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Cypress Semiconductor Corp CY7C1381D-133AXC
- Part No.:
- CY7C1381D-133AXC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1381D-133AXC.pdf
- Description:
- IC SRAM 18MBIT PARALLEL 100TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,011
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Product details
Overview
CY7C1381D-133AXC from Cypress Semiconductor is a 18-Mbit synchronous flow-through SRAM with 512K × 36 organization, supporting 133 MHz bus operations, 3.3 V core supply (VDD), 2.5 V/3.3 V I/O supply (VDDQ), and 6.5 ns clock-to-output delay. It features JEDEC-standard 100-pin TQFP packaging and is designed for high-speed cache and buffer applications in Pentium-class microprocessor systems.
For engineers reviewing the CY7C1381D-133AXC datasheet, CY7C1381D-133AXC pinout, CY7C1381D-133AXC application, or CY7C1381D-133AXC equivalent, key selection criteria include burst mode support (interleaved/linear), synchronous self-timed write capability, separate ADSP/ADSC address strobes, ZZ sleep mode, and JTAG boundary-scan compliance for system-level testability.
Technical Context
The CY7C1381D-133AXC implements a synchronous architecture with positive-edge-triggered CLK controlling all synchronous inputs-address, chip enables (CE1/CE2/CE3), burst controls (ADSP/ADSC/ADV), byte writes (BWA–BWD/BWE), and global write (GW). A 2-bit on-chip burst counter captures A[1:0] at first access and auto-increments for subsequent burst addresses.
Asynchronous functions include OE-controlled output enable and ZZ-driven sleep mode. The device supports dual I/O voltage domains (VDD = 3.3 V, VDDQ = 2.5 V or 3.3 V), IEEE 1149.1 JTAG boundary scan (with BYPASS-mode recommendation per errata), and operates with 2-1-1-1 access timing for sustained high-bandwidth data throughput.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 18 Mbit (512K × 36 configuration) |
| Max Clock Frequency | 133 MHz - enables synchronous burst transfers aligned to CPU front-side bus timing |
| Access Time (tCO) | 6.5 ns - defines minimum clock-to-output latency for read cycles at full speed |
| Core Supply Voltage | 3.3 V ± 0.3 V - powers internal logic and memory array; requires stable low-noise regulation |
| I/O Supply Voltage | 2.5 V or 3.3 V - selectable to match host processor I/O domain without level-shifting |
| Burst Mode Control | MODE pin selects Intel Pentium interleaved or linear sequences - determines address increment pattern during burst reads/writes |
| Power Consumption | 210 mA max operating current - critical for thermal management in dense cache subsystems |
Pinout & Package
Package: JEDEC-standard Pb-free 100-pin Thin Quad Flat Package (TQFP), 14 × 20 × 1.4 mm body, 0.5 mm pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0, A1, A[2:18] | Synchronous Address Input | Sampled on rising CLK edge when ADSP/ADSC active; A[1:0] load 2-bit burst counter |
| CLK | System Clock Input | Edge-triggered master timing reference for all synchronous registers and burst advancement |
| ADSP / ADSC | Address Strobe Inputs | ADSP (processor) takes priority over ADSC (controller); initiates address capture and burst start |
| ADV | Burst Address Advance | Asserted LOW on CLK edge to increment internal burst counter for next location |
| BWA–BWD, BWE | Byte Write Control | Four independent byte enables + common BWE; enables partial-word writes without disturbing adjacent bytes |
| GW | Global Write Enable | Active-LOW signal that overrides byte write controls to write all 36 bits simultaneously |
| OE | Asynchronous Output Enable | Tristates DQ/DQP outputs immediately when HIGH; masked only during first read clock after deselect |
| ZZ | Asynchronous Sleep Input | Active-HIGH entry into low-power sleep; data retention guaranteed; pin must be grounded per errata (Pin 64) |
| DQ[0:35], DQP[0:3] | Bidirectional Data I/O | 36 main data lines + 4 parity lines; direction controlled by OE; automatically tristated during writes and deselect |
| CE1, CE2, CE3 | Chip Enable Inputs | Three-level decode: CE1 (active-LOW), CE2 (active-HIGH), CE3 (active-LOW); supports depth expansion |
Key Features
| Feature | Design Value |
|---|---|
| Flow-through synchronous architecture | Eliminates pipeline stalls in burst transfers by aligning output data directly with clock edge, enabling 2-1-1-1 access rate |
| User-selectable burst sequence | MODE pin configures Intel-compatible interleaved (e.g., cache line fill) or linear (sequential buffer) addressing |
| Dual-voltage I/O interface | VDDQ independence allows seamless integration with 2.5 V or 3.3 V host buses without external level shifters |
| JTAG boundary-scan support | IEEE 1149.1 compliance enables board-level interconnect testing; use in BYPASS mode per documented errata |
| Synchronous self-timed write | Internal timing control ensures reliable write completion across process/voltage/temperature variations without external wait states |
Applications
| Level-1 Cache Buffer | Network Packet Buffer |
|---|---|
Use Scenario: High-speed L1 cache extension for x86-compatible processors requiring sub-10 ns access latency and burst-aligned data delivery. IC Role / Device Role / Timing Role: Flow-through SRAM acting as synchronous, low-latency data buffer between CPU core and secondary cache or memory controller. Use Value: 6.5 ns tCO and 133 MHz operation meet Pentium-class FSB timing constraints; 512K × 36 width matches 32-bit data + 4-bit parity bus. | Use Scenario: Temporary storage for variable-length Ethernet or ATM packets in switching ASICs or FPGA-based line cards. IC Role / Device Role / Timing Role: Burst-capable SRAM providing deterministic read/write turnaround for packet header parsing and payload reassembly. Use Value: ADSP/ADSC dual strobe support enables concurrent CPU and DMA controller access; ZZ sleep reduces idle power in low-traffic intervals. |
