1145KV18-450BZXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1145KV18-450BZXC?
CY7C1145KV18-450BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1145KV18-450BZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1145KV18-450BZXC?
For technical support, including CY7C1145KV18-450BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1145KV18-450BZXC requirements.
6.How does Aetrix verify that CY7C1145KV18-450BZXC is sourced from the original manufacturer or authorized distributors?
All CY7C1145KV18-450BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1145KV18-450BZXC meets industry standards.
7.What is the process for return or replacement of CY7C1145KV18-450BZXC?
All CY7C1145KV18-450BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1145KV18-450BZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1145KV18-450BZXC part is unused and in its original packaging.
Return procedure for CY7C1145KV18-450BZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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