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Cypress Semiconductor Corp CY7C1245KV18-400BZC

Part No.:
CY7C1245KV18-400BZC
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1245KV18-400BZC.pdf
Description:
IC SRAM 36MBIT PARALLEL 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,211

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Product details

Overview

CY7C1245KV18 from Cypress Semiconductor is a 1M × 36, 36-Mbit QDR® II+ SRAM with 2.0-cycle read latency, 400 MHz clock operation (800 Mbps DDR per port), 1.8 V core supply, and 1.4–1.8 V I/O supply. It features separate read/write ports, four-word burst transfers, echo clocks (CQ/CQ), and QVLD data-valid signaling - deployed in high-speed packet buffering for network line cards and telecom switching fabric.

For engineers reviewing the CY7C1245KV18 datasheet, CY7C1245KV18 pinout, CY7C1245KV18 application, or CY7C1245KV18 equivalent, key selection criteria include its 400 MHz synchronous timing, dual DDR interfaces, DOFF-configurable latency mode (QDR I vs. QDR II+), HSTL I/O compatibility, and 165-ball FBGA package footprint.

Technical Context

The CY7C1245KV18 implements a true dual-port architecture with physically independent read and write data paths - eliminating bus turnaround overhead. Its 2.0-cycle read latency is enforced when DOFF is HIGH, while asserting DOFF LOW reverts it to QDR I mode (1-cycle latency, ≤167 MHz). All address and control inputs are registered on K/K rising edges.

It uses an internal PLL for precise data placement and includes echo clocks (CQ/CQ) aligned to K/K for simplified high-speed capture. The device supports byte-write masking via BWS[3:0], depth expansion via RPS/WPS, and impedance tuning via ZQ pin tied to external resistor or VDDQ.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 36 Mbit (1M × 36 organization)
Max Clock Frequency 400 MHz - enables 800 MT/s DDR throughput per port
Read Latency 2.0 clock cycles - deterministic timing for pipeline-synchronized systems
Core Supply (VDD) 1.8 V ± 0.1 V - defines logic threshold and power consumption envelope
I/O Supply (VDDQ) 1.4 V to 1.8 V - supports HSTL-18 or HSTL-15 interface standards
Package 165-ball FBGA (13 × 15 × 1.4 mm) - standard footprint for high-density routing
Burst Length Four sequential 36-bit words per access - reduces address bus toggling frequency by 4×

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, 0.8 mm ball pitch.

Pin/Terminal Circuit Role Design Meaning
D[35:0] Write data input 36-bit synchronous input sampled on K/K rising edges during active WPS
Q[35:0] Read data output 36-bit DDR output driven on K/K rising edges; tri-stated when RPS inactive
RPS Read port select Active-LOW signal enabling read burst; controls Q[35:0] driver state
WPS Write port select Active-LOW signal initiating write burst; gates D[35:0] sampling
BWS[3:0] Byte write select Four active-LOW signals controlling 9-bit byte lanes (D[8:0] to D[35:27])
K / K Input clocks Differential clock pair - rising edges latch all synchronous inputs and drive outputs
CQ / CQ Echo clocks Free-running, phase-aligned copies of K/K - used for source-synchronous data capture
QVLD Data valid indicator Output pulse edge-aligned with CQ/CQ - signals validity of current Q[35:0] word
DOFF PLL disable Active-LOW pin forcing QDR I mode (1-cycle latency, max 167 MHz) when grounded
ZQ Impedance calibration Connects to external resistor to ground to tune output driver impedance to 0.2 × RQ

Key Features

Feature Design Value
Separate read/write ports Eliminates data bus turnaround delay and contention - enables concurrent full-bandwidth reads/writes
Four-word burst architecture Reduces effective address bus frequency by 75% - lowers routing complexity and EMI
DDR interfaces on both ports Delivers 800 MT/s per port at 400 MHz clock - doubles data rate without increasing clock frequency
Programmable latency via DOFF Supports both QDR II+ (2-cycle, 400 MHz) and legacy QDR I (1-cycle, ≤167 MHz) modes
HSTL-compatible I/O Ensures signal integrity at >400 MHz with matched drive strength and termination support

Applications

Network Packet Buffering Telecom Switch Fabric

Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in line-rate 10G/40G switch ASICs.

IC Role / Device Role / Timing Role: High-throughput, low-latency shared memory buffer between ingress and egress pipelines.

Use Value: Concurrent read/write capability allows simultaneous packet dequeue and enqueue without arbitration stalls.

Use Scenario: Interfacing with SerDes-based framer devices in OTN/DWDM transport equipment.

IC Role / Device Role / Timing Role: Synchronous burst memory for cell/packet reassembly and header processing.

Use Value: Four-word burst + echo clocks enable deterministic 400 MHz timing closure in FPGA-ASIC hybrid designs.

High-Speed Test Equipment Defense Radar Signal Processing

Use Scenario: Capturing real-time analog-to-digital samples in automated test systems with deep memory buffers.

