Cypress Semiconductor Corp CY7C1268KV18-400BZXC
- Part No.:
- CY7C1268KV18-400BZXC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1268KV18-400BZXC.pdf
- Description:
- IC SRAM 36MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:394
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Product details
Overview
CY7C1268KV18 from Cypress Semiconductor is a 36-Mbit (2 M × 18) DDR II+ synchronous pipelined SRAM with 2.5-cycle read latency, 550 MHz clock support, and HSTL I/O interface operating at 1.4 V to 1.8 V. It delivers 1100 MT/s data throughput via double-data-rate transfers synchronized to K/K clocks and integrates echo clocks (CQ/CQ) and QVLD for precise high-speed data capture in networking and test equipment memory buffers.
For engineers reviewing the CY7C1268KV18 datasheet, CY7C1268KV18 pinout, CY7C1268KV18 application, or CY7C1268KV18 equivalent, key selection considerations include its 165-ball FBGA package, PLL-controlled timing alignment, DOFF-selectable DDR I/DDR II+ mode, and synchronous burst write capability with byte-write select (BWS0/BWS1) for partial-word updates.
Technical Context
This SRAM implements a two-word burst architecture where each address access retrieves two consecutive 18-bit words on alternating rising edges of K and K clocks. Internal pipelining enables back-to-back read initiation every K cycle, while synchronous self-timed writes eliminate external write-strobe timing constraints.
The device uses a phase-locked loop (PLL) to align output data with echo clocks CQ/CQ, achieving ±0.45 ns data valid window relative to clock edges. DOFF pin selection determines operation mode: HIGH enables DDR II+ with 2.5-cycle latency and up to 550 MHz; LOW disables PLL and reverts to DDR I timing with 1-cycle latency and ≤167 MHz maximum frequency.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density & Organization | 36 Mbit (2 M × 18), dual 1 M × 18 arrays enabling interleaved burst reads |
| Max Clock Frequency | 550 MHz - supports 1100 MT/s DDR data rate with precise K/K edge alignment |
| Read Latency | 2.5 cycles (DOFF = HIGH) - enables deterministic timing for high-throughput packet buffering |
| I/O Voltage Range | VDDQ = 1.4 V to 1.8 V - compatible with both 1.5 V and 1.8 V system I/O rails |
| Output Interface | HSTL Class I - provides controlled impedance drive matching for >400 MHz signal integrity |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - optimized for high-density PCB layouts with thermal vias |
| Core Supply | VDD = 1.8 V ± 0.1 V - low-noise core rail decoupling required for stable PLL operation |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body height, RoHS-compliant, with thermal pad exposed on underside.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ[17:0] | Synchronous bidirectional data bus | 18-bit DDR data path; sampled on K/K rising edges during writes, driven on K/K rising edges during reads with echo-clock-aligned timing |
| K / K | Differential input clocks | Positive/negative clock inputs; all synchronous operations referenced to rising edges of both signals for DDR edge alignment |
| CQ / CQ | Output echo clocks | Free-running clocks synchronized to K/K; used by external logic to latch DQ data without skew compensation circuitry |
| QVLD | Valid data indicator | Asserted edge-aligned with CQ/CQ to signal when DQ[17:0] contains valid burst data - eliminates need for fixed delay windows |
| DOFF | PLL enable/disable control | Active-HIGH enables DDR II+ mode (2.5-cycle latency); tied LOW forces DDR I fallback (1-cycle latency, ≤167 MHz) |
| BWS0 / BWS1 | Byte write select | Active-LOW controls write masking: BWS0 for DQ[8:0], BWS1 for DQ[17:9] - enables partial-word updates without read-modify-write |
| LD | Load strobe | Synchronous address/load enable; sampled on K rising edge to define start of burst transaction - replaces asynchronous address latch |
Key Features
| Feature | Design Value |
|---|---|
| Two-word burst architecture | Reduces address bus toggling by 50% versus single-word SRAMs - lowers EMI and routing congestion in high-speed memory interfaces |
| Programmable DOFF mode selection | Enables field-reconfigurable operation between DDR II+ (550 MHz, 2.5-cycle latency) and DDR I (167 MHz, 1-cycle latency) without hardware change |
| Integrated echo clocks (CQ/CQ) | Eliminates board-level clock forwarding complexity - allows direct capture of DQ data using CQ/CQ as sampling clocks in FPGA/ASIC receivers |
| HSTL Class I I/O with ZQ calibration | Supports impedance-matched signaling to 50 Ω traces; ZQ pin enables dynamic output driver tuning to maintain signal integrity across voltage/temperature |
| JTAG 1149.1 boundary scan | Enables production testability and interconnect verification without additional test fixtures - critical for high-density BGA routing validation |
Applications
| Telecom Line Cards | High-Speed Test Equipment |
|---|---|
|
Use Scenario: Buffering real-time packet streams in 10G/40G Ethernet line cards with strict jitter tolerance. IC Role / Device Role / Timing Role: Primary burst SRAM for ingress/egress FIFOs, synchronized to SerDes reference clocks via K/K inputs. Use Value: 2.5-cycle latency and echo clocks ensure sub-1 ns data valid window alignment with FPGA fabric, eliminating setup/hold violations at 550 MHz. |
Use Scenario: Capturing high-fidelity waveform samples in automated test equipment (ATE) pattern generators. IC Role / Device Role / Timing Role: High-bandwidth memory buffer interfacing directly to FPGA-based pattern sequencers and DAC drivers. Use Value: HSTL I/O and ZQ calibration maintain signal integrity across 100+ mm PCB traces, enabling reliable 1100 MT/s transfers into mixed-signal subsystems. |
