Cypress Semiconductor Corp CY7C1313KV18-250BZXC
- Part No.:
- CY7C1313KV18-250BZXC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1313KV18-250BZXC.pdf
- Description:
- IC SRAM 18MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:135
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Product details
Overview
CY7C1313KV18-250BZXC from Cypress Semiconductor is a 1 M × 18-bit (18-Mbit), 250 MHz QDR® II SRAM with separate read/write ports, four-word burst architecture, and DDR interfaces operating at 500 MT/s per port. It uses 1.8 V core supply and 1.4–1.8 V I/O supply, features echo clocks (CQ/CQ), and supports concurrent read/write transactions in high-bandwidth networking and packet buffering applications.
For engineers reviewing the CY7C1313KV18-250BZXC datasheet, CY7C1313KV18-250BZXC pinout, CY7C1313KV18-250BZXC application, or CY7C1313KV18-250BZXC equivalent, key selection criteria include 1-cycle vs. 1.5-cycle read latency (DOFF-controlled), HSTL-18 output drive, 165-ball FBGA package compatibility, and depth expansion via RPS/WPS signals.
Technical Context
The CY7C1313KV18 implements QDR II architecture with fully independent read and write data paths-no bus turnaround required. Address latching occurs on alternating rising edges of K/K clocks, enabling true concurrency while maintaining full data coherency across both ports.
It employs synchronous self-timed writes, PLL-based data placement for timing accuracy, and dual input clock domains (K/K for address/control, C/C for output timing) to minimize skew. Echo clocks CQ/CQ are phase-aligned with Q[17:0] outputs to simplify high-speed capture at 500 MT/s.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 1 M × 18-bit (18-Mbit total); 4 internal 256 K × 18 arrays |
| Maximum Clock Frequency | 250 MHz K/K input clock → 500 MT/s effective data rate per port |
| Read Latency | Selectable: 1 cycle (DOFF = LOW) or 1.5 cycles (DOFF = HIGH) |
| Supply Voltages | VDD = 1.8 V ±0.1 V (core); VDDQ = 1.4–1.8 V (I/O, supports HSTL-18) |
| Burst Length | Fixed four-word burst per access; no burst-length programming required |
| Package | 165-ball FBGA (13 mm × 15 mm × 1.4 mm); RoHS-compliant, Pb-free option |
| JTAG Support | IEEE 1149.1 compliant TAP controller with boundary scan and ID register |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm footprint, 1.4 mm height, 0.8 mm ball pitch, JEDEC MO-245 compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[17:0] | Synchronous write data inputs | Sampled on rising edge of K/K; supports byte-write via BWS[1:0] |
| Q[17:0] | Synchronous read data outputs | Driven on rising edge of C/C; echoed by CQ/CQ for source-synchronous capture |
| K / K | Input clocks (read/write control) | Rising-edge-triggered; used for address/data latch timing; K only used for control |
| C / C | Output clocks (data timing) | Rising-edge-driven; controls Q[17:0] output timing; minimizes flight-time mismatch |
| RPS / WPS | Read/Write Port Select | Active-low enables independent port activation for depth expansion |
| BWS[1:0] | Byte Write Select | Active-low selects D[8:0] (BWS0) or D[17:9] (BWS1); preserves unselected bytes |
| DOFF | Read latency mode control | HIGH → 1.5-cycle latency; LOW → 1-cycle latency; sets internal pipeline depth |
| VREF | Reference voltage input | Supplies termination reference for HSTL-18 I/O; requires external 0.75 V source |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write data ports | Enables simultaneous access without bus contention or turnaround delay |
| Four-word burst architecture | Reduces address bus frequency by 4× versus single-word access at same bandwidth |
| Echo clocks (CQ/CQ) | Phase-matched with Q[17:0] outputs to eliminate setup/hold margin loss at 500 MT/s |
| Programmable read latency (DOFF) | Allows trade-off between latency (1 cycle) and timing margin (1.5 cycles) per system requirement |
| HSTL-18 compatible I/O | Supports 1.4–1.8 V VDDQ; enables direct interface with FPGA/ASIC memory controllers |
| JTAG 1149.1 test access port | Enables production boundary scan testing and in-system debug without additional hardware |
Applications
| High-Speed Packet Buffering | Network Switch Fabric Memory |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and metadata in Layer 2/3 switches. IC Role / Device Role / Timing Role: Dual-port SRAM serving as shared buffer with concurrent read (forwarding lookup) and write (packet arrival) operations. Use Value: 500 MT/s per port sustains ≥10 Gbps line-rate buffering with zero bus turnaround overhead. |
Use Scenario: Interconnecting multiple ASICs in modular switch chassis via shared memory fabric. IC Role / Device Role / Timing Role: QDR II SRAM acting as low-latency inter-ASIC communication buffer with deterministic 1-cycle read response. Use Value: DOFF-controlled latency allows tuning to match ASIC pipeline stages without redesigning PCB timing. |
| Telecom Line Card Buffering | Baseband Processing Memory |
|
Use Scenario: Temporary storage of processed frames in CPRI/OBSAI fronthaul interface cards. IC Role / Device Role / Timing Role: Burst-mode memory staging data between DSP cores and serial transceivers. Use Value: Four-word burst reduces address bus toggling, lowering EMI and power consumption in dense line cards. |
