Cypress Semiconductor Corp CY7C1163KV18-550BZC
- Part No.:
- CY7C1163KV18-550BZC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1163KV18-550BZC.pdf
- Description:
- IC SRAM 18MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:136
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Product details
Overview
CY7C1163KV18 from Cypress Semiconductor is a 1M × 18, 18-Mbit QDR® II+ SRAM with four-word burst architecture, 2.5-cycle read latency, and DDR interfaces on independent read/write ports. It operates at 550 MHz (1100 MT/s), supports 1.8 V core supply and 1.4–1.8 V I/O supply, and uses HSTL I/O with echo clocks (CQ/CQ) for precise high-speed data capture in networking packet buffers.
For engineers reviewing the CY7C1163KV18 datasheet, CY7C1163KV18 pinout, CY7C1163KV18 application, or CY7C1163KV18 equivalent, key selection criteria include its 550-MHz clock capability, separate RPS/WPS control, DOFF-configurable latency mode, and 165-ball FBGA package compatibility with depth-expansion systems requiring deterministic burst timing.
Technical Context
The CY7C1163KV18 implements a synchronous pipelined QDR II+ architecture with physically isolated read and write data paths-no bus turnaround required. Its dual DDR interfaces transfer data on every rising edge of K and K clocks, achieving 1100 MT/s bandwidth while maintaining full data coherency across concurrent transactions.
Internal operation relies on a PLL for accurate data placement and echo clocks (CQ/CQ) aligned to K/K for receiver-side timing recovery. The DOFF pin selects between 2.5-cycle QDR II+ mode (DOFF = HIGH) and 1-cycle QDR I mode (DOFF = LOW), with corresponding AC timing shifts and maximum frequency reduction to 167 MHz in the latter.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 18 Mbit (1M × 18 organization) |
| Max Clock Frequency | 550 MHz - enables 1100 MT/s DDR throughput on both ports |
| Read Latency | 2.5 clock cycles - fixed pipeline delay when DOFF = HIGH |
| Core Supply Voltage | 1.8 V ± 0.1 V - defines internal logic and array operating margin |
| I/O Supply Range | 1.4 V to 1.8 V - supports HSTL-15/18 termination and drive strength tuning |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - standard footprint for high-pin-count memory stacking |
| Interface Standard | HSTL Class I inputs / variable-drive HSTL outputs - ensures signal integrity at 550 MHz |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body height, RoHS-compliant, with 0.8 mm ball pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[17:0] | Synchronous write data input | Latched on rising edges of K/K; 18-bit parallel path for burst writes |
| Q[17:0] | Synchronous read data output | DDR-aligned output driven on K/K rising edges; tristated when RPS inactive |
| RPS | Read port select | Active-low synchronous enable; initiates 4-word burst read on assertion |
| WPS | Write port select | Active-low synchronous enable; gates D[17:0] and BWS[1:0] into write path |
| BWS[1:0] | Byte write select | Active-low controls D[8:0] (BWS0) and D[17:9] (BWS1); enables partial-word writes |
| K, K | Differential input clocks | Rising edges sample all synchronous inputs; K drives read path, K drives write path |
| CQ, CQ | Echo clocks | Free-running, phase-aligned copies of K/K for source-synchronous data capture |
| QVLD | Valid data indicator | Edge-aligned with CQ/CQ; signals valid Q[17:0] during read bursts |
| DOFF | PLL disable control | Active-low; disables PLL to switch from QDR II+ (2.5-cycle) to QDR I (1-cycle) timing |
| ZQ | Output impedance calibration | Connects to external resistor to ground to tune CQ/Q[17:0] drive strength to 0.2×RQ |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write ports | Eliminates data bus turnaround overhead and contention in full-duplex traffic buffers |
| Four-word burst architecture | Reduces address bus toggling by 75% per transaction vs. single-word access |
| 2.5-cycle read latency (DOFF = HIGH) | Enables predictable, low-jitter timing for packet forwarding pipelines in 10G+ switches |
| HSTL I/O with echo clocks | Supports PCB trace lengths up to 25 cm at 550 MHz with <15 ps skew tolerance |
| JTAG 1149.1 test access port | Enables boundary scan testing and in-system programming without additional debug hardware |
Applications
| High-Speed Network Packet Buffer | Telecom Line Card Memory |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet frames in Layer 2/L3 switching ASICs with strict latency budgets. IC Role / Device Role / Timing Role: Dedicated burst-access SRAM serving as ingress/egress FIFO with deterministic 2.5-cycle read response. Use Value: Concurrent read/write avoids arbitration stalls; echo clocks simplify SerDes-to-memory timing closure at 1100 MT/s. |
Use Scenario: Buffering TDM voice channels and control-plane messages in carrier-grade optical line cards. IC Role / Device Role / Timing Role: High-bandwidth, low-latency memory for time-critical header processing and buffering in multi-protocol encapsulation engines. Use Value: Separate RPS/WPS enables simultaneous header read and payload write without interlock; HSTL I/O meets ETSI thermal/noise specs. |
| Baseband Processing Memory | Test Equipment Pattern Memory |
|
