Cypress Semiconductor Corp CY7C1370KV33-167BZXC
- Part No.:
- CY7C1370KV33-167BZXC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1370KV33-167BZXC.pdf
- Description:
- IC SRAM 18MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:692
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Product details
Overview
CY7C1370KV33-167BZXC from Cypress Semiconductor is a 18-Mbit (512K × 36) pipelined synchronous SRAM with NoBL™ architecture and on-chip ECC, designed for high-throughput memory subsystems in networking and telecom line cards. It operates at 167 MHz with 3.4 ns access time, supports zero-wait-state back-to-back read/write cycles, and uses 3.3 V core (VDD) and 3.3 V/2.5 V I/O (VDDQ) supplies.
For engineers reviewing the CY7C1370KV33-167BZXC datasheet, CY7C1370KV33-167BZXC pinout, CY7C1370KV33-167BZXC application, or CY7C1370KV33-167BZXC equivalent, key selection factors include its 100-pin TQFP package, synchronous self-timed write control, byte-write capability across four 9-bit data groups (DQa–DQd + DQPa–DQPd), and JTAG-compliant boundary scan support for system-level testability.
Technical Context
This SRAM implements fully registered pipelined operation: all address, control, and data inputs are latched on the rising edge of CLK, and all outputs are driven through output registers synchronized to the same clock edge. The internal burst logic supports both linear and interleaved burst orders, selected via the MODE strap pin.
It integrates on-chip ECC encoding/decoding to detect and correct single-bit errors, reducing soft error rate in radiation-sensitive environments. Synchronous self-timed writes eliminate external write pulse timing constraints, while the ZZ sleep input provides asynchronous power-down control independent of clock state.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 18 Mbit (512K × 36 organization), enabling full-word parallel access for 36-bit data buses |
| Max Clock Frequency | 167 MHz - guarantees sustained 167 million true back-to-back operations per second |
| Access Time | 3.4 ns - defines minimum clock-to-output delay for timing-critical synchronous systems |
| VDD / VDDQ | 3.3 V core / 3.3 V or 2.5 V I/O - allows interoperability with mixed-voltage ASIC/FPGA interfaces |
| ECC Support | On-chip single-bit error correction - eliminates need for external ECC logic in mission-critical storage buffers |
| Burst Capability | Linear or interleaved burst order - configurable via MODE pin to match host processor's burst pattern |
| Package | 100-pin TQFP (14 × 20 × 1.4 mm), Pb-free, JEDEC-standard - compatible with standard SMT reflow profiles |
Pinout & Package
Package: 100-pin TQFP (14 mm × 20 mm × 1.4 mm), RoHS-compliant, surface-mount.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Synchronous address input | Latched on rising CLK edge; selects one of 524,288 memory locations (512K) |
| BWa–BWd | Synchronous byte write enable (active LOW) | Each controls 9-bit data group: BWa→DQa/DQPa, BWb→DQb/DQPb, etc. |
| CLK / CEN | Clock input / clock enable | CEN masks CLK without deselecting device-enables cycle extension for timing margin |
| CE1, CE2, CE3 | Synchronous chip enables | Three-input decode (CE1=L, CE2=H, CE3=L) enables bank selection in multi-SRAM systems |
| DQa–DQd, DQPa–DQPd | Bidirectional data I/O (36 data + 4 parity) | Full 36-bit word interface with dedicated parity bits per 9-bit byte group |
| ZZ | Asynchronous sleep input (active HIGH) | Places device in low-power state independent of clock or control signals |
Key Features
| Feature | Design Value |
|---|---|
| NoBL™ Architecture | Enables unlimited true back-to-back read/write operations with zero wait states-eliminates bus latency in packet buffering |
| Synchronous Self-timed Writes | Removes dependency on external write pulse width; simplifies timing closure in high-speed PCB layouts |
| IEEE 1149.1 JTAG Boundary Scan | Supports IEEE-compliant structural testing of interconnects without requiring functional test vectors |
| Byte Write Selects (4×) | Allows partial-word updates without read-modify-write cycles-critical for header manipulation in network processors |
| MODE Strap Configuration | Hardware-selectable burst order (linear/interleaved) matches legacy or modern CPU cache line patterns |
Applications
| Telecom Line Cards | Network Packet Buffers |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in carrier-grade switches. IC Role / Device Role / Timing Role: High-bandwidth, low-latency shared memory buffer interfacing directly with multiple SerDes lanes and traffic managers. Use Value: 167 MHz pipelined throughput and zero-wait-state operation sustain >5 Gbps aggregate packet processing without stalling the data path. |
Use Scenario: Deep packet inspection engines requiring rapid access to packet headers and payloads. IC Role / Device Role / Timing Role: Dual-port accessible SRAM used as scratchpad memory for signature matching and classification lookups. Use Value: On-chip ECC ensures data integrity during long-duration packet buffering in thermally stressed chassis environments. |
| Radar Signal Processing | Industrial PLC Memory Modules |
|
Use Scenario: Real-time FFT and beamforming buffers in phased-array radar front-ends. IC Role / Device Role / Timing Role: Burst-accessed memory staging raw ADC samples and intermediate computation results between FPGA DSP blocks. Use Value: Interleaved burst mode aligns with FFT memory access patterns, reducing average latency by up to 30% vs. linear addressing. |
