Cypress Semiconductor Corp CY7C1411KV18-300BZC
- Part No.:
- CY7C1411KV18-300BZC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1411KV18-300BZC.pdf
- Description:
- IC SRAM 36MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:378
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Product details
Overview
CY7C1411KV18 from Cypress Semiconductor is a 4 M × 8, 36-Mbit QDR® II SRAM with four-word burst architecture, 333 MHz clock operation (666 MHz DDR data rate), 1.8 V core supply, and 1.4–1.8 V I/O supply. It delivers concurrent read/write transactions via independent ports and supports high-bandwidth networking buffers in packet-switched routers.
For engineers reviewing the CY7C1411KV18 datasheet, CY7C1411KV18 pinout, CY7C1411KV18 application, or CY7C1411KV18 equivalent, key selection criteria include 1.5-cycle read latency (DOFF = HIGH), echo clock (CQ) support for timing margin recovery, HSTL-15/18-compatible output drive, JTAG 1149.1 test access, and 165-ball FBGA (13 × 15 × 1.4 mm) package compatibility.
Technical Context
The CY7C1411KV18 implements a synchronous pipelined QDR II architecture with physically separate read and write data paths-eliminating bus turnaround overhead. Its dual-clock domain uses K/K for address/data capture and C/C for output timing, enabling precise DDR alignment without external delay compensation.
Internally, it employs a 1M × 8 × 4 array organization with multiplexed 20-bit address bus latched on alternating K-clock edges. The integrated PLL ensures accurate data placement, while DOFF pin selection configures read latency between 1 cycle (DOFF = LOW) and 1.5 cycles (DOFF = HIGH), matching legacy QDR I or optimizing for higher throughput.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 36 Mbit (4 M × 8 configuration) |
| Max Clock Frequency | 333 MHz - enables 666 MT/s DDR data transfer rate per port |
| Read Latency | 1.5 cycles (DOFF = HIGH) - balances timing margin and pipeline depth for high-speed systems |
| Core Supply Voltage | 1.8 V ±0.1 V - defines minimum power rail stability requirement for internal logic |
| I/O Supply Range | 1.4 V to 1.8 V - supports interoperability with both HSTL-15 and HSTL-18 interfaces |
| Burst Length | Four-word - reduces effective address bus toggling frequency by 4× vs. single-word access |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - standard footprint for high-pin-count memory in dense PCB layouts |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body height, RoHS-compliant, 0.8 mm ball pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[7:0] | Synchronous write data input | 8-bit parallel data sampled on rising edge of K clock during active WPS assertion |
| Q[7:0] | Synchronous read data output | 8-bit parallel data driven on rising edge of C clock; valid only when RPS is asserted |
| WPS | Write port select | Active-low signal enabling write transaction; deassertion blocks D[7:0] sampling and write execution |
| RPS | Read port select | Active-low signal enabling read transaction; deassertion forces Q[7:0] into high-impedance state |
| NWS0/NWS1 | Nibble write select | Independent 4-bit write enables: NWS0 controls D[3:0], NWS1 controls D[7:4]; both sampled with data |
| K/K | Input clock pair | Differential clock inputs for address and write-data capture; device uses rising edges only |
| C/C | Output clock pair | Differential clocks for read-data output timing; minimizes skew between Q[7:0] and clock edges |
| CQ/CQ | Echo clock outputs | Delayed copies of C/C used by system controller to simplify high-speed data capture setup/hold |
| DOFF | Read latency mode control | High = 1.5-cycle latency (QDR II mode); Low = 1-cycle latency (QDR I compatibility mode) |
| VDDQ | I/O power supply | 1.4–1.8 V rail powering HSTL output drivers; must be decoupled independently from VDD |
| VDD | Core power supply | 1.8 V ±0.1 V rail powering internal logic, PLL, and registers; requires tight regulation |
| ZQ | Impedance calibration reference | Connects to 240 Ω ±1% resistor to ground for on-die output driver impedance tuning |
Key Features
| Feature | Design Value |
|---|---|
| Independent read/write ports | Enables true concurrent access-no bus arbitration or turnaround delay required between successive reads and writes |
| Four-word burst architecture | Delivers 32 bits per address cycle (8-bit × 4), reducing address bus toggle rate and simplifying controller design |
| Echo clock (CQ) support | Provides system-level timing reference aligned to Q[7:0] output edges-eliminates need for board-level trace length matching |
| Programmable output drive impedance | On-die ZQ calibration adjusts HSTL driver strength to match PCB trace impedance (typically 50 Ω), minimizing reflections |
| JTAG 1149.1 boundary scan | Enables production testability and interconnect verification without physical probe access to high-speed signals |
