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Cypress Semiconductor Corp CY7C1361C-133AXC

Part No.:
CY7C1361C-133AXC
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1361C-133AXC.pdf
Description:
IC SRAM 9MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:725

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Product details

Overview

CY7C1361C-133AXC from Infineon Technologies (formerly Cypress) is a 9-Mbit synchronous flow-through SRAM with 256K × 36 organization, designed for high-speed cache and buffer interfacing in Pentium-class microprocessor systems. It operates at 133 MHz, delivers 6.5 ns clock-to-output delay, supports dual VDDQ (2.5 V/3.3 V), and features Intel Pentium-compatible interleaved/linear burst addressing via MODE pin.

For engineers reviewing the CY7C1361C-133AXC datasheet, CY7C1361C-133AXC pinout, CY7C1361C-133AXC application, or CY7C1361C-133AXC equivalent, key selection criteria include burst sequence control (MODE), synchronous self-timed write timing, JTAG boundary-scan support (IEEE 1149.1), and compatibility with 3.3 V core / 2.5 V I/O mixed-supply systems.

Technical Context

The device implements a synchronous, clock-driven architecture where all address, data, and control inputs (except OE and ZZ) are registered on the rising edge of CLK. Burst addressing is managed by a 2-bit on-chip counter that auto-increments from the initial address captured by ADSP or ADSC strobes.

It supports two distinct burst modes-interleaved (MODE = HIGH) and linear (MODE = LOW)-and provides separate processor (ADSP) and controller (ADSC) address strobes to enable flexible system-level bus arbitration between CPU and cache controller.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 9 Mbit (256K × 36 organization), enabling full-word cache line storage for 32-bit+ systems with parity/ECC extension.
Max Clock Frequency 133 MHz - enables single-cycle access in high-bandwidth memory subsystems without wait states.
Access Time (tCO) 6.5 ns - defines minimum clock-to-output delay for timing-critical read paths in pipelined architectures.
Core Supply (VDD) 3.3 V ±5% - ensures stable operation under industrial voltage tolerances while minimizing power noise coupling.
I/O Supply (VDDQ) 2.5 V or 3.3 V - allows direct interface to either DDR/SDR logic families or legacy 3.3 V peripherals without level shifters.
Burst Control User-selectable via MODE pin - determines address increment pattern (interleaved vs. linear) required for Pentium or compatible cache coherency protocols.
JTAG Support IEEE 1149.1-compliant boundary scan - enables production testability and board-level debug without additional probe points.

Pinout & Package

Package: Pb-free 100-pin TQFP (14 × 20 × 1.4 mm), 3-chip-enable variant (A version), RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
CLK Clock input Positive-edge-triggered master timing reference for all synchronous inputs and internal burst counter.
ADSP / ADSC Address strobe (processor / controller) Initiates burst sequence; captures first address and enables internal counter; supports dual-bus arbitration.
ADV Address advance Controls internal address increment during burst; active-HIGH advances to next location in selected sequence.
MODE Burst mode select HIGH = interleaved (Pentium-compatible); LOW = linear - directly configures cache line fill behavior.
CE1 / CE2 / CE3 Chip enable inputs Three independent enables allow depth expansion across multiple SRAMs without external decoding logic.
OE Asynchronous output enable Disables DQ outputs independently of clock - enables bus sharing and low-power tri-state control.
ZZ Deep sleep mode Reduces standby current to ≤40 mA (commercial/industrial); entered asynchronously; exits synchronously on next CLK edge.
BWA–BWD / BWE Byte write enables Four 9-bit byte masks (BWA–BWD) plus global write enable (BWE) support partial-word writes without read-modify-write cycles.

Key Features

Feature Design Value
Synchronous self-timed write Eliminates external write pulse generation; internal timing ensures reliable data capture aligned to CLK edge.
Dual VDDQ support (2.5 V / 3.3 V) Enables seamless integration into mixed-voltage systems - e.g., 3.3 V core with 2.5 V DDR I/O rails.
JEDEC JESD8-5 I/O compatibility Guarantees interoperability with standard LVTTL and LVCMOS logic families across temperature and voltage ranges.
On-chip burst counter with CLR Automatically generates sequential addresses during burst; reset via internal logic prevents address wrap errors.
Separate ADSP/ADSC strobes Allows concurrent CPU and cache controller access to shared SRAM without bus contention or arbitration logic.

Applications

High-Performance CPU Cache Network Packet Buffer

Use Scenario: L2 cache for x86-compatible embedded processors operating at ≥100 MHz bus speeds.

IC Role / Device Role / Timing Role: Flow-through SRAM providing zero-wait-state burst reads/writes synchronized to processor clock domain.

Use Value: 6.5 ns tCO and 2-1-1-1 access rate sustain sustained bandwidth >1.0 GB/s for 32-byte cache lines.

Use Scenario: Temporary storage for variable-length Ethernet frames in Layer 2 switching ASICs.

IC Role / Device Role / Timing Role: Synchronous buffer with byte-selectable writes (BWA–BWD) enabling efficient frame header/body updates.

