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Cypress Semiconductor Corp CY7C1313KV18-250BZC

Part No.:
CY7C1313KV18-250BZC
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1313KV18-250BZC.pdf
Description:
QDR SRAM, 1MX18, 0.45NS, CMOS, P
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,910

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Product details

Overview

CY7C1313KV18-250BZC from Cypress Semiconductor is a 1 M × 18, 18-Mbit QDR® II SRAM with four-word burst architecture, 250 MHz maximum clock frequency (40 ns cycle time), 1.8 V core supply, and 1.4–1.8 V I/O supply. It features separate read/write ports, DDR interfaces on both ports (500 Mbps per pin), echo clocks (CQ/CQ), and DOFF-selectable 1-cycle or 1.5-cycle read latency. Used in high-bandwidth packet buffering for network switches and routers.

For engineers reviewing the CY7C1313KV18-250BZC datasheet, CY7C1313KV18-250BZC pinout, CY7C1313KV18-250BZC application, or CY7C1313KV18-250BZC equivalent, key selection criteria include burst depth, QDR II timing compliance, FBGA-165 package compatibility, and DOFF-configurable read latency for system-level timing closure.

Technical Context

The device implements true dual-port synchronous pipelined architecture with independent K/K input clocks for address/data capture and C/C output clocks for data launch-enabling concurrent read and write operations without bus turnaround. Its internal 256 K × 18 memory array is organized across four sub-arrays, accessed via 18-bit multiplexed address bus (A[17:0]) latched on alternating K-clock edges.

Read data is driven synchronously on C/C rising edges with echo clocks (CQ/CQ) aligned to output data edges, minimizing skew in high-speed capture. Write operations use on-chip self-timed control with BWS[1:0] byte write enables supporting partial-word updates without read-modify-write cycles.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 18 Mbit (1 M × 18 organization)
Maximum Clock Frequency 250 MHz (40 ns cycle time); supports full-speed operation at 250 MHz with guaranteed timing margins
Data Rate 500 Mbps per I/O pin (DDR interface on both read and write ports)
Core Supply Voltage 1.8 V ±0.1 V; defines minimum operating voltage for internal logic and array stability
I/O Supply Range 1.4 V to 1.8 V; supports interoperability with 1.5 V or 1.8 V system I/O domains
Read Latency Selectable: 1 cycle (DOFF = LOW) or 1.5 cycles (DOFF = HIGH); directly impacts pipeline depth in switch fabric controllers
Package 165-ball FBGA (13 mm × 15 mm × 1.4 mm); RoHS-compliant, thermal performance optimized for embedded networking modules

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
D[17:0] Synchronous write data inputs 18-bit parallel data sampled on rising edge of K clock; supports full-word or byte-aligned writes via BWS[1:0]
Q[17:0] Synchronous read data outputs 18-bit parallel data launched on rising edge of C/C clocks; echoed by CQ/CQ for source-synchronous capture
A[17:0] Multiplexed address inputs 18-bit address latched on alternating rising edges of K clock for read/write access to 1 M × 18 array
K / K Input clocks (read/write) Differential pair driving all synchronous inputs; only rising edges used for register sampling
C / C Output clocks (read) Differential pair controlling Q[17:0] and CQ/CQ timing; minimizes flight-time mismatch vs. data
CQ / CQ Echo clocks Source-synchronous clocks aligned to Q[17:0] output edges; simplifies high-speed FPGA receiver design
WPS Write port select Active-low signal enabling write transactions; deassertion disables write port and ignores D[17:0]
BWS[1:0] Byte write selects Two active-low signals selecting 9-bit byte groups: BWS0 → D[8:0], BWS1 → D[17:9]; enables partial-word writes
DOFF Read latency control High = 1.5-cycle latency (pipelined mode); Low = 1-cycle latency (QDR I compatibility mode)
VDD / VDDQ / VSS Power and ground terminals VDD = 1.8 V core; VDDQ = 1.4–1.8 V I/O; dedicated VSS balls per power domain ensure low-noise switching

Key Features

Feature Design Value
Separate read/write data ports Eliminates bus turnaround overhead; enables simultaneous 500 Mbps read + 500 Mbps write throughput
Four-word burst architecture Reduces effective address bus frequency by 4×; lowers PCB routing complexity and timing closure burden
DOFF-configurable read latency Supports both legacy QDR I (1-cycle) and optimized QDR II (1.5-cycle) timing models in same hardware
JTAG 1149.1 test access port Enables boundary scan testing of high-density FBGA interconnects without physical probe access
Variable-drive HSTL output buffers Adjustable drive strength matches trace impedance; reduces signal integrity issues in multi-drop memory buses

Applications

Network Packet Buffering Telecom Line Card Memory

Use Scenario: Storing ingress/egress packet headers and payloads in 10 GbE switch fabric ASICs.

IC Role / Device Role / Timing Role: High-throughput, low-latency shared memory buffer interfacing directly with SerDes MAC controllers.

