Cypress Semiconductor Corp CY7C1386KV33-200AXC
- Part No.:
- CY7C1386KV33-200AXC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1386KV33-200AXC.pdf
- Description:
- IC SRAM 18MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:294
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Product details
Overview
CY7C1386KV33-200AXC from Cypress Semiconductor is a 18-Mbit pipelined synchronous SRAM configured as 512K × 36, operating at 200 MHz with 3.3 V core (VDD) and 2.5/3.3 V I/O (VDDQ) supplies, 3 ns clock-to-output delay, and registered synchronous inputs/outputs - deployed in high-speed CPU cache subsystems requiring deterministic burst access.
For engineers reviewing the CY7C1386KV33-200AXC datasheet, CY7C1386KV33-200AXC pinout, CY7C1386KV33-200AXC application, or CY7C1386KV33-200AXC equivalent, key selection criteria include pipelined DCD timing architecture, dual-address-strobe support (ADSP/ADSC), interleaved/linear burst mode selectability via MODE pin, and depth-expansion capability without wait states.
Technical Context
This SRAM implements a two-bit synchronous wraparound burst counter, clocked by CLK's rising edge, with address registration triggered by either ADSP (processor strobe) or ADSC (controller strobe). Burst advancement is controlled by ADV, and burst sequence type (interleaved or linear) is latched from the MODE pin at initialization.
All synchronous inputs - including A[1:0], CE1/CE2/CE3, BWA–BWD, BWE, GW, OE, ADSP, ADSC, ADV, and CLK - are registered on the rising edge. Asynchronous OE and ZZ enable immediate output tristate and sleep entry, respectively, independent of clock timing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 18 Mbit (512K × 36 organization) |
| Max Clock Frequency | 200 MHz - enables 5 ns cycle time for sustained burst throughput |
| Access Time (tCO) | 3 ns - guaranteed clock-to-output delay for timing-critical cache interfaces |
| Core Supply (VDD) | 3.3 V ± 0.3 V - standard LVTTL-compatible core voltage |
| I/O Supply (VDDQ) | 2.5 V or 3.3 V - supports mixed-voltage system interfacing |
| Burst Support | Interleaved or linear sequences - selectable via MODE pin for processor/controller alignment |
| Write Architecture | Synchronous self-timed writes with byte-select (BWA–BWD) and global write (GW) control |
Pinout & Package
Package: 100-pin JEDEC-standard Pb-free TQFP (14 × 20 × 1.4 mm), RoHS-compliant, thermal resistance θJA = 35 °C/W.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Clock input | Rising-edge-triggered master clock for all synchronous registers and burst counter |
| ADSP / ADSC | Address strobe inputs | Asynchronous-selectable address capture triggers - ADSP prioritized over ADSC when both active |
| ADV | Burst advance control | Active-LOW signal that increments internal burst counter on next CLK edge |
| CE1, CE2, CE3 | Chip enable group | Three-level synchronous chip select for bank expansion; CE1 (active LOW), CE2 (active HIGH), CE3 (active LOW) |
| BWA–BWD, BWE, GW | Byte write controls | Four-byte write masking (BWA–BWD) qualified by BWE; GW overrides all to enable full-word write |
| OE | Output enable | Asynchronous, active-LOW control of DQ/DQP tristate - masked only during first read cycle after deselect |
| ZZ | Sleep mode input | Asynchronous, active-HIGH entry into low-power sleep with data retention; internal pull-down ensures safe default |
| DQx / DQP x | Data I/O with parity | 36-bit bidirectional data bus with dedicated parity pins (DQPA–DQPD); direction controlled by OE |
Key Features
| Feature | Design Value |
|---|---|
| Pipelined DCD architecture | Double-cycle deselect eliminates wait states during bank switching - critical for multi-SRAM cache line management |
| Registered I/O with clock-aligned timing | Eliminates external latch requirements and simplifies PCB layout for >166 MHz system clocks |
| User-selectable burst mode | MODE pin configures interleaved (for Pentium-style) or linear (for PowerPC-style) addressing without firmware change |
| Depth expansion support | CE2/CE3 enable seamless 36-bit-wide memory expansion across multiple devices without performance penalty |
| Flexible I/O voltage | VDDQ configurable for 2.5 V or 3.3 V - allows direct interface to both DDR2 and legacy LVTTL controllers |
Applications
| High-Performance CPU Cache | Network Packet Buffer |
|---|---|
|
Use Scenario: Secondary cache for embedded RISC processors running at 200 MHz with burst-oriented instruction fetch. IC Role / Device Role / Timing Role: Pipelined synchronous SRAM providing deterministic 3 ns tCO and 5 ns cycle time for zero-wait-state cache line fills. Use Value: Enables full utilization of 200 MHz bus bandwidth with no pipeline stalls during sequential cache line reads. |
Use Scenario: Temporary storage for variable-length Ethernet frames in Layer 2 switch ASICs. IC Role / Device Role / Timing Role: High-throughput buffer supporting concurrent ingress/egress burst transfers using ADSP/ADSC dual-strobe arbitration. Use Value: Sustains 1.6 Gbps aggregate throughput (200 MHz × 8 bytes/cycle) with byte-select write granularity for partial frame updates. |
| Industrial Motion Controller Memory | Avionics Data Acquisition Buffer |
|
