Cypress Semiconductor Corp CY7C1263XV18-633BZXC

Overview

CY7C1263XV18 from Infineon Technologies (formerly Cypress) is a 36-Mbit QDR® II+ Xtreme SRAM with 2 M × 18 organization, 633 MHz clock support, 2.5-cycle read latency, and separate read/write DDR ports enabling concurrent high-bandwidth memory access in networking packet buffers and FPGA co-processor interfaces.

For engineers reviewing the CY7C1263XV18 datasheet, CY7C1263XV18 pinout, CY7C1263XV18 application, or CY7C1263XV18 equivalent, key selection criteria include its 1266 MT/s DDR data rate, HSTL I/O compatibility, 165-ball FBGA package, DOFF-controlled PLL mode switching, and depth expansion via RPS/WPS port selects.

Technical Context

This SRAM implements a true dual-port synchronous architecture with independent read and write data paths-no bus turnaround required. It uses two input clocks (K and K) for precise DDR timing, with all inputs sampled on rising edges and outputs edge-aligned to echo clocks CQ/CQ.

The device integrates a programmable PLL for accurate data placement and supports two operational modes: QDR II+ mode (2.5-cycle latency, up to 633 MHz) when DOFF is HIGH, and QDR I mode (1-cycle latency, ≤167 MHz) when DOFF is LOW. Core VDD = 1.8 V ± 0.1 V; I/O VDDQ = 1.4–1.6 V.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body height, RoHS-compliant Pb-free construction.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Compared with CY7C1263XV18-553BZXC, the -633BZXC delivers +14% bandwidth and tighter timing margins; versus AS7C33618B-15PCCN, it provides deterministic 2.5-cycle latency, concurrent access, and scalable DDR I/O-but requires full QDR timing design discipline.

Availability

CY7C1263XV18 is available at Aetrix Electronics and suitable for high-speed network switch buffers, FPGA-based protocol accelerators, and telecom baseband processing requiring stable component supply, long-term lifecycle support, and guaranteed Pb-free compliance.

Supply support for CY7C1263XV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and now owns and supports the QDR® II+ Xtreme SRAM product line, maintaining full technical documentation, manufacturing continuity, and customer service.

This device belongs to Infineon's high-performance memory portfolio, designed specifically for deterministic, low-latency, high-throughput data buffering in wired communications infrastructure and real-time signal processing systems.

FAQ

What is the function of the DOFF pin on CY7C1263XV18?

The DOFF (PLL Turn Off) pin is an active-low control that disables the internal PLL. When pulled LOW, the device reverts to QDR I timing with 1-cycle read latency and maximum frequency limited to 167 MHz. For full QDR II+ operation at 633 MHz, DOFF must be held HIGH via a ≤10 kΩ pull-up resistor to VDDQ.

Can CY7C1263XV18 interface directly with a 1.5 V HSTL system?

Yes. The device supports VDDQ = 1.4–1.6 V, making it fully compatible with 1.5 V HSTL-18 I/O standards. Its variable-drive HSTL output buffers and ZQ pin for impedance calibration ensure robust signal integrity in 1.5 V environments without level-shifting circuitry.

How does depth expansion work with RPS and WPS pins?

Depth expansion is achieved by cascading multiple CY7C1263XV18 devices using independent RPS (Read Port Select) and WPS (Write Port Select) signals. Each device responds only when its respective RPS or WPS is asserted, allowing independent read/write access across banks while sharing the same address and data buses.

Is the 165-ball FBGA package lead-free and RoHS compliant?

Yes. The CY7C1263XV18-633BZXC is supplied in a Pb-free, RoHS-compliant 165-ball FBGA package (package code BZXC), with matte tin surface finish and JEDEC-standard moisture sensitivity level (MSL) 3 rating per J-STD-020.