Cypress Semiconductor Corp CY7C1263KV18-400BZI
- Part No.:
- CY7C1263KV18-400BZI
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1263KV18-400BZI.pdf
- Description:
- IC SRAM 36MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:331
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Product details
Overview
CY7C1263KV18 from Cypress Semiconductor is a 2M × 18, 36-Mbit QDR® II+ SRAM with separate read/write ports, 400 MHz maximum clock frequency (2.5-cycle read latency), 1.8 V core supply, and 1.4–1.8 V I/O supply. It delivers 1100 MT/s DDR data throughput on both ports and is packaged in a 165-ball FBGA (13 × 15 × 1.4 mm) for high-speed networking buffer applications.
For engineers reviewing the CY7C1263KV18 datasheet, CY7C1263KV18 pinout, CY7C1263KV18 application, or CY7C1263KV18 equivalent, key selection criteria include concurrent read/write bandwidth, echo clock timing support (CQ/CQ), QVLD data validity signaling, DOFF-controlled PLL mode selection, and HSTL-compatible 18-bit bidirectional data interface.
Technical Context
The CY7C1263KV18 implements a synchronous pipelined architecture with independent K and K input clocks driving separate read and write pipelines. All address and control inputs are registered on rising edges of K/K, while data outputs are edge-aligned to CQ/CQ echo clocks for precise capture in high-speed systems.
It supports four-word burst transfers per access, delivering 72 bits (4 × 18) per read or write cycle. With DOFF HIGH, it operates in QDR II+ mode at 2.5-cycle read latency; with DOFF LOW, it reverts to QDR I mode (1-cycle latency, ≤167 MHz). The integrated PLL enables accurate data placement and jitter reduction.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 36 Mbit (2M × 18 organization) |
| Max Clock Frequency | 400 MHz - determines maximum sustained bandwidth of 14.4 GB/s (2 × 18-bit × 400 MHz × 2) |
| Read Latency | 2.5 cycles (DOFF = HIGH) - defines minimum time from address latch to first valid Q[x] output |
| Core Supply (VDD) | 1.8 V ± 0.1 V - powers internal logic and array; strict regulation required for timing stability |
| I/O Supply (VDDQ) | 1.4 V to 1.8 V - supports dual-voltage HSTL I/O, enabling interoperability with 1.5 V or 1.8 V system buses |
| Data Interface | DDR on both ports - transfers data on every rising edge of K and K, eliminating bus turnaround overhead |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - provides low-inductance interconnect and thermal performance for >400 MHz operation |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[17:0] | Write data input bus | 18-bit synchronous input sampled on rising edges of K/K; supports byte-write via BWS0/BWS1 |
| Q[17:0] | Read data output bus | 18-bit synchronous output edge-aligned to CQ/CQ; tristated when RPS is deasserted |
| K / K | Dual-phase input clocks | Rising edges drive all synchronous inputs; K controls read port, K controls write port |
| CQ / CQ | Output echo clocks | Free-running, phase-matched copies of K/K for simplified high-speed data capture at receiver |
| QVLD | Valid data indicator | Asserted synchronously with CQ/CQ to signal presence of valid Q[17:0] data on current clock edge |
| DOFF | PLL disable control | Active-LOW input that disables internal PLL; forces QDR I timing mode (1-cycle latency, ≤167 MHz) |
| ZQ | Impedance calibration reference | Connects to external resistor to ground to calibrate output driver impedance to 0.2 × RQ |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write ports | Enables true concurrent transactions without bus turnaround, eliminating contention and simplifying controller design |
| Four-word burst architecture | Reduces effective address bus frequency by 4× - only one address needed per 72-bit transfer |
| Integrated PLL with echo clocks | Provides deterministic data-to-clock alignment (CQ/QVLD/Q[x]) for reliable >800 Mbps DDR capture |
| HSTL I/O with programmable drive | Supports 1.4–1.8 V VDDQ and variable-strength drivers for impedance matching across PCB trace variations |
| JTAG 1149.1 test access port | Enables boundary scan testing and in-system programming without requiring additional debug hardware |
Applications
| Network Packet Buffer | High-Speed Test Equipment Memory |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet/SONET frames in line-rate packet switches. IC Role / Device Role / Timing Role: Dual-port buffer providing simultaneous ingress write and egress read at 400 MHz, synchronized via CQ/CQ for deterministic latency. Use Value: Eliminates FIFO arbitration overhead and guarantees zero-data-loss buffering under full-line-rate traffic bursts. |
Use Scenario: Capturing multi-channel digital waveforms at >1 GSPS in automated test equipment. IC Role / Device Role / Timing Role: High-bandwidth acquisition memory interfacing directly to FPGA-based pattern generators and comparators. Use Value: 1100 MT/s DDR throughput enables real-time streaming without DMA bottlenecks or external buffering. |
| Baseband Signal Processor Cache | PCIe Switch Lookaside Buffer |
|
Use Scenario: Temporary storage of FFT/IFFT intermediate results in LTE/5G baseband processing units. IC Role / Device Role / Timing Role: Low-latency scratchpad memory accessed concurrently by multiple DSP cores via dedicated read/write ports. Use Value: 2.5-cycle read latency and burst capability reduce pipeline stalls, improving MAC-layer throughput by ≥18% vs. single-port SRAM. |