Use Value: Concurrent read/write capability eliminates arbitration stalls; 500 Mbps DDR I/O sustains line-rate traffic at 10 Gbps with <10 ns access jitter.

Use Scenario: Frame assembly/disassembly in OC-192 SONET/SDH line cards requiring deterministic latency.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as elastic store between framer and DSP subsystems.

Use Value: DOFF-selectable latency allows tuning to match framer FIFO depth; echo clocks simplify timing closure with Xilinx Ultrascale+ GTY transceivers.

Baseband Processing Buffer Radar Signal Processing Memory

Use Scenario: Temporary storage of OFDM symbol data between FFT and channel estimation blocks in LTE eNodeB baseband units.

IC Role / Device Role / Timing Role: Burst-access memory co-located with FPGA-based signal processors.

Use Value: Four-word burst reduces address bus toggling by 75%, lowering EMI and power consumption in dense RF modules.

Use Scenario: Real-time storage of chirp samples and intermediate FFT results in automotive 77 GHz radar SoCs.

IC Role / Device Role / Timing Role: Low-jitter, deterministic-access memory for time-critical beamforming pipelines.

Use Value: 1.5-cycle latency mode ensures predictable 40 ns read response; 165-ball FBGA fits constrained RF shielded layouts.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72T3615L10PA 18-Mbit (512K × 36), 100 MHz max clock, LVDS I/O, no echo clocks Limited to lower bandwidth systems; requires external clock forwarding for data capture Choose when system clock <125 MHz and LVDS interface is mandated; not drop-in compatible
ISSI IS61WV102418B 18-Mbit (1M × 18), asynchronous SRAM, 15 ns access, single-ended CMOS I/O No burst, no DDR, no echo clocks; higher latency, lower peak bandwidth Use only in cost-sensitive, non-pipelined designs where 500 Mbps throughput is unnecessary

Compared with IDT72T3615L10PA and IS61WV102418B, CY7C1313KV18-250BZC delivers 2.5× higher effective bandwidth via DDR + four-word burst, while its echo clocks and DOFF control provide deterministic timing unattainable with alternatives.

Availability

CY7C1313KV18-250BZC is available at Aetrix Electronics and suitable for network switch buffering, telecom line card memory, baseband processing, and radar signal processing requiring stable component supply across extended production lifecycles.

Supply support for CY7C1313KV18-250BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications.

CY7C1313KV18 belongs to the QDR® II SRAM product line, engineered specifically for deterministic, high-bandwidth packet buffering in switched fabric architectures where concurrent read/write and low-latency access are critical.

FAQ

What is the function of the DOFF pin on CY7C1313KV18-250BZC?

The DOFF (Data Output OFFset) pin configures read latency: when asserted HIGH, it enables 1.5-cycle latency (QDR II mode) for optimized throughput; when LOW, it selects 1-cycle latency (QDR I compatibility mode). This setting directly affects pipeline stage count in connected ASICs or FPGAs and must be held stable during operation.

Does CY7C1313KV18-250BZC require external termination resistors?

No-CY7C1313KV18-250BZC integrates programmable on-die termination (ODT) for HSTL Class I outputs. External 50 Ω pull-downs are required only on CQ/CQ echo clocks per datasheet Figure 12; all data and address lines use internal ODT calibrated via ZQ pin.

Can CY7C1313KV18-250BZC operate with a single clock domain?

Yes-by tying K to C and K to C, the device operates in single-clock mode. In this configuration, read data appears on Q[17:0] one cycle after address assertion, and write data is captured on the same clock edge; however, full QDR II bandwidth and echo clock benefits are forfeited.

What is the purpose of BWS[1:0] pins in CY7C1313KV18-250BZC?

BWS[1:0] (Byte Write Select) pins enable partial-word writes: BWS0 controls D[8:0], BWS1 controls D[17:9]. When either is deasserted (HIGH), the corresponding 9-bit byte is masked during write cycles, preserving existing memory contents-eliminating need for read-modify-write sequences in protocol header updates.

CY7C1313KV18-250BZC Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
18Mbit
Memory Organization:
1M x 18
Memory Interface:
Parallel
Clock Frequency:
250 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1313KV18-250BZC FAQ

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Please submit a Request for Quotation (RFQ) for CY7C1313KV18-250BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1313KV18-250BZC reliable?

The price and inventory of CY7C1313KV18-250BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1313KV18-250BZC is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1313KV18-250BZC transactions.

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CY7C1313KV18-250BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1313KV18-250BZC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1313KV18-250BZC?

For technical support, including CY7C1313KV18-250BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1313KV18-250BZC requirements.

6.How does Aetrix verify that CY7C1313KV18-250BZC is sourced from the original manufacturer or authorized distributors?

All CY7C1313KV18-250BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1313KV18-250BZC meets industry standards.

7.What is the process for return or replacement of CY7C1313KV18-250BZC?

All CY7C1313KV18-250BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1313KV18-250BZC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1313KV18-250BZC part is unused and in its original packaging.

Return procedure for CY7C1313KV18-250BZC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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