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Cypress Semiconductor Corp CY7C1264XV18-450BZXC

Part No.:
CY7C1264XV18-450BZXC
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1264XV18-450BZXC.pdf
Description:
IC SRAM 36MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:253

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Product details

Overview

CY7C1264XV18 from Infineon Technologies (formerly Cypress) is a 1 M × 36, 36-Mbit QDR® II+ Xtreme SRAM with dual independent read/write ports, 450 MHz clock operation (900 Mbps DDR data rate), 2.5-cycle read latency, and HSTL I/Os supporting 1.5 V supply. It delivers concurrent high-bandwidth memory access for network packet buffering in 10G/40G line cards.

For engineers reviewing the CY7C1264XV18 datasheet, CY7C1264XV18 pinout, CY7C1264XV18 application, or CY7C1264XV18 equivalent, key selection criteria include its 2.5-cycle latency mode, echo-clock–assisted timing closure, DOFF-configurable PLL bypass, and x36 burst interface for deterministic throughput in telecom control-plane buffers.

Technical Context

This SRAM implements QDR II+ Xtreme architecture with physically separate read and write data paths-eliminating bus turnaround overhead. Its dual DDR interfaces operate on rising edges of complementary K/K clocks, enabling full-duplex 900 Mbps transfers per port at 450 MHz.

The integrated PLL ensures precise data placement relative to echo clocks CQ/CQ, while DOFF pin allows dynamic switching between 2.5-cycle (PLL enabled) and 1-cycle (PLL disabled, QDR-I mode) latency-supporting both high-speed and legacy timing compliance within one footprint.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density36 Mbit (1 M × 36 organization)
Max Clock Frequency450 MHz - enables 900 Mbps DDR bandwidth per port
Read Latency2.5 cycles (DOFF = HIGH) - deterministic timing for pipeline-aligned systems
I/O VoltageVDDQ = 1.4–1.6 V - compatible with 1.5 V HSTL-18 signaling
Core SupplyVDD = 1.8 V ± 0.1 V - low-power, noise-immune core operation
Package165-ball FBGA (13 × 15 × 1.4 mm) - standard footprint for high-density routing
Interface TypeQDR II+ Xtreme - synchronous, pipelined, burst-2, no bus turnaround required

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant Pb-free finish.

Pin/TerminalCircuit RoleDesign Meaning
D[35:0]Synchronous write data inputsLatched on rising edges of K/K; supports full 36-bit parallel writes
Q[35:0]Synchronous read data outputsDriven on rising edges of K/K; tristated when RPS is deasserted
RPS / WPSPort select controlsActive-low enables independent read/write port activation
BWS[3:0]Byte write selectsFour independent active-low signals controlling 9-bit byte lanes in x36 mode
K / KDual input clocksComplementary clocks for DDR timing; only rising edges used for sampling
CQ / CQEcho clocksFree-running, phase-aligned copies of K/K for simplified high-speed capture
QVLDData validity indicatorEdge-aligned with CQ/CQ; asserts exactly when Q[35:0] carries valid burst data
DOFFPLL disable controlActive-low disables internal PLL to switch to QDR-I timing (≤167 MHz, 1-cycle latency)
ZQImpedance calibration inputConnects to external resistor to ground to tune output driver impedance to system bus

Key Features

FeatureDesign Value
Two-word burst architectureReduces address bus frequency by 2× versus single-word access - cuts routing congestion and timing margin pressure
Separate read/write data portsEnables true concurrent read-write operations without arbitration delay - critical for full-duplex packet buffering
Integrated PLL with echo clocksEliminates need for external clock forwarding ICs - simplifies PCB layout and improves skew control at 450 MHz
Programmable output impedance (ZQ)Allows dynamic matching to trace impedance - reduces signal reflections and improves eye diagram integrity
DOFF-selectable latency modeSingle hardware pin switches between 2.5-cycle (high-speed) and 1-cycle (legacy-compatible) operation - enables design reuse

Applications

10G/40G Ethernet Line CardsNetwork Processor Buffers

Use Scenario: Storing and forwarding variable-length packets in multi-gigabit line interface units.

IC Role / Device Role / Timing Role: High-throughput, low-latency shared buffer between MAC and switch fabric, synchronized to 450 MHz system clock.

Use Value: Concurrent read/write eliminates arbitration stalls, enabling sustained 900 Mbps throughput per port for full-duplex traffic.

Use Scenario: Temporary storage of packet headers and metadata during deep packet inspection.

IC Role / Device Role / Timing Role: Burst-access scratchpad memory for NPU microengines, interfaced via HSTL-18 buses.

Use Value: 2.5-cycle latency and echo-clock alignment ensure deterministic timing closure in 10 ns cycle budgets.

