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Cypress Semiconductor Corp CY7C1168KV18-550BZXC

Part No.:
CY7C1168KV18-550BZXC
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1168KV18-550BZXC.pdf
Description:
IC SRAM 18MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:136

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Product details

Overview

CY7C1168KV18 from Cypress Semiconductor is a 18-Mbit (1M × 18) synchronous DDR II+ SRAM with two-word burst architecture, 2.5-cycle read latency at 550 MHz, HSTL I/O interface, and integrated PLL for precise data placement. It operates with core VDD = 1.8 V ± 0.1 V and I/O VDDQ = 1.4 V to 1.8 V, and is used in high-bandwidth networking packet buffers and FPGA co-processor memory subsystems.

For engineers reviewing the CY7C1168KV18 datasheet, CY7C1168KV18 pinout, CY7C1168KV18 application, or CY7C1168KV18 equivalent, key selection criteria include DDR II+ timing compliance, echo clock (CQ/CQ) synchronization capability, QVLD data validity signaling, and 165-ball FBGA package compatibility with high-speed PCB layout constraints.

Technical Context

This SRAM implements a pipelined synchronous architecture where address and control inputs (A, R/W, LD, BWS) are registered on the rising edge of K, while write data is latched on both K and K edges. Read data is driven on both K and K edges with 2.5-cycle latency when DOFF = HIGH, enabling deterministic timing in multi-device depth-expanded configurations.

The device integrates an internal PLL to align output data with echo clocks CQ/CQ, supports byte-selectable writes via BWS[1:0], and uses ZQ impedance calibration to match system bus termination. Its dual-clock DDR interface eliminates external strobes and simplifies capture in 1100 MT/s systems without requiring source-synchronous routing per signal.

Key Specifications

Parameter Value and Actual Design Meaning
Density 18 Mbit (1M × 18), enabling compact high-throughput buffer storage without external width expansion
Max Clock Frequency 550 MHz - supports 1100 MT/s effective data rate with double-data-rate transfers
Read Latency 2.5 cycles (DOFF = HIGH) - provides predictable timing margin for FPGA or ASIC controller design
I/O Voltage VDDQ = 1.4 V to 1.8 V - compatible with both 1.5 V and 1.8 V HSTL-18/15 systems
Package 165-ball FBGA (13 × 15 × 1.4 mm) - optimized for thermal dissipation and high-pin-count routing in dense logic boards
Core Supply VDD = 1.8 V ± 0.1 V - ensures stable SRAM cell operation under process/voltage/temperature variation
Timing Interface DDR II+ with echo clocks CQ/CQ and QVLD - eliminates need for separate capture strobes in system-level timing closure

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body height, RoHS-compliant, with 0.8 mm ball pitch and standard JEDEC MO-270AB footprint.

Pin/Terminal Circuit Role Design Meaning
DQ[17:0] Synchronous bidirectional data bus Shares physical pins for input (write) and output (read); data valid aligned to CQ/CQ edges with QVLD assertion
K / K Differential clock inputs Rising edges of both clocks drive all synchronous registers; K initiates transactions, K times data output
CQ / CQ Output echo clocks Free-running, PLL-synchronized copies of K/K used by system logic to sample DQ outputs without skew compensation
QVLD Valid data indicator Asserted synchronously with CQ/CQ to signal that DQ[17:0] contains valid read data - replaces complex timing margin analysis
DOFF PLL enable/disable control Active LOW; when grounded, disables PLL and reverts to DDR I mode (1-cycle latency, ≤167 MHz)
ZQ Impedance calibration reference Connects to external resistor to ground to tune CQ/CQ/DQ output driver impedance to 0.2 × RQ for signal integrity
LD Load command input Sampled on K rising edge to latch address and R/W state; defines start of burst transaction cycle
BWS[1:0] Byte write select Active LOW controls write masking: BWS0 → DQ[8:0], BWS1 → DQ[17:9]; enables partial-word updates without read-modify-write

Key Features

Feature Design Value
Two-word burst architecture Reduces address bus toggling frequency by 50% versus single-word SRAMs, lowering EMI and controller overhead
Integrated PLL with echo clocks Eliminates need for external delay-locked loops or phase-matching circuits in DDR timing-critical designs
QVLD data validity signal Provides unambiguous, edge-aligned indication of valid output data - removes setup/hold uncertainty in capture logic
HSTL-compatible I/O with variable drive Ensures signal integrity at 1100 MT/s on controlled-impedance traces; supports both 1.5 V and 1.8 V system voltage rails
ZQ impedance calibration Enables dynamic output driver tuning to match PCB trace impedance, reducing reflection-induced jitter and eye closure

Applications

Network Packet Buffer FPGA Co-Processor Memory

Use Scenario: Storing ingress/egress Ethernet frames in Layer 2/L3 switches before forwarding decisions.

IC Role / Device Role / Timing Role: High-throughput, low-latency burst-access SRAM acting as line-rate temporary storage between MAC and switching fabric.

Use Value: 2.5-cycle latency and 1100 MT/s bandwidth support full-duplex 10 GbE frame buffering without pipeline stalls.