| Network Packet Processors | Medical Imaging Systems |
|
Use Scenario: Storing header metadata and payload fragments during deep packet inspection in multi-core NPU clusters. IC Role / Device Role / Timing Role: Shared memory resource accessed concurrently by multiple processing engines via burst-aligned read/write cycles. Use Value: Byte-write select (BWS0/BWS1) allows atomic updates to individual 9-bit fields within 18-bit words - avoids lock contention in parallel processing pipelines. |
Use Scenario: Real-time buffering of ultrasound beamforming data before GPU-accelerated reconstruction. IC Role / Device Role / Timing Role: Low-latency frame buffer synchronizing ADC sampling clocks (K/K) with GPU DMA controllers. Use Value: QVLD pin provides unambiguous data validity indication - eliminates need for fixed delay chains in safety-critical medical timing paths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed burst SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C33618A-400BIN | 400 MHz max clock, no PLL, fixed 1-cycle latency, SSTL-18 I/O | Lacks echo clocks and QVLD; requires external timing margining for data capture | Select when cost-sensitive designs tolerate reduced bandwidth and added PCB timing complexity |
| IS61WV102418BLL-10BLI | 100 MHz async SRAM, no DDR interface, 3.3 V core/I/O, 119-pin TQFP | No burst, no echo clocks, no DOFF mode switching - fundamentally different timing model | Choose only for legacy upgrades where DDR infrastructure is unavailable and latency budget >10 ns |
Compared with AS7C33618A-400BIN and IS61WV102418BLL-10BLI, CY7C1268KV18 uniquely delivers programmable DDR latency, echo-clock–assisted data capture, and HSTL signaling - making it irreplaceable in systems requiring guaranteed 550 MHz burst throughput with sub-nanosecond timing closure.
Availability
CY7C1268KV18 is available at Aetrix Electronics and suitable for telecom line cards, high-speed test equipment, network packet processors, and medical imaging systems requiring stable component supply across extended product lifecycles.
Supply support for CY7C1268KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for demanding embedded and communications applications.
CY7C1268KV18 belongs to Cypress's QDR II+/DDR II+ SRAM product line, engineered specifically for deterministic, low-jitter memory buffering in packet-switched networks and high-speed instrumentation where burst throughput and timing predictability are critical.
FAQ
What is the function of the DOFF pin on CY7C1268KV18?
The DOFF pin controls the internal PLL: when asserted HIGH, it enables DDR II+ mode with 2.5-cycle read latency and up to 550 MHz operation; when LOW, it disables the PLL and reverts the device to DDR I timing with 1-cycle latency and a maximum frequency of 167 MHz. This allows runtime mode switching without changing external clock sources or layout.
How does the QVLD signal improve system timing margin?
QVLD is edge-aligned with the echo clocks CQ and CQ and asserts precisely when DQ[17:0] data is valid. Unlike fixed-delay approaches, QVLD eliminates setup/hold uncertainty by providing a synchronous, per-burst validity indicator - enabling FPGA receivers to sample data with zero added timing margin in high-speed designs.
Can CY7C1268KV18 operate with VDDQ = 1.5 V?
Yes - the device supports VDDQ from 1.4 V to 1.8 V, including 1.5 V nominal. At 1.5 V, HSTL output drive strength remains compliant with Class I specifications, and AC timing parameters (e.g., tAC, tHZ) are guaranteed per the datasheet's 1.5 V operating condition tables, provided VDD remains at 1.8 V ± 0.1 V.
What is the purpose of the ZQ pin and how must it be connected?
ZQ enables output impedance calibration: connecting a 240 Ω resistor from ZQ to ground sets CQ, CQ, and DQ output impedance to 48 Ω (0.2 × 240 Ω). Alternatively, tying ZQ to VDDQ enables minimum-impedance mode. ZQ must never be left floating or connected to GND directly - doing so disables calibration and risks signal integrity failure.
CY7C1268KV18-400BZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, DDR II+
- Memory Size:
- 36Mbit
- Memory Organization:
- 2M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 400 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1268KV18-400BZXC FAQ
1.How can I place an order for CY7C1268KV18-400BZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1268KV18-400BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1268KV18-400BZXC reliable?
The price and inventory of CY7C1268KV18-400BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1268KV18-400BZXC is usually 5 days.
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CY7C1268KV18-400BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1268KV18-400BZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1268KV18-400BZXC?
For technical support, including CY7C1268KV18-400BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1268KV18-400BZXC requirements.
6.How does Aetrix verify that CY7C1268KV18-400BZXC is sourced from the original manufacturer or authorized distributors?
All CY7C1268KV18-400BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1268KV18-400BZXC meets industry standards.
7.What is the process for return or replacement of CY7C1268KV18-400BZXC?
All CY7C1268KV18-400BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1268KV18-400BZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1268KV18-400BZXC part is unused and in its original packaging.
Return procedure for CY7C1268KV18-400BZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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