Cypress Semiconductor Corp CY7C1264XV18-450BZXC
- Part No.:
- CY7C1264XV18-450BZXC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1264XV18-450BZXC.pdf
- Description:
- IC SRAM 36MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:253
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1264XV18 from Infineon Technologies (formerly Cypress) is a 1 M × 36, 36-Mbit QDR® II+ Xtreme SRAM with dual independent read/write ports, 450 MHz clock operation (900 Mbps DDR data rate), 2.5-cycle read latency, and HSTL I/Os supporting 1.5 V supply. It delivers concurrent high-bandwidth memory access for network packet buffering in 10G/40G line cards.
For engineers reviewing the CY7C1264XV18 datasheet, CY7C1264XV18 pinout, CY7C1264XV18 application, or CY7C1264XV18 equivalent, key selection criteria include its 2.5-cycle latency mode, echo-clock–assisted timing closure, DOFF-configurable PLL bypass, and x36 burst interface for deterministic throughput in telecom control-plane buffers.
Technical Context
This SRAM implements QDR II+ Xtreme architecture with physically separate read and write data paths-eliminating bus turnaround overhead. Its dual DDR interfaces operate on rising edges of complementary K/K clocks, enabling full-duplex 900 Mbps transfers per port at 450 MHz.
The integrated PLL ensures precise data placement relative to echo clocks CQ/CQ, while DOFF pin allows dynamic switching between 2.5-cycle (PLL enabled) and 1-cycle (PLL disabled, QDR-I mode) latency-supporting both high-speed and legacy timing compliance within one footprint.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 36 Mbit (1 M × 36 organization) |
| Max Clock Frequency | 450 MHz - enables 900 Mbps DDR bandwidth per port |
| Read Latency | 2.5 cycles (DOFF = HIGH) - deterministic timing for pipeline-aligned systems |
| I/O Voltage | VDDQ = 1.4–1.6 V - compatible with 1.5 V HSTL-18 signaling |
| Core Supply | VDD = 1.8 V ± 0.1 V - low-power, noise-immune core operation |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - standard footprint for high-density routing |
| Interface Type | QDR II+ Xtreme - synchronous, pipelined, burst-2, no bus turnaround required |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant Pb-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[35:0] | Synchronous write data inputs | Latched on rising edges of K/K; supports full 36-bit parallel writes |
| Q[35:0] | Synchronous read data outputs | Driven on rising edges of K/K; tristated when RPS is deasserted |
| RPS / WPS | Port select controls | Active-low enables independent read/write port activation |
| BWS[3:0] | Byte write selects | Four independent active-low signals controlling 9-bit byte lanes in x36 mode |
| K / K | Dual input clocks | Complementary clocks for DDR timing; only rising edges used for sampling |
| CQ / CQ | Echo clocks | Free-running, phase-aligned copies of K/K for simplified high-speed capture |
| QVLD | Data validity indicator | Edge-aligned with CQ/CQ; asserts exactly when Q[35:0] carries valid burst data |
| DOFF | PLL disable control | Active-low disables internal PLL to switch to QDR-I timing (≤167 MHz, 1-cycle latency) |
| ZQ | Impedance calibration input | Connects to external resistor to ground to tune output driver impedance to system bus |
Key Features
| Feature | Design Value |
|---|---|
| Two-word burst architecture | Reduces address bus frequency by 2× versus single-word access - cuts routing congestion and timing margin pressure |
| Separate read/write data ports | Enables true concurrent read-write operations without arbitration delay - critical for full-duplex packet buffering |
| Integrated PLL with echo clocks | Eliminates need for external clock forwarding ICs - simplifies PCB layout and improves skew control at 450 MHz |
| Programmable output impedance (ZQ) | Allows dynamic matching to trace impedance - reduces signal reflections and improves eye diagram integrity |
| DOFF-selectable latency mode | Single hardware pin switches between 2.5-cycle (high-speed) and 1-cycle (legacy-compatible) operation - enables design reuse |
Applications
| 10G/40G Ethernet Line Cards | Network Processor Buffers |
|---|---|
Use Scenario: Storing and forwarding variable-length packets in multi-gigabit line interface units. IC Role / Device Role / Timing Role: High-throughput, low-latency shared buffer between MAC and switch fabric, synchronized to 450 MHz system clock. Use Value: Concurrent read/write eliminates arbitration stalls, enabling sustained 900 Mbps throughput per port for full-duplex traffic. | Use Scenario: Temporary storage of packet headers and metadata during deep packet inspection. IC Role / Device Role / Timing Role: Burst-access scratchpad memory for NPU microengines, interfaced via HSTL-18 buses. Use Value: 2.5-cycle latency and echo-clock alignment ensure deterministic timing closure in 10 ns cycle budgets. |
| Telecom Control-Plane Memory | High-Speed Test Equipment FIFOs |