Telecom Control-Plane MemoryHigh-Speed Test Equipment FIFOs

Use Scenario: Buffering configuration updates and status reports between management CPU and line cards.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as handshake-free message queue with guaranteed coherency.

Use Value: Full data coherency and synchronous self-timed writes prevent stale reads during rapid update sequences.

Use Scenario: Real-time acquisition buffer in digital pattern generators and logic analyzers.

IC Role / Device Role / Timing Role: High-bandwidth capture memory synchronized to 450 MHz sample clock with minimal jitter.

Use Value: ZQ-calibrated outputs and CQ-aligned QVLD enable reliable data capture at 900 Msps with <100 ps setup/hold margin.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
AS7C33618B-450BIN450 MHz, x36, 36-Mbit QDR II+, no PLL, fixed 2-cycle latencyLacks DOFF-configurable latency modes and echo clocks - requires external timing compensationChoose for cost-sensitive designs where 2-cycle latency suffices and board-level clock forwarding is acceptable
IS61WV102436BLL-450TQI450 MHz, x36, 36-Mbit QDR II+, no ZQ calibration, 1.8 V only I/ORequires 1.8 V VDDQ - incompatible with 1.5 V HSTL-18 systems; no impedance tuning capabilityChoose only if system uses 1.8 V I/O rails and can tolerate higher signal integrity risk on long traces

Compared with AS7C33618B-450BIN and IS61WV102436BLL-450TQI, CY7C1264XV18 uniquely combines PLL-based timing precision, echo-clock support, ZQ impedance tuning, and DOFF-switchable latency - making it the only option qualified for 450 MHz operation in 1.5 V HSTL-18 telecom infrastructure with strict jitter and skew requirements.

Availability

CY7C1264XV18 is available at Aetrix Electronics and suitable for 10G/40G Ethernet line cards, network processor buffers, telecom control-plane memory, and high-speed test equipment requiring stable component supply across extended product lifecycles.

Supply support for CY7C1264XV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains full product continuity, technical support, and long-term supply commitment for the QDR SRAM portfolio.

This device belongs to the QDR® II+ Xtreme SRAM product line, engineered specifically for deterministic, high-bandwidth memory access in telecom infrastructure, network processors, and test instrumentation where bus turnaround overhead and timing uncertainty must be eliminated.

FAQ

What is the function of the DOFF pin on CY7C1264XV18?

The DOFF (PLL Turn Off) pin is an active-low control that disables the internal PLL. When asserted LOW, the device operates in QDR-I mode with 1-cycle read latency and maximum frequency reduced to 167 MHz. This provides backward compatibility with legacy timing constraints while retaining the same pinout and basic functionality.

How does the ZQ pin affect signal integrity?

The ZQ pin connects to an external resistor to ground to calibrate the output driver impedance of Q[35:0], CQ, and CQ pins to 0.2 × RQ. This matches the SRAM's output impedance to the PCB trace impedance, minimizing reflections and improving eye diagram margins-especially critical at 450 MHz DDR operation.

Can CY7C1264XV18 be used in depth-expanded configurations?

Yes. The device supports depth expansion using RPS and WPS signals to enable independent read/write port selection across multiple devices. Each chip responds only when its respective port select is asserted, allowing seamless extension of memory depth without external logic or address decoding complexity.

What is the role of CQ and CQ echo clocks?

CQ and CQ are free-running, phase-aligned copies of the K and K input clocks, respectively. They are provided to simplify high-speed data capture by giving the receiving logic a locally synchronized clock reference-reducing skew sensitivity and eliminating the need for complex deskew circuitry in FPGA or ASIC interfaces.

CY7C1264XV18-450BZXC Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II+
Memory Size:
36Mbit
Memory Organization:
1M x 36
Memory Interface:
Parallel
Clock Frequency:
450 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1264XV18-450BZXC FAQ

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Please submit a Request for Quotation (RFQ) for CY7C1264XV18-450BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of CY7C1264XV18-450BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1264XV18-450BZXC is usually 5 days.

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CY7C1264XV18-450BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

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5.How can I obtain technical support or documentation for CY7C1264XV18-450BZXC?

For technical support, including CY7C1264XV18-450BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1264XV18-450BZXC requirements.

6.How does Aetrix verify that CY7C1264XV18-450BZXC is sourced from the original manufacturer or authorized distributors?

All CY7C1264XV18-450BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1264XV18-450BZXC meets industry standards.

7.What is the process for return or replacement of CY7C1264XV18-450BZXC?

All CY7C1264XV18-450BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1264XV18-450BZXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1264XV18-450BZXC part is unused and in its original packaging.

Return procedure for CY7C1264XV18-450BZXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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