Use Value: Dual VDDQ support allows direct connection to 2.5 V PHY interfaces while maintaining 3.3 V core integrity.

Industrial Motion Controller Memory Avionics Data Acquisition Buffer

Use Scenario: Real-time position interpolation table storage in servo drive firmware with deterministic latency.

IC Role / Device Role / Timing Role: Deterministic-access SRAM with ZZ sleep mode for low-power idle periods between motion cycles.

Use Value: ≤40 mA CMOS standby current and asynchronous ZZ entry/exit meet IEC 61800-5-1 energy efficiency requirements.

Use Scenario: Buffered acquisition of sensor telemetry (e.g., ADC samples, IMU data) in DO-254-certifiable avionics modules.

IC Role / Device Role / Timing Role: Radiation-tolerant SRAM (neutron soft error immunity documented) with JTAG test access for traceable verification.

Use Value: IEEE 1149.1 boundary scan enables full interconnect testing per DO-254 tool qualification requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous burst SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IS61WV102432BLL-133TQLI 1024K × 32 organization, 3.3 V only VDDQ, no MODE pin - fixed linear burst only. Lacks interleaved burst mode; requires external logic for Pentium-compatible cache line fills. Select when system uses linear-only burst protocol and lower density (32-bit) word width suffices.
AS7C31026B-133BIN 1M × 32 organization, 3.3 V VDD/VDDQ, no JTAG, no ZZ sleep mode, tCO = 7.0 ns. No boundary-scan testability or deep-sleep capability; higher standby current (65 mA). Choose for cost-sensitive industrial designs where JTAG and ultra-low standby are non-critical.

Compared with IS61WV102432BLL-133TQLI and AS7C31026B-133BIN, the CY7C1361C-133AXC uniquely combines Pentium-compatible interleaved burst, dual-VDDQ flexibility, IEEE 1149.1 testability, and ZZ sleep - making it optimal for certified, high-reliability, mixed-voltage cache subsystems.

Availability

CY7C1361C-133AXC is available at Aetrix Electronics and suitable for high-speed CPU cache, network packet buffering, and industrial motion control applications requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.

Supply support for CY7C1361C-133AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains its high-performance memory portfolio, including synchronous SRAMs engineered for deterministic timing and system-level integration.

This device belongs to the Cypress Flow-Through SRAM product line, originally developed for glueless interfacing with Pentium-class microprocessors and optimized for cache, buffer, and FIFO applications demanding sub-7 ns access and burst predictability.

FAQ

What is the function of the MODE pin on CY7C1361C-133AXC?

The MODE pin selects burst address sequencing: HIGH configures interleaved mode (required for Intel Pentium-compatible cache line fills), while LOW enables linear mode. This setting directly controls the on-chip 2-bit counter's increment pattern and must be held stable during burst initiation via ADSP or ADSC.

Can CY7C1361C-133AXC operate with 2.5 V I/O while using 3.3 V core supply?

Yes. The device supports independent VDD (3.3 V ±5%) and VDDQ (2.5 V or 3.3 V) supplies. When VDDQ = 2.5 V, all DQ, DQP, and control outputs (except CLK, ZZ, MODE) comply with 2.5 V LVTTL levels, enabling direct interface to 2.5 V logic without level shifters.

Does CY7C1361C-133AXC support JTAG boundary scan in all package variants?

JTAG (IEEE 1149.1) is supported in the 119-ball BGA (2-CE, with TDO/TDI/TCK/TMS pins) and 165-ball FBGA packages. The 100-pin TQFP variant does not include dedicated JTAG pins and therefore lacks boundary-scan functionality per the datasheet pinout diagrams.

How does the ZZ (sleep) mode affect timing behavior during wake-up?

ZZ mode reduces standby current to ≤40 mA. Exit from ZZ is synchronous: the first rising CLK edge after ZZ returns HIGH initiates internal recovery; valid data appears on DQ after tHZPX (max 25 ns) and subsequent accesses follow normal timing parameters - no additional initialization delay is required.

CY7C1361C-133AXC Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
100-LQFP
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
9Mbit
Memory Organization:
256K x 36
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
6.5 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1361C-133AXC FAQ

1.How can I place an order for CY7C1361C-133AXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1361C-133AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1361C-133AXC reliable?

The price and inventory of CY7C1361C-133AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1361C-133AXC is usually 5 days.

3.What payment methods are accepted for CY7C1361C-133AXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1361C-133AXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1361C-133AXC?

CY7C1361C-133AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1361C-133AXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1361C-133AXC?

For technical support, including CY7C1361C-133AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1361C-133AXC requirements.

6.How does Aetrix verify that CY7C1361C-133AXC is sourced from the original manufacturer or authorized distributors?

All CY7C1361C-133AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1361C-133AXC meets industry standards.

7.What is the process for return or replacement of CY7C1361C-133AXC?

All CY7C1361C-133AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1361C-133AXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1361C-133AXC part is unused and in its original packaging.

Return procedure for CY7C1361C-133AXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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