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Cypress Semiconductor Corp CY7C1170KV18-450BZXC

Part No.:
CY7C1170KV18-450BZXC
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1170KV18-450BZXC.pdf
Description:
IC SRAM 18MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:390

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Product details

Overview

CY7C1170KV18-450BZXC from Cypress Semiconductor is a 18-Mbit (512K × 36) synchronous pipelined DDR II+ SRAM with 2.5-cycle read latency, 450 MHz clock operation, HSTL I/O interface, and integrated PLL for precise data placement. It delivers 900 MB/s peak bandwidth via double-data-rate transfers at 900 Mbps per data pin, used in high-speed packet buffering and network line-card memory subsystems.

For engineers reviewing the CY7C1170KV18-450BZXC datasheet, CY7C1170KV18-450BZXC pinout, CY7C1170KV18-450BZXC application, or CY7C1170KV18-450BZXC equivalent, key selection criteria include its 450 MHz maximum operating frequency, 512K × 36 organization, DOFF-controlled DDR I/DDR II+ mode switching, echo-clock–based data capture, and 165-ball FBGA (13 × 15 × 1.4 mm) package compatibility with high-density PCB layouts.

Technical Context

This SRAM implements a two-word burst architecture where each address access retrieves two consecutive 36-bit words on alternating K/K rising edges. Internal pipelining enables back-to-back read initiation every K cycle, with output timing tightly referenced to echo clocks CQ/CQ for deterministic data capture without board-level skew compensation.

The device integrates a PLL that locks to the K input clock to generate internal timing for 2.5-cycle latency operation; when DOFF is asserted LOW, the PLL disables and the device reverts to single-cycle DDR I timing up to 167 MHz. All synchronous inputs (A, R/W, LD, BWS[3:0]) are registered on K, while data I/O uses both K and K edges for DDR alignment.

Key Specifications

ParameterValue and Actual Design Meaning
Density & Organization18 Mbit (512K × 36), enabling compact 36-bit wide memory interfaces without external width expansion
Max Clock Frequency450 MHz - supports sustained 900 MB/s bandwidth with 36-bit bus width
Read Latency2.5 cycles (DOFF = HIGH) or 1 cycle (DOFF = LOW), allowing system-level timing flexibility
I/O VoltageVDDQ = 1.4 V to 1.8 V - compatible with both 1.5 V and 1.8 V HSTL-15/18 systems
Package165-ball FBGA (13 × 15 × 1.4 mm) - optimized for thermal dissipation and signal integrity in dense routing
Core SupplyVDD = 1.8 V ± 0.1 V - low-voltage core reduces dynamic power vs. 2.5 V SRAMs
Timing InterfaceDDR II+ with echo clocks CQ/CQ - eliminates need for separate DQS per device in multi-SRAM configurations

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant Pb-free option available.

Pin/TerminalCircuit RoleDesign Meaning
DQ[35:0]Synchronous bidirectional data I/O36-bit DDR data bus; sampled on K/K rising edges during writes, driven on K/K rising edges during reads with QVLD synchronization
K / KDifferential input clocksRising edges of both clocks control all synchronous operations; K drives address/control, both drive data
CQ / CQOutput echo clocksFree-running, phase-aligned copies of K/K used by system logic to latch DQ data without additional timing margin
QVLDValid data indicatorAsserted edge-aligned with CQ/CQ to signal valid DQ data - enables reliable capture without fixed delay assumptions
DOFFPLL enable/disable controlActive-LOW pin selecting DDR II+ (2.5-cycle latency, 450 MHz) or DDR I (1-cycle latency, ≤167 MHz) operation mode
BWS[3:0]Byte write select inputsFour independent active-LOW signals controlling 9-bit byte lanes across 36-bit bus - enables partial-word writes without read-modify-write
LDLoad strobeSynchronous address latch enable; defines start of burst transaction on rising edge of K
ZQImpedance calibration referenceConnects to external 240 Ω resistor to ground to calibrate output driver impedance to 48 Ω (0.2 × RQ)

Key Features

FeatureDesign Value
Two-word burst architectureReduces address bus toggling by 50% vs. single-word SRAMs - lowers EMI and simplifies controller address generation
Programmable 2.5/1-cycle read latencyDOFF pin allows runtime switching between high-performance DDR II+ and legacy DDR I timing - aids migration and interoperability
HSTL-compatible I/O with variable driveSupports 1.4 V to 1.8 V VDDQ and matches JEDEC HSTL Class I/II electrical specs - ensures signal integrity at 450 MHz
Integrated PLL with echo clocksEliminates need for external clock forwarding ICs - simplifies layout and reduces jitter accumulation in multi-device memory banks
JTAG 1149.1 test access portEnables boundary-scan testing and in-system diagnostics without dedicated test pads - improves manufacturing yield verification

Applications

Network Packet BufferingTelecom Line Card Memory

Use Scenario: Storing ingress/egress Ethernet frames in 10G/25G switch ASICs with strict latency budgets.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency shared memory buffer interfacing directly to SerDes MAC controllers.

Use Value: 450 MHz DDR II+ operation delivers 900 MB/s throughput on 36-bit bus, meeting line-rate buffering requirements without interleaving.

Use Scenario: Frame assembly/disassembly in carrier-grade SDH/SONET add-drop multiplexers.

