Cypress Semiconductor Corp CY7C1392KV18-250BZXC

Overview

CY7C1392KV18-250BZXC from Cypress Semiconductor is a 18-Mbit (2M × 8) synchronous pipelined DDR II SIO SRAM with two-word burst architecture, 250 MHz maximum clock frequency, 1.8 V core supply, and HSTL I/O compatible with 1.5 V/1.8 V VDDQ. It delivers 666 Mbps effective data rate via double-data-rate read/write operations and supports precise timing using dual K/K input clocks and dual C/C output clocks - deployed in high-speed networking buffers and packet-forwarding ASIC interfaces.

For engineers reviewing the CY7C1392KV18-250BZXC datasheet, CY7C1392KV18-250BZXC pinout, CY7C1392KV18-250BZXC application, or CY7C1392KV18-250BZXC equivalent, key selection criteria include DDR II SIO separate I/O architecture, 1.5-cycle read latency (DOFF = HIGH), echo clock support (CQ/CQ), JTAG 1149.1 test access, and 165-ball FBGA package compatibility with high-density PCB layouts.

Technical Context

This SRAM implements a synchronous pipelined architecture with independent read and write ports sharing a common address bus. Address latching occurs on alternating rising edges of K and K clocks, enabling two-word burst transfers per access cycle without bus turnaround.

It integrates a PLL for accurate data placement, uses echo clocks (CQ/CQ) referenced to C/C for simplified high-speed data capture, and supports programmable impedance matching via ZQ pin. Write operations are internally self-timed, and DOFF pin configures read latency between 1-cycle (DDR I mode) and 1.5-cycle (DDR II mode).

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body height, RoHS-compliant, Pb-free option available.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed burst SRAM applications.

Compared with AS7C3256A-25JCIN and IS61WV102416BLL-25MLI, CY7C1392KV18-250BZXC uniquely delivers DDR II SIO burst bandwidth, configurable latency, and echo-clocked timing closure - making it irreplaceable in systems demanding >500 MT/s sustained throughput with sub-ns jitter control.

Availability

CY7C1392KV18-250BZXC is available at Aetrix Electronics and suitable for high-speed network packet buffers, FPGA-based protocol accelerators, telecom baseband processing buffers, and industrial real-time motion controllers requiring stable component supply across multi-year production cycles.

Supply support for CY7C1392KV18-250BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.

The CY7C1392KV18 belongs to Cypress's DDR II SIO SRAM product line, engineered specifically for deterministic, high-bandwidth buffering in packet-switched infrastructure where bus turnaround overhead and clock skew limit performance.

FAQ

What is the function of the DOFF pin on CY7C1392KV18-250BZXC?

The DOFF (Data Output OFF) pin configures read latency mode: when asserted HIGH, it enables DDR II operation with 1.5-cycle read latency; when LOW, it reverts to DDR I mode with 1-cycle latency. This setting directly affects internal pipeline staging and must be fixed at power-up - it is not dynamically switchable during operation.

Can CY7C1392KV18-250BZXC operate without external C and C clocks?

Yes - the device supports single-clock mode where K and K serve as both input and output clocks. In this configuration, read data is driven on rising edges of K/K instead of C/C, and echo clocks CQ/CQ are generated relative to K/K. However, system-level timing margin decreases by ~35% compared to dual-clock mode with deskewed C/C.

How does the ZQ pin affect signal integrity in high-speed layouts?

The ZQ pin connects to an external 240 Ω resistor to ground and calibrates the HSTL output driver impedance to match PCB trace characteristics. This calibration ensures consistent edge rates and minimizes reflections at 666 Mbps, especially critical for maintaining <±15 ps eye opening across temperature and voltage corners in 10-layer backplane designs.

Is CY7C1392KV18-250BZXC pin-compatible with CY7C1393KV18-250BZXC?

No - although both share the same 165-ball FBGA footprint and clock/interface signaling, their data bus widths differ: CY7C1392KV18 is 2M × 8 (D[7:0]/Q[7:0]), while CY7C1393KV18 is 1M × 18 (D[17:0]/Q[17:0]). Pin assignments for data signals are not aligned; direct substitution requires PCB redesign and firmware register mapping changes.