| Graphics Frame Buffer | Industrial Motion Controller Buffer |
Use Scenario: Intermediate frame storage in embedded graphics pipelines where real-time pixel streaming demands predictable latency. IC Role / Device Role / Timing Role: Synchronous SRAM serving as double-buffered pixel FIFO with burst-aligned write/read for display engine synchronization. Use Value: 2-1-1-1 access pattern sustains >1 Gbps bandwidth; VDDQ flexibility interfaces directly with GPU I/O voltage rails. | Use Scenario: Real-time position/trajectory data buffering in CNC or robotics controllers requiring jitter-free data handoff between motion IC and FPGA. IC Role / Device Role / Timing Role: Deterministic-latency memory node in closed-loop servo control path, synchronized to system clock domain. Use Value: Synchronous self-timed write guarantees write completion within one clock cycle; CE2/CE3 depth expansion supports multi-axis memory mapping. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C33128A-133BIN | Same density (512K × 36), 133 MHz, but uses single 3.3 V supply for core and I/O; no VDDQ separation | Lacks dual-voltage I/O support; not suitable for mixed-voltage systems requiring 2.5 V interface | Select when system uses uniform 3.3 V signaling and JTAG is not required |
| IS61WV102432BLL-133TQLI | 133 MHz, 1M × 32 organization; no parity pins (DQPx); different pinout and CE logic (single CE) | Higher density but narrower data bus; lacks burst mode selection and ADSC/ADSP dual-strobe capability | Select for cost-sensitive applications needing higher capacity but tolerating simplified control interface |
Compared with AS7C33128A-133BIN and IS61WV102432BLL-133TQLI, the CY7C1381D-133AXC uniquely supports dual-voltage I/O, Intel-compatible burst modes, and dedicated processor/controller address strobes-making it optimal for legacy x86 cache subsystems requiring strict timing compliance and testability via JTAG.
Availability
CY7C1381D-133AXC is available at Aetrix Electronics and suitable for high-speed cache buffers, network packet processing engines, and graphics frame buffering applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for CY7C1381D-133AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in memory, microcontrollers, and programmable system-on-chip solutions.
The CY7C1381D belongs to Cypress's high-speed synchronous SRAM product line, engineered specifically for low-latency, burst-oriented interfacing with x86-compatible microprocessors and cache-coherent subsystems.
FAQ
What is the required connection for the ZZ pin on CY7C1381D-133AXC?
The ZZ pin (Pin 64 in TQFP package) must be externally connected to ground for normal operation, as specified in the device errata. Although ZZ is an active-HIGH sleep input with internal pull-down, grounding ensures reliable disable of sleep mode and avoids unintended entry due to noise or floating conditions. Leaving it unconnected is not recommended.
Does CY7C1381D-133AXC support both 2.5 V and 3.3 V I/O interfaces simultaneously?
No-VDDQ is a single supply pin that must be set to either 2.5 V or 3.3 V, not both. The device supports interface with either voltage domain, but all DQ/DQP pins operate at the same VDDQ level. System design must select one I/O voltage and maintain rail stability within ±5% tolerance per datasheet specifications.
How does the CY7C1381D-133AXC handle burst termination during a read sequence?
Burst termination is controlled externally via deassertion of ADSP or ADSC. Once the initial address strobe is released, the device completes the current burst cycle (up to four words) and halts further auto-incrementing. Subsequent accesses require a new ADSP/ADSC assertion. There is no internal burst-length register-the burst length is fixed at four words per Intel Pentium convention.
Is JTAG boundary-scan functional on CY7C1381D-133AXC for production testing?
JTAG is implemented per IEEE 1149.1 but should be used only in BYPASS mode during production testing, as stated in the errata. Full JTAG functionality (including INTEST and EXTEST) is not guaranteed due to silicon-level limitations. Boundary-scan is retained for basic connectivity verification, but functional test coverage must rely on external vectors or system-level methods.
CY7C1381D-133AXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 18Mbit
- Memory Organization:
- 512K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 6.5 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1381D-133AXC FAQ
1.How can I place an order for CY7C1381D-133AXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1381D-133AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1381D-133AXC reliable?
The price and inventory of CY7C1381D-133AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1381D-133AXC is usually 5 days.
3.What payment methods are accepted for CY7C1381D-133AXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1381D-133AXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1381D-133AXC?
CY7C1381D-133AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1381D-133AXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1381D-133AXC?
For technical support, including CY7C1381D-133AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1381D-133AXC requirements.
6.How does Aetrix verify that CY7C1381D-133AXC is sourced from the original manufacturer or authorized distributors?
All CY7C1381D-133AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1381D-133AXC meets industry standards.
7.What is the process for return or replacement of CY7C1381D-133AXC?
All CY7C1381D-133AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1381D-133AXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1381D-133AXC part is unused and in its original packaging.
Return procedure for CY7C1381D-133AXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1381D-133AXC Tags
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