IC Role / Device Role / Timing Role: Synchronous burst SRAM providing deterministic 2.5-cycle read response for time-critical TDM payload handling.

Use Value: Echo clocks CQ/CQ align data capture to system FPGA logic, removing setup/hold uncertainty in 100+ MHz designs.

High-Speed Test Equipment MemoryAvionics Data Acquisition Buffer

Use Scenario: Capturing real-time analog-to-digital samples at >500 MS/s in automated test systems.

IC Role / Device Role / Timing Role: Burst-access memory staging digitized waveform data before DMA transfer to host processor.

Use Value: DOFF-controlled DDR I fallback mode allows graceful degradation to 167 MHz operation if PLL lock fails - maintains basic functionality.

Use Scenario: Buffered sensor fusion data logging in flight control computers requiring radiation-tolerant storage.

IC Role / Device Role / Timing Role: Radiation-hardened-by-design SRAM with neutron soft error immunity used for critical telemetry buffering.

Use Value: 1.8 V core voltage and HSTL I/O reduce power density and EMI susceptibility in safety-critical avionics enclosures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IDT72T3652L10PF36-Mbit (1M × 36), 10 ns async access; no DDR, no PLL, no echo clocksUsed in legacy systems requiring simple address/data multiplexing and no clock synchronizationSelect only when DDR timing, burst efficiency, or system-level clock alignment are not required
ISSI IS61WV102432BLL-10BLI32-Mbit (1M × 32), 10 ns async CMOS SRAM; no DDR, no burst, no JTAGTargeted at cost-sensitive industrial controllers with moderate bandwidth needsChoose when lowest BOM cost outweighs bandwidth, latency, and testability requirements

Compared with IDT72T3652L10PF and IS61WV102432BLL-10BLI, CY7C1170KV18-450BZXC provides 2× higher effective bandwidth via DDR and eliminates board-level timing closure challenges through echo clocks and QVLD - critical for 450 MHz+ systems where asynchronous alternatives require complex wait-state management.

Availability

CY7C1170KV18-450BZXC is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, high-speed test equipment memory, and avionics data acquisition buffer applications requiring stable component supply, long-lifecycle support, and guaranteed traceable sourcing.

Supply support for CY7C1170KV18-450BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable solutions for industrial, automotive, and communications markets.

CY7C1170KV18 belongs to Cypress's DDR II+ SRAM product line, engineered specifically for deterministic, low-latency, high-bandwidth memory subsystems in networking and telecom infrastructure where traditional asynchronous or QDR SRAMs introduce timing complexity.

FAQ

What is the function of the DOFF pin on CY7C1170KV18-450BZXC?

The DOFF (DLL/PLL Off) pin is an active-LOW control that disables the internal PLL. When DOFF = LOW, the device operates in DDR I mode with 1-cycle read latency and maximum frequency limited to 167 MHz. When DOFF = HIGH, the PLL is enabled and the device runs in DDR II+ mode with 2.5-cycle latency at up to 450 MHz. This pin must be pulled up via ≤10 kΩ resistor for normal operation.

How does the ZQ pin affect output driver impedance?

The ZQ pin connects to an external 240 Ω resistor to ground to calibrate the output driver impedance to 48 Ω (0.2 × RQ). This ensures consistent signal integrity across process/voltage/temperature variations. If ZQ is tied directly to VDDQ, the device enters minimum-impedance mode (~30 Ω); it must never be left floating or connected to GND.

Can CY7C1170KV18-450BZXC operate with VDDQ = 1.5 V?

Yes. The device supports VDDQ from 1.4 V to 1.8 V, including 1.5 V nominal operation. At 1.5 V, HSTL-compatible output drive strength and input thresholds remain within JEDEC HSTL Class I specifications, and AC timing parameters (e.g., tAC, tHZ) are guaranteed per datasheet limits at 450 MHz.

What is the role of QVLD in system timing design?

QVLD is a synchronous output that asserts edge-aligned with CQ/CQ to indicate when DQ[35:0] data is valid. Unlike fixed-delay approaches, QVLD eliminates the need for static timing margins - system logic uses QVLD as a gating signal to sample DQ, enabling robust data capture even with PVT-induced clock/data skew in high-speed PCBs.

CY7C1170KV18-450BZXC Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, DDR II+
Memory Size:
18Mbit
Memory Organization:
512K x 36
Memory Interface:
Parallel
Clock Frequency:
450 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1170KV18-450BZXC FAQ

1.How can I place an order for CY7C1170KV18-450BZXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1170KV18-450BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1170KV18-450BZXC reliable?

The price and inventory of CY7C1170KV18-450BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1170KV18-450BZXC is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1170KV18-450BZXC transactions.

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4.How is shipping managed for CY7C1170KV18-450BZXC?

CY7C1170KV18-450BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1170KV18-450BZXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1170KV18-450BZXC?

For technical support, including CY7C1170KV18-450BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1170KV18-450BZXC requirements.

6.How does Aetrix verify that CY7C1170KV18-450BZXC is sourced from the original manufacturer or authorized distributors?

All CY7C1170KV18-450BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1170KV18-450BZXC meets industry standards.

7.What is the process for return or replacement of CY7C1170KV18-450BZXC?

All CY7C1170KV18-450BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1170KV18-450BZXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1170KV18-450BZXC part is unused and in its original packaging.

Return procedure for CY7C1170KV18-450BZXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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