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Cypress Semiconductor Corp CY7C1313KV18-250BZXC

Part No.:
CY7C1313KV18-250BZXC
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1313KV18-250BZXC.pdf
Description:
IC SRAM 18MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:135

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Product details

Overview

CY7C1313KV18-250BZXC from Cypress Semiconductor is a 1 M × 18-bit (18-Mbit), 250 MHz QDR® II SRAM with separate read/write ports, four-word burst architecture, and DDR interfaces operating at 500 MT/s per port. It uses 1.8 V core supply and 1.4–1.8 V I/O supply, features echo clocks (CQ/CQ), and supports concurrent read/write transactions in high-bandwidth networking and packet buffering applications.

For engineers reviewing the CY7C1313KV18-250BZXC datasheet, CY7C1313KV18-250BZXC pinout, CY7C1313KV18-250BZXC application, or CY7C1313KV18-250BZXC equivalent, key selection criteria include 1-cycle vs. 1.5-cycle read latency (DOFF-controlled), HSTL-18 output drive, 165-ball FBGA package compatibility, and depth expansion via RPS/WPS signals.

Technical Context

The CY7C1313KV18 implements QDR II architecture with fully independent read and write data paths-no bus turnaround required. Address latching occurs on alternating rising edges of K/K clocks, enabling true concurrency while maintaining full data coherency across both ports.

It employs synchronous self-timed writes, PLL-based data placement for timing accuracy, and dual input clock domains (K/K for address/control, C/C for output timing) to minimize skew. Echo clocks CQ/CQ are phase-aligned with Q[17:0] outputs to simplify high-speed capture at 500 MT/s.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 1 M × 18-bit (18-Mbit total); 4 internal 256 K × 18 arrays
Maximum Clock Frequency 250 MHz K/K input clock → 500 MT/s effective data rate per port
Read Latency Selectable: 1 cycle (DOFF = LOW) or 1.5 cycles (DOFF = HIGH)
Supply Voltages VDD = 1.8 V ±0.1 V (core); VDDQ = 1.4–1.8 V (I/O, supports HSTL-18)
Burst Length Fixed four-word burst per access; no burst-length programming required
Package 165-ball FBGA (13 mm × 15 mm × 1.4 mm); RoHS-compliant, Pb-free option
JTAG Support IEEE 1149.1 compliant TAP controller with boundary scan and ID register

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm footprint, 1.4 mm height, 0.8 mm ball pitch, JEDEC MO-245 compliant.

Pin/Terminal Circuit Role Design Meaning
D[17:0] Synchronous write data inputs Sampled on rising edge of K/K; supports byte-write via BWS[1:0]
Q[17:0] Synchronous read data outputs Driven on rising edge of C/C; echoed by CQ/CQ for source-synchronous capture
K / K Input clocks (read/write control) Rising-edge-triggered; used for address/data latch timing; K only used for control
C / C Output clocks (data timing) Rising-edge-driven; controls Q[17:0] output timing; minimizes flight-time mismatch
RPS / WPS Read/Write Port Select Active-low enables independent port activation for depth expansion
BWS[1:0] Byte Write Select Active-low selects D[8:0] (BWS0) or D[17:9] (BWS1); preserves unselected bytes
DOFF Read latency mode control HIGH → 1.5-cycle latency; LOW → 1-cycle latency; sets internal pipeline depth
VREF Reference voltage input Supplies termination reference for HSTL-18 I/O; requires external 0.75 V source

Key Features

Feature Design Value
Separate read/write data ports Enables simultaneous access without bus contention or turnaround delay
Four-word burst architecture Reduces address bus frequency by 4× versus single-word access at same bandwidth
Echo clocks (CQ/CQ) Phase-matched with Q[17:0] outputs to eliminate setup/hold margin loss at 500 MT/s
Programmable read latency (DOFF) Allows trade-off between latency (1 cycle) and timing margin (1.5 cycles) per system requirement
HSTL-18 compatible I/O Supports 1.4–1.8 V VDDQ; enables direct interface with FPGA/ASIC memory controllers
JTAG 1149.1 test access port Enables production boundary scan testing and in-system debug without additional hardware

Applications

High-Speed Packet Buffering Network Switch Fabric Memory

Use Scenario: Storing ingress/egress packet headers and metadata in Layer 2/3 switches.

IC Role / Device Role / Timing Role: Dual-port SRAM serving as shared buffer with concurrent read (forwarding lookup) and write (packet arrival) operations.

Use Value: 500 MT/s per port sustains ≥10 Gbps line-rate buffering with zero bus turnaround overhead.

Use Scenario: Interconnecting multiple ASICs in modular switch chassis via shared memory fabric.

IC Role / Device Role / Timing Role: QDR II SRAM acting as low-latency inter-ASIC communication buffer with deterministic 1-cycle read response.

