Cypress Semiconductor Corp CY7C1321KV18-250BZC
- Part No.:
- CY7C1321KV18-250BZC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1321KV18-250BZC.pdf
- Description:
- IC SRAM 18MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1321KV18-250BZC from Cypress Semiconductor is a 18-Mbit synchronous pipelined DDR II SRAM configured as 512K × 36, operating at 250 MHz with 1.8 V core supply and HSTL I/O. It implements four-word burst reads/writes synchronized to dual-edge–referenced clocks (K/K for input, C/C for output), features echo clocks (CQ/CQ) for timing margin recovery, and supports programmable output impedance via ZQ pin. It is used in high-bandwidth packet buffering and network switch fabric memory subsystems.
For engineers reviewing the CY7C1321KV18-250BZC datasheet, CY7C1321KV18-250BZC pinout, CY7C1321KV18-250BZC application, or CY7C1321KV18-250BZC equivalent, key selection criteria include DDR II burst latency mode (DOFF-controlled), 36-bit wide data interface, 165-ball FBGA package compatibility, and JTAG 1149.1 test access support for system-level validation.
Technical Context
This SRAM uses a synchronous pipelined architecture with internal two-bit burst counter driven by A[1:0], delivering four sequential 36-bit words per access. Read latency is 1.5 cycles when DOFF = HIGH (DDR II mode) or 1 cycle when DOFF = LOW (DDR I mode). All address, control, and data inputs are registered on rising edges of K and K clocks.
Output data is edge-aligned to C and C clocks, with echo clocks CQ and CQ phase-matched to C and C respectively-enabling source-synchronous capture at the controller without board-level skew compensation. The device integrates a PLL for precise internal clock alignment and supports variable-strength HSTL outputs (1.4 V–VDDQ) with ZQ calibration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density & Organization | 18 Mbit / 512K × 36 - provides 36-bit wide parallel interface optimized for burst-oriented packet buffer applications. |
| Max Clock Frequency | 250 MHz (K/K) - defines maximum sustained bus bandwidth of 18 Gbps (36 bits × 250 MHz). |
| Read Latency | 1 or 1.5 clock cycles - selectable via DOFF pin; enables trade-off between timing margin and pipeline depth in switch ASIC interfaces. |
| I/O Voltage | 1.8 V core / 1.4–1.8 V HSTL I/O - supports mixed-voltage systems and backward compatibility with 1.5 V HSTL-18 buses. |
| Burst Mode | Four-word linear burst - reduces external address bus toggling frequency by 4× versus single-word access, lowering EMI and routing complexity. |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - standard footprint for high-pin-count memory devices in space-constrained networking modules. |
| JTAG Support | IEEE 1149.1 compliant TAP - enables boundary scan testing of SRAM interconnects without requiring functional access. |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body height, RoHS-compliant Pb-free option available.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ[35:0] | Synchronous bidirectional data bus | 36-bit DDR data path; inputs sampled on K/K rising edges, outputs driven on C/C rising edges; tristated automatically when deselected. |
| K, K | Input clock pair (positive/negative) | Reference clocks for all synchronous inputs (address, R/W, LD, BWS); rising edges latch control and data; define access initiation timing. |
| C, C | Output clock pair (positive/negative) | Source-synchronous clocks for read data; used with CQ/CQ to deskew flight time mismatches across multiple SRAMs in parallel configurations. |
| CQ, CQ | Echo clock outputs | Free-running clocks synchronized to C/C; enable controller to capture Q[35:0] with minimal setup/hold uncertainty in high-speed designs. |
| DOFF | DDR operation mode select | LOW = DDR I mode (1-cycle read latency); HIGH = DDR II mode (1.5-cycle read latency); determines burst timing behavior and pipeline staging. |
| ZQ | Output impedance calibration input | Connects to external 240 Ω resistor to ground; calibrates DQ and CQ driver strength to match 60 Ω PCB trace impedance (0.2 × RQ). |
| LD | Load strobe | Active-low synchronous signal that latches address and R/W state on next K/K edge; initiates burst sequence for four consecutive words. |
| BWS[3:0] | Byte write select (active low) | Four independent 9-bit byte enables; allows partial writes without read-modify-write; BWS0–BWS3 map to D[8:0], D[17:9], D[26:18], D[35:27]. |
Key Features
| Feature | Design Value |
|---|---|
| Four-word burst architecture | Reduces external address bus activity by 75% per transaction, minimizing routing layers and signal integrity challenges in dense switch fabric layouts. |
| Programmable HSTL drive strength | ZQ-calibrated output impedance ensures consistent signal integrity across voltage/temperature variations, eliminating manual termination resistor tuning. |
| Source-synchronous echo clocks (CQ/CQ) | Eliminates need for separate capture clock generation at the controller; simplifies timing closure for >500 Mbps per pin interfaces. |
| Configurable DDR latency mode | DOFF pin selects between 1-cycle (DDR I) and 1.5-cycle (DDR II) read latency-enables optimization for either throughput or timing margin in ASIC co-design. |
| JTAG 1149.1 test access port | Enables full boundary scan visibility of all 165 balls, supporting automated test pattern generation and interconnect fault isolation in production test. |
Applications
| Network Switch Buffer Memory | Telecom Line Card Packet FIFO |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and payload fragments in multi-gigabit Ethernet switching ASICs. IC Role / Device Role / Timing Role: High-throughput, low-latency burst-access memory serving as first-level packet buffer between MAC and traffic manager. Use Value: Four-word burst and echo clocks enable deterministic 1.5-cycle read response, allowing switch fabric arbitration logic to schedule next-hop forwarding within fixed pipeline stages. |
