Cypress Semiconductor Corp CY7C1363C-133AXC
- Part No.:
- CY7C1363C-133AXC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1363C-133AXC.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:339
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Product details
Overview
CY7C1363C-133AXC from Infineon Technologies (formerly Cypress) is a 9-Mbit synchronous flow-through SRAM with 512K × 18 organization, designed for high-speed cache and buffer interfacing in Pentium-class microprocessor systems. It supports 133 MHz bus operation with 6.5 ns clock-to-output delay, operates on 3.3 V core supply (±5%/+10%), and features dual VDDQ options (2.5 V or 3.3 V) for I/O compatibility.
For engineers reviewing the CY7C1363C-133AXC datasheet, CY7C1363C-133AXC pinout, CY7C1363C-133AXC application, or CY7C1363C-133AXC equivalent, key selection criteria include burst sequence mode (interleaved/linear), chip enable configuration (3-CE TQFP), JTAG boundary scan support, and ZZ sleep mode timing compliance.
Technical Context
The device implements a synchronous, clock-driven architecture with positive-edge-triggered CLK controlling all address, data, and control inputs except OE and ZZ. A 2-bit on-chip burst counter captures the initial address and auto-increments for subsequent burst cycles, supporting Intel Pentium–compatible interleaved or linear sequences via the MODE pin.
Burst initiation is selectable between processor (ADSP) and controller (ADSC) address strobes, with address advancement governed by the ADV signal. Write operations are self-timed and synchronous, while output enable (OE) remains asynchronous-enabling precise output gating independent of clock phase.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 9 Mbit (512K × 18), enabling compact high-bandwidth buffering for 18-bit data buses. |
| Max Clock Frequency | 133 MHz - defines maximum sustained burst throughput of 2.39 Gb/s (133 MHz × 18-bit). |
| Access Time (tCO) | 6.5 ns - guarantees sub-8 ns valid data window at 133 MHz, critical for tight setup/hold timing margins. |
| VDD Supply Range | 3.3 V ±5% / +10% - accommodates industrial power rail tolerances without regulation overhead. |
| VDDQ Options | 2.5 V or 3.3 V - allows direct interface to mixed-voltage SoCs or legacy 2.5 V logic without level shifters. |
| Burst Mode Control | MODE pin selects interleaved (HIGH) or linear (LOW) addressing - matches specific CPU cache line fetch patterns. |
| Sleep Mode | ZZ pin enables low-power standby drawing ≤40 mA - reduces system idle power in burst-oriented applications. |
Pinout & Package
Package: Pb-free 100-pin TQFP (14 × 20 × 1.4 mm), 3-chip-enable variant (A version), RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Positive-edge-triggered system clock input | Synchronizes all register-controlled inputs (addresses, CE, BW, GW, ADSP/ADSC, ADV, MODE); defines timing reference for tCO and access cycle. |
| ADSP / ADSC | Address strobe inputs (processor / controller) | Selects burst initiator source; both are synchronous inputs registered on CLK edge - determines which subsystem triggers memory access. |
| ADV | Address advancement control | Drives internal burst counter increment; HIGH enables auto-addressing for sequential burst reads/writes after first address capture. |
| MODE | Burst sequence configuration | HIGH = interleaved (0,2,4,6… then 1,3,5,7…); LOW = linear (0,1,2,3…) - must match CPU's cache line ordering protocol. |
| CE1 / CE2 / CE3 | Chip enable inputs (3-CE option) | Enable hierarchical depth expansion; CE1 primary, CE2/CE3 for bank selection - supports multi-SRAM stacking without external decode logic. |
| ZZ | Deep power-down control | Asynchronous active-low entry into low-current sleep mode (≤40 mA); retains data but halts clock-sensitive operations until deasserted. |
| OE | Asynchronous output enable | Directly gates output drivers independent of CLK - enables precise read-data masking during partial bus cycles or contention avoidance. |
| DQA–DQD / DQPA–DQPD | Data I/O and parity terminals | 18-bit data + 4-bit parity (22 total); DQx = main data, DQP x = parity bits - supports ECC-capable systems without external logic. |
Key Features
| Feature | Design Value |
|---|---|
| Flow-through synchronous architecture | Eliminates pipeline latency between consecutive burst accesses - delivers 2-1-1-1 access rate for sustained bandwidth. |
| User-selectable burst sequence | Hardware-mode pin (MODE) configures interleaved or linear addressing to match exact CPU cache controller behavior. |
| Separate ADSP/ADSC strobes | Enables coexistence of CPU and cache controller on same bus - avoids arbitration logic in dual-master systems. |
| IEEE 1149.1 JTAG boundary scan | Supports production test and board-level diagnostics without additional test points - verified per JESD78 compliance. |
| Flexible I/O voltage (VDDQ) | 2.5 V or 3.3 V selection allows drop-in replacement in mixed-voltage designs - no external level translation required. |
Applications
| Level-1 Cache Buffer | Network Packet Buffer |
|---|---|
|
Use Scenario: High-speed L1 cache extension for embedded x86-compatible processors requiring zero-wait-state burst access. IC Role / Device Role / Timing Role: Flow-through SRAM providing 133 MHz synchronous read/write with 6.5 ns tCO to meet Pentium-class timing budgets. Use Value: Eliminates glue logic for address pipelining and burst sequencing - reduces PCB area and signal integrity complexity. |
Use Scenario: Temporary storage for variable-length Ethernet frames in Layer-2 switching ASICs with burst-oriented DMA engines. IC Role / Device Role / Timing Role: Synchronous buffer accepting back-to-back 18-bit data bursts from MAC layer with programmable burst length. Use Value: Dual VDDQ support enables direct interface to 2.5 V PHY and 3.3 V control logic - lowers BOM count and power conversion loss. |
| Industrial PLC Memory Module | Radar Signal Processing FIFO |
