Cypress Semiconductor Corp CY7C1371KVE33-133AXI
- Part No.:
- CY7C1371KVE33-133AXI
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1371KVE33-133AXI.pdf
- Description:
- IC SRAM 18MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:413
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Product details
Overview
CY7C1371KVE33-133AXI from Cypress Semiconductor is a 18-Mbit synchronous flow-through SRAM with NoBL™ architecture and on-chip ECC, configured as 512K × 36 or 1M × 18. It supports true back-to-back read/write operations at 133 MHz with zero wait states, 6.5 ns clock-to-output delay, and 3.3 V/2.5 V I/O (VDDQ) for high-throughput memory buffering in network packet processors and telecom line cards.
For engineers reviewing the CY7C1371KVE33-133AXI datasheet, CY7C1371KVE33-133AXI pinout, CY7C1371KVE33-133AXI application, or CY7C1371KVE33-133AXI equivalent, key selection criteria include burst order control (linear/interleaved), synchronous byte write capability (BWA–BWD), ZZ sleep mode for low-power standby, and ECC-enabled soft error resilience in mission-critical systems.
Technical Context
The device implements a fully synchronous interface with registered inputs sampled on the rising edge of CLK, qualified by CEN. All reads and writes are self-timed internally-eliminating external OE timing constraints and enabling deterministic 133 MHz operation without dead cycles between consecutive accesses.
It integrates dual-burst logic (linear or interleaved via MODE pin), on-chip ECC encoding/decoding for single-bit correction and double-bit detection, and three chip enables (CE1 active-low, CE2 active-high, CE3 active-low) for flexible bank expansion in multi-SRAM configurations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 18 Mbit (512K × 36 or 1M × 18 configuration) |
| Max Clock Frequency | 133 MHz - enables continuous data transfer on every clock cycle without wait states |
| Access Time (tAC) | 6.5 ns - defines maximum clock-to-valid-output delay for timing-critical read paths |
| ECC Support | On-chip SEC-DED - corrects single-bit errors and detects double-bit errors to reduce SER in radiation-prone environments |
| I/O Voltage (VDDQ) | 3.3 V or 2.5 V - allows interoperability with both legacy and low-voltage system buses |
| Burst Order | Selectable linear or interleaved via MODE pin strap - matches CPU or ASIC burst addressing patterns |
| Power-Down Mode | ZZ sleep input (asynchronous, active-HIGH) - reduces standby current while preserving data integrity |
Pinout & Package
Package: 100-pin JEDEC-standard Pb-free TQFP (14 × 20 × 1.4 mm), RoHS-compliant, with exposed thermal pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK, CEN | Synchronous clock control | CLK sampled only when CEN = LOW; CEN deassertion extends previous cycle without deselection |
| A[1:0], ADV/LD | Burst address generation | A[1:0] feed 2-bit counter; ADV/LD HIGH advances counter, LOW loads new address |
| BWA–BWD, WE | Byte-level write control | Four independent active-LOW byte enables qualified by WE for granular 8-bit writes |
| CE1, CE2, CE3 | Chip select logic | Three enables (CE1/CE3 active-LOW, CE2 active-HIGH) enable depth expansion up to 8 banks |
| DQ[A:D], DQP[A:D] | Data/parity I/O | 36-bit data + 4-bit parity bus; direction controlled by OE; automatically tristated during write data phase |
| MODE, ZZ, OE | Configuration & control | MODE selects burst order; ZZ enables non-critical sleep; OE is asynchronous but masked during writes |
Key Features
| Feature | Design Value |
|---|---|
| No Bus Latency (NoBL™) architecture | Eliminates dead cycles between read/write transitions-enables 100% bus utilization at 133 MHz |
| Synchronous self-timed writes | Removes external write pulse timing constraints-simplifies controller design and improves timing margin |
| Registered inputs with clock qualification | All address, control, and data inputs latched on CLK rising edge-ensures setup/hold compliance across PVT |
| Byte write capability with four BW pins | Enables independent 8-bit writes to any byte lane-reduces bus traffic and avoids full-word overwrites |
| Automatic output tristating during writes | Prevents bus contention without external logic-guarantees clean data steering in shared-memory systems |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in switching ASICs with strict latency budgets. IC Role / Device Role / Timing Role: High-speed flow-through SRAM acting as first-level packet buffer with zero-wait-state read/write turnaround. Use Value: 6.5 ns tAC and NoBL™ architecture ensure sub-8 ns round-trip access-critical for 10G+ line-rate processing. |
Use Scenario: Frame buffering in SONET/SDH framer modules requiring burst-aligned data transfers and ECC protection. IC Role / Device Role / Timing Role: Synchronous burst SRAM interfacing directly to framer DSPs with interleaved burst addressing. Use Value: Interleaved burst mode (via MODE pin) matches framer's native address sequence-reducing address generation overhead. |
| Radar Signal Processing Buffer | Industrial PLC Data Logging |
|