Use Scenario: Deterministic I/O mapping and program storage in safety-critical programmable logic controllers. IC Role / Device Role / Timing Role: Nonvolatile-configurable SRAM serving as configuration RAM and real-time tag database. Use Value: ZZ sleep mode reduces standby power to <100 µA-enabling fanless, sealed enclosure designs compliant with IEC 61131-2. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C331024B-167BIN | 18-Mbit (1M × 18), no ECC, 165-ball FBGA only, no JTAG | Lacks on-chip ECC and boundary scan-requires external error handling and board-level test planning | Preferred where cost sensitivity outweighs reliability requirements and footprint allows FBGA |
| IS61WV102436BLL-167TQLI | 18-Mbit (512K × 36), no ECC, 100-pin TQFP, supports 200 MHz max | Higher speed grade but no error correction-unsuitable for radiation-prone or long MTBF systems | Valid drop-in replacement for non-ECC designs needing marginally higher bandwidth |
Compared with AS7C331024B-167BIN and IS61WV102436BLL-167TQLI, CY7C1370KV33-167BZXC uniquely delivers ECC protection and JTAG testability in the same 100-pin TQFP footprint-critical for telecom and defense applications where field reliability and production test coverage are mandatory.
Availability
CY7C1370KV33-167BZXC is available at Aetrix Electronics and suitable for telecom line cards, network packet buffers, radar signal processing, and industrial PLC memory modules requiring stable component supply across extended product lifecycles.
Supply support for CY7C1370KV33-167BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.
CY7C1370KV33-167BZXC belongs to Cypress's NoBL™ SRAM product line, engineered specifically for deterministic, low-latency memory subsystems in infrastructure equipment where bus efficiency and data integrity are non-negotiable.
FAQ
What is the function of the MODE pin on CY7C1370KV33-167BZXC?
The MODE pin is a strap input that configures burst address sequencing: tied HIGH it selects interleaved burst order, pulled LOW it selects linear burst order. It must be held static during operation and defaults to HIGH if left floating-ensuring predictable boot-time behavior without external configuration logic.
Does CY7C1370KV33-167BZXC require external termination resistors on DQ lines?
No. The device incorporates programmable output drive strength and on-die termination (ODT) support via internal impedance control circuitry, eliminating the need for discrete series or parallel termination resistors on data bus traces-reducing BOM count and PCB area.
How does the ZZ pin interact with CEN and clock gating?
ZZ is asynchronous and overrides all clock-domain logic: asserting ZZ HIGH forces immediate entry into low-power sleep mode regardless of CEN or CLK state. Unlike CEN-which extends the current cycle-ZZ disables internal clocks, memory array biasing, and I/O drivers, reducing ICC to <100 µA.
Can CY7C1370KV33-167BZXC operate with 2.5 V VDDQ while using 3.3 V VDD?
Yes. The device supports mixed I/O voltage operation: VDD must be 3.3 V ± 0.3 V, while VDDQ may be independently set to either 3.3 V or 2.5 V to interface with corresponding FPGA/ASIC I/O banks-verified per AC/DC electrical specifications in the datasheet.
CY7C1370KV33-167BZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- NoBL™
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 18Mbit
- Memory Organization:
- 512K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 167 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.4 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1370KV33-167BZXC FAQ
1.How can I place an order for CY7C1370KV33-167BZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1370KV33-167BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1370KV33-167BZXC reliable?
The price and inventory of CY7C1370KV33-167BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1370KV33-167BZXC is usually 5 days.
3.What payment methods are accepted for CY7C1370KV33-167BZXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1370KV33-167BZXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1370KV33-167BZXC?
CY7C1370KV33-167BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1370KV33-167BZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1370KV33-167BZXC?
For technical support, including CY7C1370KV33-167BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1370KV33-167BZXC requirements.
6.How does Aetrix verify that CY7C1370KV33-167BZXC is sourced from the original manufacturer or authorized distributors?
All CY7C1370KV33-167BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1370KV33-167BZXC meets industry standards.
7.What is the process for return or replacement of CY7C1370KV33-167BZXC?
All CY7C1370KV33-167BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1370KV33-167BZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1370KV33-167BZXC part is unused and in its original packaging.
Return procedure for CY7C1370KV33-167BZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1370KV33-167BZXC Tags

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STMicroelectronics
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Microchip Technology

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Microchip Technology
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STMicroelectronics

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