Cypress Semiconductor Corp CY7C1262XV18-366BZXC

Overview

CY7C1262XV18-366BZXC from Infineon Technologies (formerly Cypress) is a 36-Mbit QDR® II+ Xtreme SRAM with 2 M × 18 organization, 2.5-cycle read latency, and dual DDR interfaces operating at 450 MHz clock (900 Mbps data rate). It features separate read/write ports, echo clocks (CQ/CQ), QVLD data-valid indicator, and PLL-based timing alignment. Used in high-bandwidth networking line cards for packet buffering and header processing.

For engineers reviewing the CY7C1262XV18-366BZXC datasheet, CY7C1262XV18-366BZXC pinout, CY7C1262XV18-366BZXC application, or CY7C1262XV18-366BZXC equivalent, key selection criteria include 2.5-cycle latency mode, HSTL I/O compatibility, 165-ball FBGA package, DOFF-controlled PLL enable/disable, and concurrent read/write transaction support.

Technical Context

This SRAM implements QDR II+ Xtreme architecture with fully independent synchronous read and write ports sharing a single multiplexed address bus. Address latching occurs on alternating rising edges of K and K clocks, enabling two-word burst transfers per access cycle without bus turnaround.

The integrated PLL aligns output timing to input clocks, while echo clocks CQ and CQ provide source-synchronous capture aids for high-speed systems. DOFF pin selects between 2.5-cycle (PLL enabled) and 1-cycle (PLL disabled, QDR-I mode) read latency, with corresponding max frequency limits of 450 MHz and 167 MHz.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, Pb-free.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Compared with CY7C1262XV18-333BZXC, the -366BZXC delivers +117 MHz clock headroom and tighter jitter control; versus AS7C336200B-166BIN, it enables true concurrent DDR operation with deterministic latency-critical for modern packet-processing pipelines.

Availability

CY7C1262XV18-366BZXC is available at Aetrix Electronics and suitable for high-speed networking equipment, telecom infrastructure hardware, and automated test equipment requiring stable component supply and long-term lifecycle support.

Supply support for CY7C1262XV18-366BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and now owns and supports the QDR® II+ Xtreme SRAM portfolio, maintaining full technical documentation, manufacturing continuity, and long-term product availability.

This device belongs to Infineon's high-performance memory product line, designed specifically for deterministic, low-latency, concurrent-access applications in networking, telecommunications, and test instrumentation where DDR bandwidth and precise timing alignment are essential.

FAQ

What is the function of the DOFF pin?

The DOFF pin controls the internal PLL: when pulled HIGH (via 10 kΩ pull-up), the PLL is active, enabling 2.5-cycle read latency and 450 MHz operation. When pulled LOW, the PLL is disabled, reverting the device to QDR-I timing with 1-cycle latency and a maximum frequency of 167 MHz. This dual-mode capability allows backward compatibility and flexible system-level timing design.

How does the CY7C1262XV18-366BZXC handle byte-level writes?

It uses two active-low byte write select signals: BWS0 controls D[8:0], and BWS1 controls D[17:9]. During a write cycle, only bytes corresponding to asserted BWS pins are updated; unselected bytes retain their prior values. This eliminates the need for read-modify-write sequences and preserves data integrity in partial-word update scenarios common in packet header manipulation.

What role do CQ and CQ serve in system timing?

CQ and CQ are free-running echo clocks synchronized to K and K, respectively. They provide source-synchronous timing references for capturing Q[17:0] output data, relaxing board-level skew constraints. Their edge alignment with QVLD ensures unambiguous identification of valid data windows, directly supporting reliable >400 MHz DDR interface implementation without complex deskew circuitry.

Is the 165-ball FBGA package compatible with standard reflow profiles?

Yes - the package complies with IPC/JEDEC J-STD-020 moisture sensitivity level 3 and supports standard lead-free reflow profiles (peak temperature ≤260°C). Its 0.8 mm ball pitch and 13 × 15 mm footprint are compatible with mainstream HDI PCB stackups; thermal resistance (θ_JA) is 28°C/W, requiring minimal heatsinking under typical 1.2 A operating current conditions.