Use Scenario: Temporary storage of digitized RF samples in phased-array radar systems operating in harsh EMI environments. IC Role / Device Role / Timing Role: ECC-equipped SRAM providing soft-error-resilient memory for real-time signal buffers. Use Value: On-chip SEC-DED ECC reduces uncorrectable errors by >99.9% under neutron flux-meeting DO-254 avionics requirements. |
Use Scenario: Reliable cyclic data logging in programmable logic controllers where power interruptions may occur. IC Role / Device Role / Timing Role: Low-power standby SRAM using ZZ sleep mode to retain data during brownouts. Use Value: ZZ mode reduces standby current to <50 µA while preserving contents-extending backup capacitor hold-up time. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous burst SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V2115L133PF | 18-Mbit (512K × 36), 133 MHz, no on-chip ECC, supports ZBT™ but not NoBL™ | Lacks hardware ECC-requires external error handling or software mitigation | Choose when ECC is unnecessary and ZBT™ compatibility is prioritized over NoBL™ throughput |
| ISSI IS61WV102436BLL-133TQLI | 18-Mbit (512K × 36), 133 MHz, no ECC, supports linear burst only, different pinout (119-ball BGA) | Non-pin-compatible; requires PCB redesign; no ZZ sleep or MODE-selectable burst order | Choose only if footprint change is acceptable and ECC/sleep features are not required |
Compared with IDT72V2115L133PF and IS61WV102436BLL-133TQLI, CY7C1371KVE33-133AXI uniquely delivers integrated ECC, selectable burst order, and NoBL™-enabled zero-latency operation-making it optimal for safety-critical or latency-sensitive designs where reliability and throughput are co-constrained.
Availability
CY7C1371KVE33-133AXI is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, and radar signal processing requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for CY7C1371KVE33-133AXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.
CY7C1371KVE33-133AXI belongs to Cypress's NoBL™ SRAM product line, engineered specifically for systems demanding deterministic, high-bandwidth memory access with built-in data integrity-targeting networking infrastructure and real-time signal processing.
FAQ
What is the function of the MODE pin on CY7C1371KVE33-133AXI?
The MODE pin is a static configuration input that selects burst addressing order: tied to GND for linear burst (0,1,2,3…), or to VDD/floating for interleaved burst (0,2,4,6…,1,3,5,7…). It is sampled at power-up and remains fixed during operation-no dynamic reconfiguration is supported.
Does CY7C1371KVE33-133AXI require an external clock buffer for 133 MHz operation?
No. The device accepts a clean, single-ended CMOS clock directly at the CLK pin. Input timing specifications assume 1.5 ns max skew and 40–60% duty cycle; no external buffering is needed unless board-level skew exceeds these limits or multiple devices share a daisy-chained clock tree.
How does the ZZ sleep mode interact with data retention and wake-up timing?
In ZZ mode (pin driven HIGH), core power drops significantly while VDD and VDDQ remain powered; data is retained indefinitely as long as supply voltages stay within operating range. Wake-up is asynchronous and complete within one CLK cycle after ZZ returns LOW-no initialization sequence is required.
Can CY7C1371KVE33-133AXI operate in 1M × 18 mode without hardware modification?
Yes. The 512K × 36 / 1M × 18 configuration is determined solely by address mapping: using A[18:0] addresses 1M × 18; using A[18:1] with A0 ignored maps to 512K × 36. No strapping or register setting is needed-the same physical device supports both modes via controller address decoding.
CY7C1371KVE33-133AXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- NoBL™
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 18Mbit
- Memory Organization:
- 512K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 6.5 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1371KVE33-133AXI FAQ
1.How can I place an order for CY7C1371KVE33-133AXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1371KVE33-133AXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1371KVE33-133AXI reliable?
The price and inventory of CY7C1371KVE33-133AXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1371KVE33-133AXI is usually 5 days.
3.What payment methods are accepted for CY7C1371KVE33-133AXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1371KVE33-133AXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1371KVE33-133AXI?
CY7C1371KVE33-133AXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1371KVE33-133AXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1371KVE33-133AXI?
For technical support, including CY7C1371KVE33-133AXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1371KVE33-133AXI requirements.
6.How does Aetrix verify that CY7C1371KVE33-133AXI is sourced from the original manufacturer or authorized distributors?
All CY7C1371KVE33-133AXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1371KVE33-133AXI meets industry standards.
7.What is the process for return or replacement of CY7C1371KVE33-133AXI?
All CY7C1371KVE33-133AXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1371KVE33-133AXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1371KVE33-133AXI part is unused and in its original packaging.
Return procedure for CY7C1371KVE33-133AXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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