|
Use Scenario: Deterministic data logging buffer in safety-critical PLCs where burst write reliability and low standby current are mandatory. IC Role / Device Role / Timing Role: SRAM with ZZ sleep mode (≤40 mA) and JTAG testability - meets IEC 61508 hardware fault tolerance requirements. Use Value: Asynchronous OE and synchronous writes allow atomic frame capture without clock-domain crossing logic - improves data integrity. |
Use Scenario: Real-time FIFO for ADC sample streams in automotive radar ECU, requiring jitter-free burst reads under temperature variation. IC Role / Device Role / Timing Role: 133 MHz flow-through SRAM with 3.3 V ±10% VDD tolerance - maintains timing margin across –40°C to +105°C industrial range. Use Value: Interleaved burst mode aligns with FFT engine's memory access pattern - increases effective throughput by 18% vs. linear addressing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous burst SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61WV51218BLL-133TQLI | 512K × 18, 133 MHz, 3.3 V core, but lacks JTAG and ZZ sleep mode; uses different burst control (BWS instead of MODE/ADV). | No built-in boundary scan or deep-sleep - unsuitable for safety-certified or ultra-low-power standby systems. | Prefer CY7C1363C-133AXC when JTAG testability or <40 mA standby is required. |
| AS7C351218A-133BIN | 512K × 18, 133 MHz, 3.3 V, supports linear bursts only; no interleaved mode or separate ADSP/ADSC strobes. | Cannot emulate Pentium-style cache line fetch - incompatible with legacy x86 co-processors requiring interleaved addressing. | Choose CY7C1363C-133AXC for Intel-compatible burst protocols or dual-strobe controller integration. |
Compared with IS61WV51218BLL-133TQLI and AS7C351218A-133BIN, the CY7C1363C-133AXC uniquely combines JTAG testability, ZZ sleep mode, and hardware-selectable interleaved/linear burst modes - making it the only option qualified for certified industrial control and legacy x86 cache extension designs.
Availability
CY7C1363C-133AXC is available at Aetrix Electronics and suitable for high-reliability industrial control systems, automotive radar ECUs, network switching buffers, and legacy x86-compatible embedded computing platforms requiring stable component supply over extended product lifecycles.
Supply support for CY7C1363C-133AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains full product continuity, technical support, and long-term supply commitment for the former Cypress SRAM portfolio.
This device belongs to the CY7C136x family of high-speed synchronous flow-through SRAMs, engineered specifically for cache and buffer applications in microprocessor-based systems requiring deterministic burst timing and minimal interface logic.
FAQ
What is the function of the MODE pin on CY7C1363C-133AXC?
The MODE pin selects burst address sequencing: HIGH configures interleaved mode (0,2,4,6,1,3,5,7), matching Intel Pentium cache line fetch order; LOW selects linear mode (0,1,2,3,4,5,6,7). This hardware-selectable feature eliminates need for external mode configuration logic and ensures compatibility with specific CPU architectures.
Does CY7C1363C-133AXC support JTAG boundary scan, and how is it enabled?
Yes, it implements IEEE 1149.1 JTAG boundary scan using dedicated TDI, TDO, TCK, and TMS pins. JTAG is enabled by default; to disable it, tie TMS to VDD and apply a TAP reset sequence. The boundary scan chain covers all I/O pins and internal registers, supporting production test and board-level diagnostics per JESD78.
How does the ZZ (sleep) mode affect data retention and wake-up timing?
In ZZ mode (ZZ = LOW), the device enters deep power-down, drawing ≤40 mA while retaining all stored data. Wake-up occurs synchronously on ZZ deassertion (HIGH) followed by one CLK cycle - no additional stabilization delay is required, and the next valid access may begin immediately after the first post-wake clock edge.
Can CY7C1363C-133AXC operate with 2.5 V I/O while using 3.3 V core supply?
Yes - VDD is fixed at 3.3 V ±5%/+10%, while VDDQ is independently configurable for either 2.5 V or 3.3 V. This allows direct connection to 2.5 V FPGAs or ASICs without level shifters, while maintaining full 133 MHz performance and 6.5 ns tCO, as validated in the datasheet's AC switching characteristics tables.
CY7C1363C-133AXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 9Mbit
- Memory Organization:
- 512K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 6.5 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1363C-133AXC FAQ
1.How can I place an order for CY7C1363C-133AXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1363C-133AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1363C-133AXC reliable?
The price and inventory of CY7C1363C-133AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1363C-133AXC is usually 5 days.
3.What payment methods are accepted for CY7C1363C-133AXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1363C-133AXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1363C-133AXC?
CY7C1363C-133AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1363C-133AXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1363C-133AXC?
For technical support, including CY7C1363C-133AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1363C-133AXC requirements.
6.How does Aetrix verify that CY7C1363C-133AXC is sourced from the original manufacturer or authorized distributors?
All CY7C1363C-133AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1363C-133AXC meets industry standards.
7.What is the process for return or replacement of CY7C1363C-133AXC?
All CY7C1363C-133AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1363C-133AXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1363C-133AXC part is unused and in its original packaging.
Return procedure for CY7C1363C-133AXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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