Cypress Semiconductor Corp CY7C1315KV18-250BZI

Overview

CY7C1315KV18 from Cypress Semiconductor is a 18-Mbit QDR® II SRAM with 512K × 36 organization, four-word burst architecture, and separate read/write DDR ports operating at 333 MHz (666 MT/s effective). It features echo clocks (CQ/CQ), DOFF-selectable 1.5-cycle or 1-cycle read latency, and 1.8 V core / 1.4–1.8 V I/O supply. Used in high-bandwidth packet buffering for network switches and routers.

For engineers reviewing the CY7C1315KV18 datasheet, CY7C1315KV18 pinout, CY7C1315KV18 application, or CY7C1315KV18 equivalent, key selection considerations include its 165-ball FBGA package, BWS[3:0] byte write control, QDR II concurrent transaction capability, and HSTL-18-compatible output drive.

Technical Context

The CY7C1315KV18 implements a synchronous pipelined QDR II architecture with fully independent read and write data paths-no bus turnaround required. Its 512K × 36 configuration uses 17 address bits (A[16:0]), four-byte-wide write select (BWS[3:0]), and 36-bit bidirectional data interface (D[35:0]/Q[35:0]).

It employs dual input clocks (K/K) for address/data capture and dual output clocks (C/C) with echo clocks (CQ/CQ) to align data valid windows. The on-chip PLL ensures precise DDR timing placement, and DOFF pin configures read latency between 1 cycle (LOW) and 1.5 cycles (HIGH).

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Compared with IDT72T3615L10BG and AS7C331024B-25BIN, CY7C1315KV18 uniquely delivers configurable read latency, echo-clock–assisted timing closure, and true concurrent DDR bandwidth-making it optimal for next-generation networking and test equipment demanding both speed and design margin.

Availability

CY7C1315KV18 is available at Aetrix Electronics and suitable for network switch buffering, high-speed ATE memory subsystems, telecom baseband processing, and defense radar signal buffering requiring stable component supply across multi-year production cycles.

Supply support for CY7C1315KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications, with emphasis on signal integrity and timing robustness.

The QDR® II SRAM product line targets high-bandwidth, low-latency memory subsystems in infrastructure equipment-specifically engineered to eliminate bus turnaround and support deterministic DDR timing in FPGA- and ASIC-based systems.

FAQ

What is the function of the DOFF pin on CY7C1315KV18?

The DOFF (Data Output OFFset) pin selects read latency mode: when asserted HIGH, it configures 1.5-cycle read latency for improved timing margin in high-skew layouts; when LOW, it enables 1-cycle latency for minimal delay in tightly controlled interfaces. This setting directly controls internal pipeline depth and affects tAC and tCO timing parameters.

How does the BWS[3:0] signal operate in CY7C1315KV18?

BWS[3:0] are active-LOW byte write enables controlling 8-bit segments of the 36-bit D[35:0] bus: BWS0 covers D[8:0], BWS1 covers D[17:9], BWS2 covers D[26:18], and BWS3 covers D[35:27]. All are sampled synchronously with K/K clock edges during write operations, allowing partial writes without disturbing unselected bytes.

Can CY7C1315KV18 operate with only one clock domain (K-only)?

Yes-CY7C1315KV18 supports single-clock-domain operation where K is used for both address and data capture, and C is used for output timing. In this mode, C and K must be phase-aligned, and echo clocks (CQ/CQ) remain functional for source-synchronous capture, though C/C skew management becomes more critical.

What is the purpose of the ZQ pin and how should it be terminated?

ZQ is the impedance calibration reference pin for HSTL-18 output drivers. It must be connected to a precision 240 Ω ±1% resistor tied to VSS (ground) to enable on-die termination calibration. Failure to terminate ZQ correctly results in inconsistent output drive strength and signal integrity degradation at 333 MHz.