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Cypress Semiconductor Corp CY7C1165KV18-400BZC

Part No.:
CY7C1165KV18-400BZC
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1165KV18-400BZC.pdf
Description:
IC SRAM 18MBIT PARALLEL 165FBGA
Quantity:
Payment:
Payment
Shipping:
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Inventory:2,069

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Product details

Overview

CY7C1165KV18 from Cypress Semiconductor is a 512K × 36, 18-Mbit QDR® II+ SRAM with four-word burst architecture, 2.5-cycle read latency, and DDR interfaces on independent read/write ports operating at 400 MHz (200 MHz clock, 400 MT/s per port). It uses 1.8 V core supply (VDD) and 1.4–1.8 V I/O supply (VDDQ), housed in a 165-ball FBGA (13 × 15 × 1.4 mm), and targets high-bandwidth packet buffering in network switches and routers.

For engineers reviewing the CY7C1165KV18 datasheet, CY7C1165KV18 pinout, CY7C1165KV18 application, or CY7C1165KV18 equivalent, key selection criteria include its 2.5-cycle read latency mode (DOFF = HIGH), echo clock (CQ/CQ) timing support, HSTL I/O compatibility, byte write select (BWS[3:0]) granularity, and JTAG 1149.1 test access for production validation.

Technical Context

The CY7C1165KV18 implements a synchronous pipelined QDR II+ architecture with physically separate read and write data paths-eliminating bus turnaround and enabling true concurrent read/write operations. Its dual DDR interfaces transfer data on both rising edges of K and K clocks, achieving 400 MT/s effective throughput per port with 512K × 36 organization.

It integrates an internal PLL for precise data placement relative to echo clocks CQ/CQ, supports programmable output impedance via ZQ pin (0.2×RQ matching), and provides QVLD to indicate valid output data edge-aligned with echo clocks-critical for reliable capture in high-speed SerDes-adjacent systems.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density18 Mbit (512K × 36 configuration)
Max Clock Frequency400 MHz input clock → 400 MT/s DDR data rate per port
Read Latency2.5 cycles (when DOFF = HIGH); enables deterministic timing for pipeline-constrained designs
Core Supply VoltageVDD = 1.8 V ± 0.1 V - defines minimum power rail stability requirement
I/O Supply RangeVDDQ = 1.4 V to 1.8 V - supports interoperability with 1.5 V or 1.8 V system logic
Package165-ball FBGA (13 × 15 × 1.4 mm) - standard footprint for high-pin-count memory in dense PCB layouts
Interface StandardHSTL Class I inputs / variable-drive HSTL outputs - ensures signal integrity at 400 MT/s

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
D[35:0]Synchronous write data inputs36-bit parallel data sampled on rising edges of K/K; supports full-width or byte-selectable writes via BWS[3:0]
Q[35:0]Synchronous read data outputs36-bit parallel outputs edge-aligned with CQ/CQ; tristated when RPS deasserted
RPS, WPSPort select controlsActive-low synchronous enables for independent read/write port activation - enables depth expansion and port gating
BWS[3:0]Byte write select inputsFour independent active-low signals controlling 9-bit byte lanes (D[8:0], D[17:9], D[26:18], D[35:27]) - preserves unselected data during partial writes
K, KDual-phase input clocksRising edges drive all synchronous inputs/outputs; K used for address/RPS/WPS/BWS sampling; K used for D[35:0] sampling and Q[35:0] driving
CQ, CQFree-running echo clocksOutput clocks synchronized to K/K - simplify high-speed data capture by eliminating board-level clock skew compensation
QVLDData validity indicatorAsserted coincident with first valid Q[35:0] word in burst - eliminates need for fixed delay-based data strobes
ZQImpedance calibration inputConnects to external resistor to ground to tune CQ/CQ/Q[35:0] output drive strength to match 50 Ω or 60 Ω trace impedance
DOFFPLL disable controlActive-low pin that disables internal PLL; forces QDR I mode (1-cycle latency, ≤167 MHz) - used for fallback or low-power test modes

Key Features

FeatureDesign Value
Independent Read/Write PortsEliminates data bus turnaround overhead - enables simultaneous 400 MT/s read + 400 MT/s write without arbitration or contention
Four-Word Burst ArchitectureTransfers 144 bits (4 × 36) per access in two clock cycles - reduces address bus frequency by 2× vs. single-word devices
Echo Clocks (CQ/CQ)Provide source-synchronous timing references aligned to Q[35:0] - removes setup/hold uncertainty in FPGA or ASIC receiver design
Programmable Output Impedance (ZQ)Enables on-die termination tuning to match PCB trace impedance - reduces signal reflections and improves eye margin at 400 MT/s
JTAG 1149.1 Test Access PortSupports boundary scan testing and in-system programming - critical for manufacturing test coverage in high-reliability telecom hardware

Applications

Network Packet BufferingHigh-Speed Interconnect Buffering

Use Scenario: Storing ingress/egress packet headers and payloads in Layer 2/3 switching ASICs where line-rate forwarding requires zero-latency memory access.

IC Role / Device Role / Timing Role: Dedicated QDR II+ SRAM acting as dual-port FIFO buffer - reads from egress pipeline while writing from ingress pipeline concurrently.

Use Value: 2.5-cycle read latency and 400 MT/s bandwidth ensure no backpressure under 10 Gbps Ethernet traffic with 64-byte packets.

Use Scenario: Bridging between high-speed SerDes lanes (e.g., PCIe Gen3 x8) and slower processing subsystems in baseband units or radar processors.

