Cypress Semiconductor Corp CY7C1411KV18-250BZXC

Overview

CY7C1411KV18 from Cypress Semiconductor is a 4 M × 8, 36-Mbit QDR® II SRAM with four-word burst architecture, 333 MHz clock support (666 MHz DDR data rate), 1.8 V core supply, and 1.4–1.8 V I/O supply. It delivers concurrent read/write operations via independent ports and targets high-bandwidth packet buffering in network switches and routers.

For engineers reviewing the CY7C1411KV18 datasheet, CY7C1411KV18 pinout, CY7C1411KV18 application, or CY7C1411KV18 equivalent, key selection criteria include 1.5-cycle read latency (DOFF = HIGH), echo clock (CQ) timing support, HSTL-compatible output drive, JTAG 1149.1 test access, and 165-ball FBGA package compatibility.

Technical Context

The device implements a synchronous pipelined QDR II architecture with physically separate read and write data paths, eliminating bus turnaround delays. It uses dual input clocks (K/K̄) for address/data latching and dual output clocks (C/C̄) with echo clock (CQ/CQ̄) to align data capture at the receiver.

Internally, it organizes memory as four 1 M × 8 arrays, supports depth expansion via RPS/WPS controls, and employs on-chip PLL for precise DDR edge placement. Read latency is configurable: 1 cycle (DOFF = LOW) or 1.5 cycles (DOFF = HIGH), enabling trade-offs between timing margin and throughput.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed dual-port SRAM applications.

Compared with IDT72T3615L10BG, CY7C1411KV18 trades peak bandwidth for superior timing robustness via CQ and DOFF-configurable latency; versus IS61WV102416BLL-10MLI, it delivers 2.25× density, concurrent access, and deterministic DDR timing essential for modern packet processing.

Availability

CY7C1411KV18 is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, baseband processing cache, and test equipment pattern memory requiring stable component supply across extended product lifecycles.

Supply support for CY7C1411KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial systems, with emphasis on signal integrity and timing precision.

CY7C1411KV18 belongs to Cypress's QDR II SRAM product line, engineered specifically for deterministic, low-latency, high-bandwidth memory interfacing in packet-switched infrastructure and real-time signal processing platforms.

FAQ

What is the function of the DOFF pin on CY7C1411KV18?

The DOFF (Data Output OFFset) pin configures read latency: when asserted HIGH, it enables 1.5-cycle latency for improved timing margin in high-speed systems; when LOW, it selects 1-cycle latency for minimal delay. This setting directly affects the phase relationship between C/C̄ clocks and valid Q[7:0] data, and must be set before initialization.

Can CY7C1411KV18 operate with only a single clock (K) instead of differential K/K̄?

Yes-CY7C1411KV18 supports single-clock mode where K̄ is tied to ground or VDD, and both read and write operations synchronize to the rising edge of K alone. In this mode, C/C̄ and CQ/CQ̄ remain functional, but timing margins tighten due to lack of differential noise rejection on the input clock path.

How does the NWS0/NWS1 pin functionality differ from byte write enables in other SRAMs?

NWS0 and NWS1 are nibble write selects active LOW, each controlling a 4-bit segment of D[7:0]. Unlike generic byte enables, they operate synchronously with K/K̄ and are sampled alongside data-ensuring atomic partial writes without requiring external gating logic or additional clock cycles.

Is the 165-ball FBGA package of CY7C1411KV18 compatible with standard reflow profiles?

Yes-the 165-ball FBGA (13 × 15 × 1.4 mm) uses lead-free solder balls and complies with IPC/JEDEC J-STD-020D moisture sensitivity level 3. Standard Pb-free reflow profiles with peak temperature ≤260°C and time above liquidus 60–150 seconds are validated for this package; bake preconditioning is required if exposed >168 hours at >30°C/60% RH.