Use Scenario: Holding FFT/IFFT intermediate results in LTE/5G baseband units. IC Role / Device Role / Timing Role: Synchronous pipelined SRAM providing time-aligned read/write for parallel processing pipelines. Use Value: Independent RPS/WPS enables multi-core access arbitration without software synchronization overhead. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T3615L10BG | 1 M × 18, 10 ns async access; no DDR, no echo clocks, no DOFF latency control | Lower bandwidth (≤200 MHz effective), higher latency variability; suited for non-packetized control-plane buffers | Choose when deterministic sub-10 ns latency matters more than throughput; avoid for 10G+ data-path use. |
| ISSI IS61WV102418B | 1 M × 18, 165 MHz sync SRAM; single-port, no burst, no QDR architecture | No concurrent read/write; requires external arbitration; max 330 MB/s vs. 1.8 GB/s per port | Acceptable only for cost-sensitive, low-throughput control memory where QDR advantages are unused. |
Compared with IDT72T3615L10BG and IS61WV102418B, CY7C1313KV18-250BZXC delivers 3.6× higher sustained bandwidth, eliminates bus turnaround delays, and provides programmable latency-critical for packet-processing pipelines requiring precise timing alignment.
Availability
CY7C1313KV18-250BZXC is available at Aetrix Electronics and suitable for high-speed packet buffering, network switch fabric memory, telecom line card buffering, and baseband processing requiring stable component supply and long-term industrial availability.
Supply support for CY7C1313KV18-250BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive systems.
CY7C1313KV18 belongs to the QDR® II SRAM product line, engineered specifically for deterministic, low-latency, high-throughput memory interfacing in packet-switched infrastructure and real-time signal processing.
FAQ
What is the function of the DOFF pin on CY7C1313KV18-250BZXC?
The DOFF (Data Output OFFset) pin selects read latency mode: when asserted HIGH, it configures 1.5-cycle latency for improved timing margin; when LOW, it enables 1-cycle latency for minimal delay. This setting directly controls internal pipeline depth and must be held stable during operation-no dynamic switching is supported.
Can CY7C1313KV18-250BZXC operate with only one clock domain (K-only)?
No. The device requires two independent clock domains: K/K for address/control/data input timing and C/C for output timing. Using only K (and tying C = K) violates AC timing specifications and disables echo clock functionality, risking data capture failure at rated speed. C/C must be driven separately.
How does byte write select (BWS) work for the 18-bit data width?
BWS[1:0] divides the 18-bit D[17:0] bus into two 9-bit groups: BWS0 controls D[8:0], BWS1 controls D[17:9]. Both are active-low; deasserting either leaves its corresponding 9-bit segment unchanged in memory. This enables partial-word updates without read-modify-write cycles.
Is VREF required for proper operation of CY7C1313KV18-250BZXC?
Yes. VREF must be supplied with a stable 0.75 V ±1% reference voltage, as it sets the switching threshold for all HSTL-18 I/O pins (D[17:0], Q[17:0], BWS, RPS, WPS, etc.). Omitting or misbiasing VREF causes undefined logic levels and functional failure, especially at 250 MHz operation.
CY7C1313KV18-250BZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 18Mbit
- Memory Organization:
- 1M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 250 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1313KV18-250BZXC FAQ
1.How can I place an order for CY7C1313KV18-250BZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1313KV18-250BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1313KV18-250BZXC reliable?
The price and inventory of CY7C1313KV18-250BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1313KV18-250BZXC is usually 5 days.
3.What payment methods are accepted for CY7C1313KV18-250BZXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1313KV18-250BZXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1313KV18-250BZXC?
CY7C1313KV18-250BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1313KV18-250BZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1313KV18-250BZXC?
For technical support, including CY7C1313KV18-250BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1313KV18-250BZXC requirements.
6.How does Aetrix verify that CY7C1313KV18-250BZXC is sourced from the original manufacturer or authorized distributors?
All CY7C1313KV18-250BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1313KV18-250BZXC meets industry standards.
7.What is the process for return or replacement of CY7C1313KV18-250BZXC?
All CY7C1313KV18-250BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1313KV18-250BZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1313KV18-250BZXC part is unused and in its original packaging.
Return procedure for CY7C1313KV18-250BZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1313KV18-250BZXC Tags

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STMicroelectronics
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Microchip Technology

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Microchip Technology

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Microchip Technology
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STMicroelectronics

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Microchip Technology

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Microchip Technology

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Microchip Technology
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