Use Scenario: Holding channel estimation coefficients and FFT output buffers in LTE/5G baseband FPGAs. IC Role / Device Role / Timing Role: Synchronous burst SRAM interfacing directly to FPGA fabric via dedicated read/write data paths. Use Value: 550-MHz clock supports >8 Gbps aggregate bandwidth needed for real-time OFDM symbol processing. |
Use Scenario: Storing stimulus/response patterns in high-speed ATE systems performing DDR4/LPDDR4 validation. IC Role / Device Role / Timing Role: Deterministic-latency memory for generating precise timing waveforms synchronized to system clocks. Use Value: QVLD and echo clocks provide cycle-accurate data validity feedback essential for sub-nanosecond pattern alignment. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T3615L5PF | 1M × 18 QDR II+, 500 MHz max, 2.5-cycle latency, same 165-BGA package | Lower max frequency; tighter tKQV (QVLD setup) spec; no ZQ calibration | Select when 500 MHz suffices and impedance matching is handled externally |
| ISSI IS61QW25618A-550BQI | 256K × 18 QDR II+, 550 MHz, 2.5-cycle latency, 165-BGA, but lower density | Half the memory depth; different BWS mapping; no DOFF pin for QDR I fallback | Choose only if system requires smaller footprint and can accept reduced buffer depth |
Compared with IDT72T3615L5PF and IS61QW25618A-550BQI, CY7C1163KV18 delivers full 18-Mbit depth at 550 MHz with programmable impedance (ZQ) and dual-mode latency (via DOFF), making it uniquely suited for next-gen packet processors needing both bandwidth headroom and timing flexibility.
Availability
CY7C1163KV18 is available at Aetrix Electronics and suitable for high-speed network packet buffers, telecom line card memory, and baseband processing systems requiring stable component supply, long-lifecycle support, and guaranteed traceable sourcing.
Supply support for CY7C1163KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive markets.
CY7C1163KV18 belongs to Cypress's QDR® II+ SRAM product line, engineered specifically for deterministic, low-latency, full-duplex memory access in packet-switching and signal-processing infrastructure.
FAQ
What is the function of the DOFF pin on CY7C1163KV18?
The DOFF pin controls the internal PLL: when asserted LOW, it disables the PLL and forces the device into QDR I mode with 1-cycle read latency and reduced maximum frequency (167 MHz). When HIGH, the PLL is active, enabling 2.5-cycle latency and full 550-MHz operation. Pull-up resistors ≤10 kΩ are recommended for normal QDR II+ use.
How does the ZQ pin affect output drive strength?
ZQ connects to an external resistor (RQ) tied to ground to calibrate output impedance of Q[17:0], CQ, and CQ pins to 0.2 × RQ. This matches the device's drive strength to the PCB trace impedance, minimizing reflections and improving signal integrity. Connecting ZQ directly to VDDQ enables minimum impedance mode; floating or grounding ZQ is prohibited.
Can CY7C1163KV18 perform simultaneous read and write operations?
Yes - the device features fully independent read and write ports with separate RPS and WPS controls. A read burst (initiated by RPS) and write burst (initiated by WPS) can occur concurrently on the same clock cycle, provided address and byte-select signals are valid, with no bus contention or turnaround delay.
What is the purpose of the QVLD signal?
QVLD is an edge-aligned valid-data indicator that asserts synchronously with CQ/CQ to mark when Q[17:0] outputs contain valid data during a read burst. It eliminates the need for fixed delay-based sampling windows and enables dynamic, clock-phase-locked data capture in high-speed receivers, especially critical in FPGA-based systems.
CY7C1163KV18-550BZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II+
- Memory Size:
- 18Mbit
- Memory Organization:
- 1M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 550 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1163KV18-550BZC FAQ
1.How can I place an order for CY7C1163KV18-550BZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1163KV18-550BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1163KV18-550BZC reliable?
The price and inventory of CY7C1163KV18-550BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1163KV18-550BZC is usually 5 days.
3.What payment methods are accepted for CY7C1163KV18-550BZC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1163KV18-550BZC transactions.
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4.How is shipping managed for CY7C1163KV18-550BZC?
CY7C1163KV18-550BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1163KV18-550BZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1163KV18-550BZC?
For technical support, including CY7C1163KV18-550BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1163KV18-550BZC requirements.
6.How does Aetrix verify that CY7C1163KV18-550BZC is sourced from the original manufacturer or authorized distributors?
All CY7C1163KV18-550BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1163KV18-550BZC meets industry standards.
7.What is the process for return or replacement of CY7C1163KV18-550BZC?
All CY7C1163KV18-550BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1163KV18-550BZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1163KV18-550BZC part is unused and in its original packaging.
Return procedure for CY7C1163KV18-550BZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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