Use Scenario: Temporary storage of ATM or IP packets in carrier-grade DSLAM and OLT line cards before QoS scheduling. IC Role / Device Role / Timing Role: Synchronous DDR II SRAM acting as elastic buffer between PHY layer and packet classification engine. Use Value: 36-bit width matches common internal bus widths in telecom SoCs; ZQ calibration maintains signal fidelity over temperature drift in uncontrolled chassis environments. |
| High-Speed Test Equipment Memory | Industrial Protocol Gateway Cache |
|
Use Scenario: Capturing real-time waveform samples in digital storage oscilloscopes and bit error rate testers. IC Role / Device Role / Timing Role: Burst-mode acquisition memory interfaced directly to high-speed ADC/DAC controllers. Use Value: 250 MHz clocking and 1.8 V HSTL I/O ensure clean signal transitions at >500 Mbps per pin, reducing sampling jitter in precision measurement systems. |
Use Scenario: Caching Modbus TCP or PROFINET frame translations in industrial edge gateways with deterministic latency requirements. IC Role / Device Role / Timing Role: Deterministic-access SRAM providing predictable read/write timing for real-time protocol stack execution. Use Value: DOFF-selectable latency allows firmware to lock into 1-cycle mode for worst-case interrupt response, while retaining DDR II mode for bulk data transfers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C33256P-25TIN | 32-Mbit (1M × 32), 25 ns async access, 3.3 V CMOS - no DDR, no burst, no echo clocks. | Used in legacy control-plane buffers where timing determinism is less critical than cost. | Select only if system lacks DDR clock infrastructure and tolerates higher latency and lower bandwidth. |
| IS61WV102432BLL-15BLI | 32-Mbit (1M × 32), 15 ns async, 3.3 V LVTTL - no DDR, no JTAG, no ZQ calibration. | Fits cost-sensitive industrial controllers needing simple parallel SRAM without high-speed timing constraints. | Choose only when design does not require source-synchronous timing, burst efficiency, or production testability via JTAG. |
Compared with AS7C33256P-25TIN and IS61WV102432BLL-15BLI, CY7C1321KV18-250BZC delivers 2.2× higher effective bandwidth via DDR + burst, eliminates board-level timing skew with echo clocks, and enables production test coverage through integrated JTAG-making it uniquely suited for modern high-speed packet processing.
Availability
CY7C1321KV18-250BZC is available at Aetrix Electronics and suitable for network switch buffer memory, telecom line card packet FIFO, high-speed test equipment memory, and industrial protocol gateway cache applications requiring stable component supply across extended product lifecycles.
Supply support for CY7C1321KV18-250BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.
CY7C1321KV18 belongs to Cypress's DDR II SRAM product line, designed specifically for deterministic, high-bandwidth buffering in packet-switched infrastructure where burst efficiency, timing margin, and testability are critical.
FAQ
What is the function of the DOFF pin on CY7C1321KV18-250BZC?
The DOFF pin selects DDR latency mode: when asserted HIGH, the device operates in DDR II mode with 1.5-cycle read latency; when LOW, it reverts to DDR I mode with 1-cycle latency. This setting affects internal pipeline staging and must be held stable during operation-no dynamic switching is supported. The pin is sampled synchronously on the K clock edge at initialization.
How does ZQ calibration work on this SRAM?
ZQ calibration adjusts the output driver impedance of DQ[35:0] and CQ/CQ pins to match the system's data bus characteristic impedance. A 240 Ω resistor connected between ZQ and ground sets nominal output impedance to 60 Ω (0.2 × 240 Ω). The calibration occurs automatically at power-up and can be retriggered via JTAG instruction. Direct connection to VDDQ enables minimum impedance mode.
Can CY7C1321KV18-250BZC operate in single-clock mode?
Yes-when C and C are left unconnected or tied to VDDQ/VSS, the device uses K and K as both input and output clocks. In this mode, read data is driven on K/K rising edges, and echo clocks CQ/CQ are generated relative to K/K. Single-clock mode sacrifices deskew capability but simplifies clock distribution in less demanding applications.
What is the purpose of BWS[3:0] signals?
BWS[3:0] are active-low byte write enables that allow selective writing of 9-bit subwords within the 36-bit DQ bus. Each BWS controls one 9-bit segment: BWS0 → D[8:0], BWS1 → D[17:9], BWS2 → D[26:18], BWS3 → D[35:27]. When a BWS is HIGH, its corresponding byte remains unchanged during write cycles-enabling efficient partial updates without read-modify-write overhead.
CY7C1321KV18-250BZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, DDR II
- Memory Size:
- 18Mbit
- Memory Organization:
- 512K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 250 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1321KV18-250BZC FAQ
1.How can I place an order for CY7C1321KV18-250BZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1321KV18-250BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1321KV18-250BZC reliable?
The price and inventory of CY7C1321KV18-250BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1321KV18-250BZC is usually 5 days.
3.What payment methods are accepted for CY7C1321KV18-250BZC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1321KV18-250BZC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1321KV18-250BZC?
CY7C1321KV18-250BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1321KV18-250BZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1321KV18-250BZC?
For technical support, including CY7C1321KV18-250BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1321KV18-250BZC requirements.
6.How does Aetrix verify that CY7C1321KV18-250BZC is sourced from the original manufacturer or authorized distributors?
All CY7C1321KV18-250BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1321KV18-250BZC meets industry standards.
7.What is the process for return or replacement of CY7C1321KV18-250BZC?
All CY7C1321KV18-250BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1321KV18-250BZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1321KV18-250BZC part is unused and in its original packaging.
Return procedure for CY7C1321KV18-250BZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1321KV18-250BZC Tags

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