IC Role / Device Role / Timing Role: Burst-access FIFO replacement for high-fidelity waveform storage.

Use Value: 2.0-cycle latency and QVLD signaling provide precise sample timestamp alignment across multiple channels.

Use Scenario: Storing intermediate FFT results and beamforming coefficients in phased-array radar processors.

IC Role / Device Role / Timing Role: Deterministic latency memory for pipelined DSP algorithms requiring strict timing predictability.

Use Value: DOFF-configurable mode allows fallback to QDR I timing during radiation-induced PLL upset events.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth burst SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72T36120L10BG 36-Mbit QDR II+ SRAM, 1M × 36, 10 ns access, 1.8 V core, but uses 1.5 V only I/O (no 1.4 V support) Lacks DOFF-configurable latency mode - fixed 2-cycle latency only Preferred where system-level timing margin permits fixed latency and 1.5 V I/O is standardized
ISSI IS61WV102436B 1M × 36 QDR II SRAM (not II+), 333 MHz max, no PLL, no echo clocks, no QVLD Lower bandwidth (666 MT/s), no source-synchronous capture aids - requires tighter PCB layout control Selected for cost-sensitive designs where 400 MHz operation and jitter-tolerant capture are not required

Compared with IDT72T36120L10BG and IS61WV102436B, the CY7C1245KV18 uniquely supports 1.4 V I/O operation, configurable latency via DOFF, and integrated echo clocks - making it optimal for next-generation telecom and defense systems demanding flexible timing and robust high-speed signaling.

Availability

CY7C1245KV18 is available at Aetrix Electronics and suitable for network packet buffering, telecom switch fabric, high-speed test equipment, and defense radar signal processing requiring stable component supply and long-term obsolescence management.

Supply support for CY7C1245KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable solutions for industrial, automotive, and communications markets.

The CY7C1245KV18 belongs to Cypress's QDR® II+ SRAM product line, engineered specifically for deterministic, low-latency, concurrent-access memory in high-speed networking and signal processing systems.

FAQ

What is the function of the DOFF pin on CY7C1245KV18?

The DOFF (PLL Disable) pin is an active-LOW input that disables the internal PLL. When pulled LOW, the device operates in QDR I mode with 1-cycle read latency and maximum clock frequency of 167 MHz. When HIGH (via pull-up), it enables QDR II+ mode with 2-cycle latency and up to 400 MHz operation. This provides hardware-selectable timing flexibility for system-level optimization.

How does the ZQ pin affect output driver performance?

The ZQ pin connects to an external resistor to ground to calibrate output driver impedance. It sets CQ, CQ, and Q[35:0] output impedance to 0.2 × RQ, matching typical 50 Ω transmission lines. If tied directly to VDDQ, it enables minimum impedance mode (≈25 Ω). ZQ must never be left floating or tied to GND, as this disables calibration and risks signal integrity failure.

Can CY7C1245KV18 perform simultaneous read and write operations?

Yes - the CY7C1245KV18 has fully independent read and write ports with separate data buses, clocks, and control signals (RPS/WPS). A read burst on Q[35:0] and a write burst on D[35:0] can occur concurrently on the same clock cycle, delivering true 1.6 GB/s aggregate bandwidth (800 MT/s per port) without arbitration or bus turnaround delays.

What is the role of QVLD in system timing design?

QVLD is a synchronous output that pulses high for one K/K cycle precisely when valid data appears on Q[35:0]. It is edge-aligned with CQ/CQ, enabling reliable source-synchronous capture in FPGA or ASIC receivers. Unlike asynchronous ready signals, QVLD eliminates setup/hold uncertainty and simplifies timing closure in 400 MHz DDR interfaces.

CY7C1245KV18-400BZC Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II+
Memory Size:
36Mbit
Memory Organization:
1M x 36
Memory Interface:
Parallel
Clock Frequency:
400 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1245KV18-400BZC FAQ

1.How can I place an order for CY7C1245KV18-400BZC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1245KV18-400BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1245KV18-400BZC reliable?

The price and inventory of CY7C1245KV18-400BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1245KV18-400BZC is usually 5 days.

3.What payment methods are accepted for CY7C1245KV18-400BZC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1245KV18-400BZC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1245KV18-400BZC?

CY7C1245KV18-400BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1245KV18-400BZC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1245KV18-400BZC?

For technical support, including CY7C1245KV18-400BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1245KV18-400BZC requirements.

6.How does Aetrix verify that CY7C1245KV18-400BZC is sourced from the original manufacturer or authorized distributors?

All CY7C1245KV18-400BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1245KV18-400BZC meets industry standards.

7.What is the process for return or replacement of CY7C1245KV18-400BZC?

All CY7C1245KV18-400BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1245KV18-400BZC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1245KV18-400BZC part is unused and in its original packaging.

Return procedure for CY7C1245KV18-400BZC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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