IC Role / Device Role / Timing Role: Synchronizing and decoupling data streams across clock domains using echo clocks (CQ/CQ) for deterministic capture timing.

Use Value: HSTL I/O and ZQ-calibrated outputs maintain >400 mV eye height at 400 MT/s, meeting PCIe Gen3 jitter specs without external terminations.

Telecom Line Card MemoryTest Equipment Pattern Memory

Use Scenario: Holding real-time protocol state tables (e.g., MPLS label stacks, VLAN mappings) in carrier-grade optical transport equipment.

IC Role / Device Role / Timing Role: Low-latency SRAM providing sub-5 ns read access to routing metadata - accessed via dedicated RPS/WPS control lines.

Use Value: Concurrent read/write capability allows table updates (write) without stalling packet lookups (read), sustaining 100% line-rate performance.

Use Scenario: Storing stimulus/response patterns for automated test equipment (ATE) requiring deterministic, high-throughput memory access.

IC Role / Device Role / Timing Role: High-reliability burst memory delivering 144-bit pattern words on every K/K edge - synchronized via QVLD for precise trigger alignment.

Use Value: JTAG 1149.1 support enables in-system verification of memory contents and fault isolation during production test.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IDT72T3615L10BG10 ns access time, 3.3 V core/I/O, ×36 QDR-II (not QDR-II+), no PLL, max 250 MHz clockLimited to lower-frequency legacy systems; lacks echo clocks and QVLD; incompatible with 1.8 V core designsSelect only if maintaining legacy 3.3 V infrastructure and <250 MHz bandwidth suffices
ISSI IS61WV102432BLL-10BLI1024K × 32, 3.3 V/2.5 V, asynchronous SRAM, no DDR, no burst, 10 ns accessSingle-port, non-pipelined - cannot support concurrent read/write; unsuitable for real-time bufferingChoose only for simple control-plane storage where latency tolerance >10 ns and bandwidth <200 MB/s

Compared with IDT72T3615L10BG and IS61WV102432BLL-10BLI, the CY7C1165KV18 uniquely delivers 400 MT/s DDR throughput with 2.5-cycle latency, echo-clock–assisted timing, and 1.8 V core operation - making it the only viable option for new 10G+ packet-processing designs requiring deterministic dual-port behavior.

Availability

CY7C1165KV18 is available at Aetrix Electronics and suitable for network packet buffering, high-speed interconnect buffering, and telecom line card memory requiring stable component supply and long-term industrial lifecycle support.

Supply support for CY7C1165KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.

The QDR® II+ SRAM product line was designed specifically for high-throughput, low-latency buffering in networking and telecommunications infrastructure - emphasizing deterministic timing, concurrent access, and signal integrity at multi-Gbps rates.

FAQ

What is the function of the DOFF pin on CY7C1165KV18?

The DOFF (PLL Turn Off) pin is an active-low control that disables the internal phase-locked loop. When pulled LOW, the device reverts to QDR I timing mode with 1-cycle read latency and maximum 167 MHz clock rate. For normal QDR II+ operation at 400 MHz with 2.5-cycle latency, DOFF must be tied HIGH via ≤10 kΩ pull-up to VDDQ.

How does the ZQ pin affect signal integrity?

The ZQ pin connects to an external resistor to ground (typically 50 Ω or 60 Ω) to calibrate the output driver impedance of Q[35:0], CQ, and CQ pins to 0.2×RQ. This matches the SRAM's output impedance to the PCB trace impedance, minimizing reflections and preserving signal eye opening at 400 MT/s - critical for reliable operation without external series termination.

Can CY7C1165KV18 perform partial writes without corrupting adjacent data?

Yes. The device supports byte-selectable writes using BWS[3:0] inputs. Each BWS signal controls a 9-bit lane (e.g., BWS0 → D[8:0]). When a BWS bit is deasserted (HIGH), the corresponding byte remains unaltered during the write cycle - enabling safe in-place updates of specific fields within a 36-bit word without read-modify-write overhead.

Is the CY7C1165KV18 compatible with FPGA memory controllers supporting QDR II+?

Yes. The device complies fully with the QDR II+ specification, including echo clock (CQ/CQ) timing, QVLD signaling, and 2.5-cycle latency mode. Major FPGA vendors (Xilinx, Intel) provide verified IP cores for CY7C1165KV18 interfacing - confirmed by reference designs in Xilinx UG586 and Intel AN-724, supporting 400 MT/s operation with proper PCB layout guidelines.

CY7C1165KV18-400BZC Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II+
Memory Size:
18Mbit
Memory Organization:
512K x 36
Memory Interface:
Parallel
Clock Frequency:
400 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1165KV18-400BZC FAQ

1.How can I place an order for CY7C1165KV18-400BZC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1165KV18-400BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1165KV18-400BZC reliable?

The price and inventory of CY7C1165KV18-400BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1165KV18-400BZC is usually 5 days.

3.What payment methods are accepted for CY7C1165KV18-400BZC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1165KV18-400BZC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1165KV18-400BZC?

CY7C1165KV18-400BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1165KV18-400BZC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1165KV18-400BZC?

For technical support, including CY7C1165KV18-400BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1165KV18-400BZC requirements.

6.How does Aetrix verify that CY7C1165KV18-400BZC is sourced from the original manufacturer or authorized distributors?

All CY7C1165KV18-400BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1165KV18-400BZC meets industry standards.

7.What is the process for return or replacement of CY7C1165KV18-400BZC?

All CY7C1165KV18-400BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1165KV18-400BZC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1165KV18-400BZC part is unused and in its original packaging.

Return procedure for CY7C1165KV18-400BZC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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