Use Value: DOFF-controlled latency allows tuning to match ASIC pipeline stages without redesigning PCB timing.

Telecom Line Card Buffering Baseband Processing Memory

Use Scenario: Temporary storage of processed frames in CPRI/OBSAI fronthaul interface cards.

IC Role / Device Role / Timing Role: Burst-mode memory staging data between DSP cores and serial transceivers.

Use Value: Four-word burst reduces address bus toggling, lowering EMI and power consumption in dense line cards.

Use Scenario: Holding FFT/IFFT intermediate results in LTE/5G baseband units.

IC Role / Device Role / Timing Role: Synchronous pipelined SRAM providing time-aligned read/write for parallel processing pipelines.

Use Value: Independent RPS/WPS enables multi-core access arbitration without software synchronization overhead.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72T3615L10BG 1 M × 18, 10 ns async access; no DDR, no echo clocks, no DOFF latency control Lower bandwidth (≤200 MHz effective), higher latency variability; suited for non-packetized control-plane buffers Choose when deterministic sub-10 ns latency matters more than throughput; avoid for 10G+ data-path use.
ISSI IS61WV102418B 1 M × 18, 165 MHz sync SRAM; single-port, no burst, no QDR architecture No concurrent read/write; requires external arbitration; max 330 MB/s vs. 1.8 GB/s per port Acceptable only for cost-sensitive, low-throughput control memory where QDR advantages are unused.

Compared with IDT72T3615L10BG and IS61WV102418B, CY7C1313KV18-250BZXC delivers 3.6× higher sustained bandwidth, eliminates bus turnaround delays, and provides programmable latency-critical for packet-processing pipelines requiring precise timing alignment.

Availability

CY7C1313KV18-250BZXC is available at Aetrix Electronics and suitable for high-speed packet buffering, network switch fabric memory, telecom line card buffering, and baseband processing requiring stable component supply and long-term industrial availability.

Supply support for CY7C1313KV18-250BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive systems.

CY7C1313KV18 belongs to the QDR® II SRAM product line, engineered specifically for deterministic, low-latency, high-throughput memory interfacing in packet-switched infrastructure and real-time signal processing.

FAQ

What is the function of the DOFF pin on CY7C1313KV18-250BZXC?

The DOFF (Data Output OFFset) pin selects read latency mode: when asserted HIGH, it configures 1.5-cycle latency for improved timing margin; when LOW, it enables 1-cycle latency for minimal delay. This setting directly controls internal pipeline depth and must be held stable during operation-no dynamic switching is supported.

Can CY7C1313KV18-250BZXC operate with only one clock domain (K-only)?

No. The device requires two independent clock domains: K/K for address/control/data input timing and C/C for output timing. Using only K (and tying C = K) violates AC timing specifications and disables echo clock functionality, risking data capture failure at rated speed. C/C must be driven separately.

How does byte write select (BWS) work for the 18-bit data width?

BWS[1:0] divides the 18-bit D[17:0] bus into two 9-bit groups: BWS0 controls D[8:0], BWS1 controls D[17:9]. Both are active-low; deasserting either leaves its corresponding 9-bit segment unchanged in memory. This enables partial-word updates without read-modify-write cycles.

Is VREF required for proper operation of CY7C1313KV18-250BZXC?

Yes. VREF must be supplied with a stable 0.75 V ±1% reference voltage, as it sets the switching threshold for all HSTL-18 I/O pins (D[17:0], Q[17:0], BWS, RPS, WPS, etc.). Omitting or misbiasing VREF causes undefined logic levels and functional failure, especially at 250 MHz operation.

CY7C1313KV18-250BZXC Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Bulk
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
18Mbit
Memory Organization:
1M x 18
Memory Interface:
Parallel
Clock Frequency:
250 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1313KV18-250BZXC FAQ

1.How can I place an order for CY7C1313KV18-250BZXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1313KV18-250BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1313KV18-250BZXC reliable?

The price and inventory of CY7C1313KV18-250BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1313KV18-250BZXC is usually 5 days.

3.What payment methods are accepted for CY7C1313KV18-250BZXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1313KV18-250BZXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1313KV18-250BZXC?

CY7C1313KV18-250BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1313KV18-250BZXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1313KV18-250BZXC?

For technical support, including CY7C1313KV18-250BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1313KV18-250BZXC requirements.

6.How does Aetrix verify that CY7C1313KV18-250BZXC is sourced from the original manufacturer or authorized distributors?

All CY7C1313KV18-250BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1313KV18-250BZXC meets industry standards.

7.What is the process for return or replacement of CY7C1313KV18-250BZXC?

All CY7C1313KV18-250BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1313KV18-250BZXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1313KV18-250BZXC part is unused and in its original packaging.

Return procedure for CY7C1313KV18-250BZXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1313KV18-250BZXC Tags

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