Cypress Semiconductor Corp CY7C1345G-100AXI
- Part No.:
- CY7C1345G-100AXI
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1345G-100AXI.pdf
- Description:
- IC SRAM 4.5MBIT PAR 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:705
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Product details
Overview
CY7C1345G-100AXI from Cypress Semiconductor is a 4-Mbit (128K × 36) flow-through synchronous SRAM with 3.3 V core supply, 2.5/3.3 V I/O supply, 8.0 ns clock-to-output delay at 100 MHz, and user-selectable Intel Pentium–compatible interleaved or linear burst sequences. It serves as secondary cache memory for high-speed microprocessors requiring glueless interface, low-latency burst reads/writes, and synchronous self-timed writes.
For engineers reviewing the CY7C1345G-100AXI datasheet, CY7C1345G-100AXI pinout, CY7C1345G-100AXI application, or CY7C1345G-100AXI equivalent, key selection criteria include burst mode control via MODE pin, ZZ sleep mode implementation, byte-write granularity (BWA–BWD), synchronous address strobes (ADSP/ADSC), and TQFP-100 package compatibility with JEDEC JESD8-5 I/O standards.
Technical Context
The CY7C1345G-100AXI implements a 2-bit on-chip wrap-around burst counter fed by A[1:0], enabling automatic address increment during burst cycles controlled by ADV. All synchronous inputs-including addresses, CE1/CE2/CE3, ADSP/ADSC, BWx, BWE, GW, and MODE-are registered on the rising edge of CLK.
Asynchronous OE enables tristate control of bidirectional DQ/DQP I/Os, while ZZ (Pin 64) must be externally tied to ground per errata. The device supports both processor-initiated (ADSP) and controller-initiated (ADSC) burst accesses, with ADSP taking priority when both strobes are active.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4 Mbit (128K × 36 bits), supporting 36-bit wide cache data paths |
| Access Time (tCO) | 8.0 ns max at 100 MHz - defines minimum clock-to-data valid window for timing closure |
| Core Supply (VDD) | 3.3 V ± 0.3 V - powers internal logic and memory array; not tolerant of 2.5 V operation |
| I/O Supply (VDDQ) | 2.5 V or 3.3 V - enables mixed-voltage system interfacing with Pentium-class processors |
| Burst Mode Control | MODE pin selects interleaved (HIGH) or linear (LOW) addressing - matches i486/Pentium vs. PowerPC-style burst protocols |
| Write Architecture | Synchronous self-timed write with global (GW) and per-byte (BWA–BWD + BWE) control - eliminates external write pulse generation |
| Power Consumption | 205 mA max operating current, 40 mA max standby - critical for thermal design in dense cache modules |
Pinout & Package
Package: 100-pin Thin Quad Flat Package (TQFP), 14 × 20 × 1.4 mm, lead-free (RoHS-compliant), with exposed thermal pad (not electrically connected).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Synchronous clock input | Rising-edge-triggered master clock for all synchronous registers and burst counter increment |
| ADSP / ADSC | Address strobe inputs | ADSP (processor) takes precedence over ADSC (controller); both latch A[1:0] into burst counter on activation |
| ADV | Burst advance control | Asserted LOW on CLK rise to auto-increment burst address; required for multi-cycle burst progression |
| MODE | Burst sequence selector | Static strap pin: HIGH = interleaved (Pentium), LOW = linear; must remain stable during operation |
| ZZ (Pin 64) | Asynchronous sleep enable | Must be externally grounded per errata (Rev. *P, p.22); floating or HIGH violates functional spec |
| DQA–DQD, DQPA–DQPD | 36-bit bidirectional I/O | Four 9-bit byte groups; direction controlled by OE; tristated automatically during writes regardless of OE state |
| BWA–BWD | Byte write select | Active-LOW per-byte masks; qualified by BWE to enable selective 9-bit writes without global write assertion |
Key Features
| Feature | Design Value |
|---|---|
| Flow-through synchronous architecture | Eliminates pipeline stalls between consecutive burst reads; supports 2-1-1-1 access rate for sustained bandwidth |
| User-selectable burst order | Hardware-mode pin (MODE) enables direct compatibility with either Intel Pentium (interleaved) or linear-burst processors without firmware change |
| Synchronous self-timed write | On-chip write sequencing removes need for external write pulse generators or timing controllers in cache subsystems |
| Separate ADSP/ADSC strobes | Enables dual-initiator systems (e.g., CPU + cache controller) with deterministic priority and independent address capture |
| JEDEC JESD8-5 I/O compliance | Guarantees interoperability with 2.5 V and 3.3 V LVTTL/LVCMOS bus interfaces without level shifters |
Applications
| High-Performance CPU Cache | Network Packet Buffer |
|---|---|
Use Scenario: Secondary cache for x86-compatible embedded processors running real-time OS with strict latency budgets. IC Role / Device Role / Timing Role: Synchronous SRAM providing 36-bit-wide burst data path with 8.0 ns tCO to meet Pentium-style 100 MHz bus timing. Use Value: Eliminates glue logic for burst address generation and write timing control, reducing PCB area and signal integrity risk. | Use Scenario: Temporary storage for variable-length Ethernet frames in Layer 2 switch ASIC support circuitry. IC Role / Device Role / Timing Role: Flow-through SRAM buffering incoming/outgoing packets with simultaneous read/write capability via separate ADSP/ADSC control. Use Value: Enables concurrent packet ingress (via ADSC) and egress (via ADSP) without arbitration logic or external FIFOs. |
| Industrial Motion Controller Memory | Avionics Data Acquisition Buffer |