Use Scenario: Providing scratchpad memory for real-time DSP algorithms running on Xilinx or Intel FPGAs.

IC Role / Device Role / Timing Role: Synchronous DDR II+ memory interfaced directly to FPGA's hardened memory controller IP.

Use Value: Echo clocks (CQ/CQ) and QVLD eliminate custom timing closure effort, accelerating FPGA memory interface development.

Telecom Baseband Processing Industrial Real-Time Control Buffer

Use Scenario: Holding intermediate FFT/IFFT results in 4G/5G baseband processing units.

IC Role / Device Role / Timing Role: Burst-capable SRAM synchronized to FPGA or ASIC baseband processor clocks.

Use Value: Two-word burst reduces address bus activity and power consumption during repetitive coefficient access patterns.

Use Scenario: Capturing sensor fusion data streams from multiple ADCs in motion-control PLCs.

IC Role / Device Role / Timing Role: Deterministic-latency memory for time-critical data aggregation prior to CPU processing.

Use Value: Fixed 2.5-cycle latency enables guaranteed worst-case response timing in safety-critical control loops.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
AS7C3256B-15JIN Asynchronous 256K × 16 SRAM, no DDR interface, 15 ns access, 3.3 V only Lacks burst, echo clocks, QVLD, and PLL - requires external timing control and wider bus for same bandwidth Select only if system lacks DDR clock infrastructure and bandwidth demand ≤ 66 MHz sustained
IS61WV102418BLL-10BLI Synchronous 1M × 18 SRAM, single-data-rate, 10 ns cycle time, 3.3 V/2.5 V, no echo clocks or QVLD No DDR timing, no burst, no impedance calibration - simpler interface but half the effective throughput at same clock rate Choose when design prioritizes simplicity over bandwidth density and can tolerate higher controller complexity for burst emulation

Compared with AS7C3256B-15JIN and IS61WV102418BLL-10BLI, CY7C1168KV18 delivers 2× data rate via DDR, eliminates external timing margining with QVLD/CQ, and enables scalable depth expansion without wait states - critical for 10 GbE and FPGA-accelerated systems.

Availability

CY7C1168KV18 is available at Aetrix Electronics and suitable for network packet buffering, FPGA co-processor memory, and telecom baseband processing requiring stable component supply across extended product lifecycles.

Supply support for CY7C1168KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for automotive, industrial, and communications markets, with focus on signal integrity and timing-critical applications.

CY7C1168KV18 belongs to the QDR II+/DDR II+ SRAM product line, engineered specifically for deterministic, high-bandwidth memory interfacing in FPGA-based and ASIC-based networking and signal processing systems.

FAQ

What is the function of the DOFF pin?

The DOFF pin controls internal PLL operation: when asserted HIGH (via pull-up), the device operates in DDR II+ mode with 2.5-cycle read latency at up to 550 MHz; when pulled LOW, the PLL is disabled and the device reverts to DDR I mode with 1-cycle latency and maximum 167 MHz operation. This allows backward compatibility and reduced timing complexity in legacy designs.

How does ZQ calibration affect signal integrity?

ZQ calibration adjusts the output driver impedance of DQ, CQ, and CQ pins to match the system's data bus characteristic impedance. By connecting an external resistor (RQ) from ZQ to ground, the device sets its output impedance to 0.2 × RQ - typically 25 Ω or 34 Ω - minimizing reflections, improving eye diagram margins, and ensuring reliable 1100 MT/s operation on controlled-impedance PCBs.

Can CY7C1168KV18 be used in depth-expanded configurations?

Yes - the device supports seamless depth expansion using LD and R/W signals across multiple chips. When one device completes a read, its outputs are automatically tristated on the next K rising edge, allowing immediate access to the next device without wait states. The QVLD signal remains synchronized across devices when echo clocks are shared, preserving timing determinism.

What is the role of the BWS pins in write operations?

BWS[1:0] are active-LOW byte write select signals that gate write data to specific 9-bit segments of the 18-bit DQ bus: BWS0 enables DQ[8:0], BWS1 enables DQ[17:9]. During a write, only enabled bytes are updated; unselected bytes retain their prior values. This eliminates the need for read-modify-write cycles when updating partial words, reducing bus traffic and latency.

CY7C1168KV18-550BZXC Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, DDR II+
Memory Size:
18Mbit
Memory Organization:
1M x 18
Memory Interface:
Parallel
Clock Frequency:
550 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1168KV18-550BZXC FAQ

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The price and inventory of CY7C1168KV18-550BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1168KV18-550BZXC is usually 5 days.

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For technical support, including CY7C1168KV18-550BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1168KV18-550BZXC requirements.

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All CY7C1168KV18-550BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1168KV18-550BZXC meets industry standards.

7.What is the process for return or replacement of CY7C1168KV18-550BZXC?

All CY7C1168KV18-550BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1168KV18-550BZXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1168KV18-550BZXC part is unused and in its original packaging.

Return procedure for CY7C1168KV18-550BZXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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