Use Scenario: Real-time trajectory interpolation buffer in CNC motion controllers requiring deterministic latency. IC Role / Device Role / Timing Role: Deterministic-access SRAM with ZZ sleep mode for power-gated idle periods between motion segments. Use Value: Guarantees sub-5 ns read response and <1 µA sleep current - meets IEC 61800-3 EMC and thermal constraints. |
Use Scenario: Buffered acquisition of synchronized sensor streams (IMU, pressure, temp) in DO-254-certifiable flight systems. IC Role / Device Role / Timing Role: Radiation-tolerant SRAM (neutron soft error immunity documented) with synchronous self-timed writes for fault-avoidant logging. Use Value: Provides single-event upset (SEU) mitigation via hardened design while maintaining 200 MHz burst throughput for time-critical telemetry. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61WV102436BLL-200BLI | 200 MHz, 1M × 36 organization, 3.3 V only (no VDDQ flexibility), no ZZ sleep mode | Lacks asynchronous sleep and dual-VDDQ support - unsuitable for mixed-voltage or low-power duty-cycled systems | Select when strict 3.3 V I/O compatibility is required and sleep mode is unnecessary |
| MT55LSD256K36P-200:G | 200 MHz, 9-Mbit (256K × 36), supports only linear burst, no ADSC/ADSP dual-strobe logic | Missing controller-address-strobe (ADSC) path - incompatible with legacy controller-based cache coherency protocols | Select for cost-sensitive designs where ADSC functionality and full 18-Mbit density are not required |
Compared with IS61WV102436BLL-200BLI and MT55LSD256K36P-200:G, the CY7C1386KV33-200AXC uniquely combines 512K × 36 density, dual-strobe support, VDDQ voltage flexibility, and ZZ sleep - making it the only option for high-reliability, mixed-voltage, burst-protocol-diverse cache subsystems.
Availability
CY7C1386KV33-200AXC is available at Aetrix Electronics and suitable for high-speed CPU cache, network packet buffering, industrial motion control, and avionics data acquisition requiring stable component supply and long-term lifecycle assurance.
Supply support for CY7C1386KV33-200AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for industrial, automotive, and communications infrastructure.
The CY7C1386KV33 belongs to Cypress's high-speed synchronous SRAM product line, engineered specifically for deterministic-burst, low-latency cache and buffer applications in real-time embedded systems.
FAQ
What is the function of the MODE pin on CY7C1386KV33-200AXC?
The MODE pin selects burst address sequencing: logic HIGH configures linear burst (0,1,2,3…), logic LOW configures interleaved burst (0,2,4,6… then 1,3,5,7…). It is sampled once at power-up or reset and remains latched until next reset - no runtime reconfiguration is supported.
Can CY7C1386KV33-200AXC operate with VDDQ = 2.5 V while VDD = 3.3 V?
Yes. The device fully supports independent 3.3 V core (VDD) and 2.5 V I/O (VDDQ) operation per JESD8-5 specifications. All I/O pins (DQx, DQP x, BWA–BWD, etc.) are 2.5 V tolerant and drive compliant levels when VDDQ = 2.5 V, enabling direct interface to 2.5 V logic families.
How does the double-cycle deselect feature improve system performance?
When CE1/CE2/CE3 transition to deselect state, outputs remain valid for one additional clock cycle before tristating - allowing adjacent SRAMs in a depth-expanded bank to overlap deselect timing. This eliminates inter-bank wait states and sustains continuous 200 MHz burst throughput across multi-chip configurations.
Is ZZ sleep mode compatible with asynchronous OE assertion during active operation?
Yes. ZZ sleep and OE are fully independent: OE can be asserted HIGH to tristate outputs at any time, even while ZZ = LOW (active mode), and ZZ can be asserted HIGH to enter sleep while OE remains LOW - though outputs will tristate upon sleep entry regardless of OE state.
CY7C1386KV33-200AXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 18Mbit
- Memory Organization:
- 512K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1386KV33-200AXC FAQ
1.How can I place an order for CY7C1386KV33-200AXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1386KV33-200AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1386KV33-200AXC reliable?
The price and inventory of CY7C1386KV33-200AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1386KV33-200AXC is usually 5 days.
3.What payment methods are accepted for CY7C1386KV33-200AXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1386KV33-200AXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1386KV33-200AXC?
CY7C1386KV33-200AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1386KV33-200AXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1386KV33-200AXC?
For technical support, including CY7C1386KV33-200AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1386KV33-200AXC requirements.
6.How does Aetrix verify that CY7C1386KV33-200AXC is sourced from the original manufacturer or authorized distributors?
All CY7C1386KV33-200AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1386KV33-200AXC meets industry standards.
7.What is the process for return or replacement of CY7C1386KV33-200AXC?
All CY7C1386KV33-200AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1386KV33-200AXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1386KV33-200AXC part is unused and in its original packaging.
Return procedure for CY7C1386KV33-200AXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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