Use Scenario: Buffering configuration updates and status reports between management CPU and line cards. IC Role / Device Role / Timing Role: Dual-port SRAM acting as handshake-free message queue with guaranteed coherency. Use Value: Full data coherency and synchronous self-timed writes prevent stale reads during rapid update sequences. | Use Scenario: Real-time acquisition buffer in digital pattern generators and logic analyzers. IC Role / Device Role / Timing Role: High-bandwidth capture memory synchronized to 450 MHz sample clock with minimal jitter. Use Value: ZQ-calibrated outputs and CQ-aligned QVLD enable reliable data capture at 900 Msps with <100 ps setup/hold margin. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C33618B-450BIN | 450 MHz, x36, 36-Mbit QDR II+, no PLL, fixed 2-cycle latency | Lacks DOFF-configurable latency modes and echo clocks - requires external timing compensation | Choose for cost-sensitive designs where 2-cycle latency suffices and board-level clock forwarding is acceptable |
| IS61WV102436BLL-450TQI | 450 MHz, x36, 36-Mbit QDR II+, no ZQ calibration, 1.8 V only I/O | Requires 1.8 V VDDQ - incompatible with 1.5 V HSTL-18 systems; no impedance tuning capability | Choose only if system uses 1.8 V I/O rails and can tolerate higher signal integrity risk on long traces |
Compared with AS7C33618B-450BIN and IS61WV102436BLL-450TQI, CY7C1264XV18 uniquely combines PLL-based timing precision, echo-clock support, ZQ impedance tuning, and DOFF-switchable latency - making it the only option qualified for 450 MHz operation in 1.5 V HSTL-18 telecom infrastructure with strict jitter and skew requirements.
Availability
CY7C1264XV18 is available at Aetrix Electronics and suitable for 10G/40G Ethernet line cards, network processor buffers, telecom control-plane memory, and high-speed test equipment requiring stable component supply across extended product lifecycles.
Supply support for CY7C1264XV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains full product continuity, technical support, and long-term supply commitment for the QDR SRAM portfolio.
This device belongs to the QDR® II+ Xtreme SRAM product line, engineered specifically for deterministic, high-bandwidth memory access in telecom infrastructure, network processors, and test instrumentation where bus turnaround overhead and timing uncertainty must be eliminated.
FAQ
What is the function of the DOFF pin on CY7C1264XV18?
The DOFF (PLL Turn Off) pin is an active-low control that disables the internal PLL. When asserted LOW, the device operates in QDR-I mode with 1-cycle read latency and maximum frequency reduced to 167 MHz. This provides backward compatibility with legacy timing constraints while retaining the same pinout and basic functionality.
How does the ZQ pin affect signal integrity?
The ZQ pin connects to an external resistor to ground to calibrate the output driver impedance of Q[35:0], CQ, and CQ pins to 0.2 × RQ. This matches the SRAM's output impedance to the PCB trace impedance, minimizing reflections and improving eye diagram margins-especially critical at 450 MHz DDR operation.
Can CY7C1264XV18 be used in depth-expanded configurations?
Yes. The device supports depth expansion using RPS and WPS signals to enable independent read/write port selection across multiple devices. Each chip responds only when its respective port select is asserted, allowing seamless extension of memory depth without external logic or address decoding complexity.
What is the role of CQ and CQ echo clocks?
CQ and CQ are free-running, phase-aligned copies of the K and K input clocks, respectively. They are provided to simplify high-speed data capture by giving the receiving logic a locally synchronized clock reference-reducing skew sensitivity and eliminating the need for complex deskew circuitry in FPGA or ASIC interfaces.
CY7C1264XV18-450BZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II+
- Memory Size:
- 36Mbit
- Memory Organization:
- 1M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 450 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1264XV18-450BZXC FAQ
1.How can I place an order for CY7C1264XV18-450BZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1264XV18-450BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1264XV18-450BZXC reliable?
The price and inventory of CY7C1264XV18-450BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1264XV18-450BZXC is usually 5 days.
3.What payment methods are accepted for CY7C1264XV18-450BZXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1264XV18-450BZXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1264XV18-450BZXC?
CY7C1264XV18-450BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1264XV18-450BZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1264XV18-450BZXC?
For technical support, including CY7C1264XV18-450BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1264XV18-450BZXC requirements.
6.How does Aetrix verify that CY7C1264XV18-450BZXC is sourced from the original manufacturer or authorized distributors?
All CY7C1264XV18-450BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1264XV18-450BZXC meets industry standards.
7.What is the process for return or replacement of CY7C1264XV18-450BZXC?
All CY7C1264XV18-450BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1264XV18-450BZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1264XV18-450BZXC part is unused and in its original packaging.
Return procedure for CY7C1264XV18-450BZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1264XV18-450BZXC Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