Use Scenario: Real-time trajectory lookup table storage in servo drive controllers requiring deterministic access under 10 ns jitter. IC Role / Device Role / Timing Role: Synchronous cache holding interpolated motion profiles; accessed via linear burst mode for sequential memory fetch. Use Value: MODE pin strapped LOW ensures predictable linear address progression, simplifying motion profile DMA engine design. | Use Scenario: High-integrity sensor data staging before CRC validation and transmission in DO-254-compliant flight control modules. IC Role / Device Role / Timing Role: Radiation-tolerant (neutron soft error immunity documented) SRAM buffer preserving data integrity during transient events. Use Value: ZZ pin grounded per errata ensures reliable sleep-state behavior during power management transitions without data corruption. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61LV51236A-100TQLI | 512K × 36, 3.3 V only (no VDDQ flexibility), 10 ns tCO, no ZZ sleep mode | Lacks burst mode selection and asynchronous sleep; requires external write control logic | Preferred where VDDQ voltage matching is unnecessary and simpler timing margin suffices |
| AS7C3256A-10JC | 256K × 36, 3.3 V core/I/O, 10 ns tCO, no ADSP/ADSC separation or MODE pin | Single address strobe only; fixed linear burst; no processor/controller dual-initiator support | Selected for cost-sensitive designs where burst flexibility and dual-strobe control are not required |
Compared with IS61LV51236A-100TQLI and AS7C3256A-10JC, the CY7C1345G-100AXI uniquely delivers Pentium-compatible interleaved burst, dual-address-strobe arbitration, and hardware-configurable MODE selection-enabling drop-in replacement in legacy x86 cache designs without redesigning timing or control logic.
Availability
CY7C1345G-100AXI is available at Aetrix Electronics and suitable for high-speed CPU cache modules, network switching buffers, industrial motion controllers, and avionics data acquisition systems requiring stable component supply, long-lifecycle support, and RoHS-compliant packaging.
Supply support for CY7C1345G-100AXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in memory, microcontrollers, and programmable logic solutions for embedded and industrial applications.
The CY7C1345G belongs to Cypress's high-speed synchronous SRAM product line, designed specifically for secondary cache implementations in x86 and compatible microprocessor systems requiring glueless interface, burst efficiency, and deterministic timing.
FAQ
What is the correct connection for the ZZ pin on CY7C1345G-100AXI?
The ZZ pin (Pin 64) must be externally connected to ground, as specified in the Rev. *P errata (page 22). Leaving it floating or pulling it HIGH violates functional specification and may cause unpredictable sleep-mode behavior or data retention failure. The device includes an internal pull-down, but external grounding is mandatory for guaranteed operation.
Can CY7C1345G-100AXI operate with 2.5 V VDDQ while using 3.3 V VDD?
Yes. The device supports independent core and I/O supplies: VDD must be 3.3 V ± 0.3 V, while VDDQ accepts either 2.5 V ± 0.2 V or 3.3 V ± 0.3 V. This allows direct interfacing with 2.5 V processor buses without level shifters, provided VSSQ is referenced to the same ground as VSS and noise margins are verified per AC characteristics tables.
How does the MODE pin affect burst address sequencing?
The MODE pin determines burst order at initialization: HIGH selects interleaved (0→2→4→6→1→3→5→7), matching Intel Pentium processors; LOW selects linear (0→1→2→3→4→5→6→7). It is a static strap pin - changing its state mid-operation causes undefined burst behavior and must be held stable throughout device operation.
What happens if both ADSP and ADSC are asserted simultaneously?
ADSP takes unconditional priority over ADSC. When both are LOW, only ADSP is recognized - the address is latched, A[1:0] loads the burst counter, and ADSC is ignored. This priority scheme ensures deterministic behavior in systems where both CPU and cache controller could issue requests, preventing race conditions in address capture.
CY7C1345G-100AXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 8 ns
- Voltage - Supply:
- 3.15V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1345G-100AXI FAQ
1.How can I place an order for CY7C1345G-100AXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1345G-100AXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1345G-100AXI reliable?
The price and inventory of CY7C1345G-100AXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1345G-100AXI is usually 5 days.
3.What payment methods are accepted for CY7C1345G-100AXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1345G-100AXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1345G-100AXI?
CY7C1345G-100AXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1345G-100AXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1345G-100AXI?
For technical support, including CY7C1345G-100AXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1345G-100AXI requirements.
6.How does Aetrix verify that CY7C1345G-100AXI is sourced from the original manufacturer or authorized distributors?
All CY7C1345G-100AXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1345G-100AXI meets industry standards.
7.What is the process for return or replacement of CY7C1345G-100AXI?
All CY7C1345G-100AXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1345G-100AXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1345G-100AXI part is unused and in its original packaging.
Return procedure for CY7C1345G-100AXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1345G-100AXI Tags

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