Use Scenario: Staging packets between PCIe root complex and endpoint devices in enterprise switch ASICs. IC Role / Device Role / Timing Role: Shared buffer supporting simultaneous upstream/downstream traffic with guaranteed QoS scheduling. Use Value: Full data coherency ensures most recent writes are always visible on reads, preventing stale packet forwarding errors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T3615L10BG | 36-Mbit QDR II, 10 ns access, no PLL, max 333 MHz, 2.5 V core | Lacks echo clocks and QVLD; requires external timing margining for >400 Mbps capture | Select when legacy 2.5 V systems or simpler timing closure outweighs need for 400 MHz+ bandwidth |
| ISSI IS61WV102418B | 18-Mbit sync SRAM, single port, 150 MHz, 3.3 V/2.5 V/1.8 V, no DDR | No concurrent read/write; half the density; no burst or echo clock support | Only suitable for cost-sensitive, lower-bandwidth control-plane buffers where latency < 10 ns is acceptable |
Compared with IDT72T3615L10BG and IS61WV102418B, CY7C1263KV18 uniquely delivers 400 MHz DDR operation with integrated PLL, echo clocks, and QVLD-enabling deterministic sub-nanosecond timing closure in 10G+ networking and test systems where concurrent bandwidth and data validity assurance are mandatory.
Availability
CY7C1263KV18 is available at Aetrix Electronics and suitable for high-speed networking equipment, automated test instrumentation, wireless baseband processors, and PCIe infrastructure requiring stable component supply and long-term obsolescence management.
Supply support for CY7C1263KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for demanding embedded and communications applications.
The QDR® II+ SRAM product line targets ultra-low-latency, high-throughput buffering in networking, test, and signal processing systems where deterministic timing and concurrent access are critical.
FAQ
What is the function of the DOFF pin on CY7C1263KV18?
The DOFF (PLL Disable) pin is an active-LOW control that disables the internal phase-locked loop. When pulled LOW, the device operates in QDR I mode with 1-cycle read latency and a maximum frequency of 167 MHz. When held HIGH (typically via 10 kΩ pull-up), it enables full QDR II+ operation at up to 400 MHz with 2.5-cycle latency and echo clock functionality.
How does the ZQ pin affect output driver impedance?
The ZQ pin connects to an external resistor (RQ) tied to ground, enabling on-die impedance calibration. The device sets its CQ, CQ, and Q[17:0] output driver impedance to 0.2 × RQ. If ZQ is tied directly to VDDQ, the device enters minimum-impedance mode. ZQ must never be left floating or connected to GND, as this disables calibration and risks signal integrity failure.
Can CY7C1263KV18 support byte-level writes?
Yes. The device supports byte-selective writes using BWS0 and BWS1 pins. BWS0 controls D[8:0], and BWS1 controls D[17:9]. Both are active-LOW synchronous inputs sampled on K/K rising edges. When a BWS signal is deasserted, the corresponding 9-bit byte is ignored during the write cycle, preserving prior data in those bits.
What timing role do CQ and CQ serve in system design?
CQ and CQ are free-running echo clocks synchronized to K and K, respectively. They provide a clean, low-jitter reference aligned to Q[17:0] output transitions and QVLD assertion. System receivers use CQ/CQ-not K/K-to clock data capture registers, eliminating setup/hold violations caused by clock skew and PCB trace mismatch in >400 MHz designs.
CY7C1263KV18-400BZI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II+
- Memory Size:
- 36Mbit
- Memory Organization:
- 2M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 400 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1263KV18-400BZI FAQ
1.How can I place an order for CY7C1263KV18-400BZI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1263KV18-400BZI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1263KV18-400BZI reliable?
The price and inventory of CY7C1263KV18-400BZI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1263KV18-400BZI is usually 5 days.
3.What payment methods are accepted for CY7C1263KV18-400BZI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1263KV18-400BZI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1263KV18-400BZI?
CY7C1263KV18-400BZI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1263KV18-400BZI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1263KV18-400BZI?
For technical support, including CY7C1263KV18-400BZI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1263KV18-400BZI requirements.
6.How does Aetrix verify that CY7C1263KV18-400BZI is sourced from the original manufacturer or authorized distributors?
All CY7C1263KV18-400BZI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1263KV18-400BZI meets industry standards.
7.What is the process for return or replacement of CY7C1263KV18-400BZI?
All CY7C1263KV18-400BZI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1263KV18-400BZI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1263KV18-400BZI part is unused and in its original packaging.
Return procedure for CY7C1263KV18-400BZI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1263KV18-400BZI Tags

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