Applications
| Packet Buffering in Core Routers | Line Card Memory for 10G/40G Ethernet Switches |
|---|---|
Use Scenario: Storing ingress/egress packet headers and payload fragments in multi-terabit core routers where deterministic latency and zero bus contention are mandatory. IC Role / Device Role / Timing Role: Dual-port SRAM acting as shared buffer between ingress scheduler and egress traffic manager; K/C clocks synchronized to line-rate timing domains. Use Value: Concurrent read/write eliminates serialization bottlenecks-enabling full line-rate forwarding at OC-192/STM-64 speeds without packet loss. | Use Scenario: Serving as frame buffer in modular line cards supporting 10GBase-R and 40GBase-R PHY aggregation with deep queuing requirements. IC Role / Device Role / Timing Role: High-bandwidth memory interface bridging SerDes MAC layer and traffic shaping engine; CQ clocks used for reliable data capture at 666 MT/s. Use Value: Four-word burst reduces address bus bandwidth by 75%, freeing FPGA logic resources for header parsing and classification. |
| Telecom Control Plane Caching | Test Equipment Pattern Memory |
Use Scenario: Caching routing table entries and session state in carrier-grade session border controllers requiring sub-10 ns access consistency. IC Role / Device Role / Timing Role: Deterministic-latency SRAM accessed by dual-core ARM subsystem-one core writes updates, the other reads for lookup acceleration. Use Value: 1.5-cycle read latency (DOFF = HIGH) provides predictable timing margin across voltage/temperature corners for real-time control loops. | Use Scenario: Storing stimulus/response vectors in automated test equipment (ATE) platforms performing high-speed digital pattern generation and capture. IC Role / Device Role / Timing Role: Synchronized waveform memory interfaced to high-speed DAC/ADC channels; K and C clocks phase-aligned to instrument sampling clock. Use Value: Echo clocks (CQ) allow ATE controller to recover data with <0.1 UI jitter-meeting JEDEC JESD22-B100 reliability thresholds. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T3615L5PF | 36-Mbit QDR II+, 350 MHz max, 1.5 V core, LVDS I/O, 165-ball FBGA | Requires LVDS termination and differential clock distribution; lacks echo clocks and ZQ calibration | Preferred for new designs targeting >333 MHz operation where LVDS infrastructure exists |
| ISSI IS61WV102416BLL-15BLI | 16-Mbit asynchronous SRAM, 15 ns access, 3.3 V, 48-pin TSOP | No DDR, no burst, no dual-port-requires external arbitration and bus turnaround logic | Only suitable for low-bandwidth control-plane buffering where QDR features are unnecessary |
Compared with IDT72T3615L5PF and IS61WV102416BLL-15BLI, the CY7C1411KV18 uniquely combines HSTL-15/18 flexibility, echo clock timing aid, and on-die impedance tuning-making it optimal for cost-sensitive, high-volume telecom line cards where board-level signal integrity margins are constrained.
Availability
CY7C1411KV18 is available at Aetrix Electronics and suitable for packet buffering in core routers, line card memory for 10G/40G Ethernet switches, telecom control plane caching, and test equipment pattern memory requiring stable component supply across extended product lifecycles.
Supply support for CY7C1411KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable analog/digital ICs for industrial, automotive, and communications markets.
The QDR® II SRAM product line was designed specifically for ultra-low-latency, high-throughput packet processing in networking infrastructure-emphasizing deterministic timing, concurrent access, and robust signal integrity at multi-GHz data rates.
FAQ
What is the function of the DOFF pin on CY7C1411KV18?
The DOFF (Data Output OFFset) pin selects read latency mode: when HIGH, it configures 1.5-cycle latency for optimized QDR II timing margin; when LOW, it enables 1-cycle latency for backward compatibility with QDR I controllers. This setting directly affects the C-clock-to-Q-data timing relationship and must be fixed at power-up.
Can CY7C1411KV18 operate with only a single clock source?
Yes-CY7C1411KV18 supports single-clock mode where K and C are driven by the same clock signal. In this configuration, read data is registered on the same clock edge as address latch, eliminating need for separate C-clock generation but reducing maximum achievable bandwidth compared to dual-clock operation.
How does the ZQ pin enable output driver calibration?
The ZQ pin connects to a precision 240 Ω ±1% resistor to ground, allowing the device to measure reference current and adjust internal HSTL output driver impedance to match PCB trace characteristics. Calibration occurs automatically at power-up and can be retriggered via JTAG instruction, ensuring consistent signal integrity across voltage and temperature.
Is the CY7C1411KV18 pin-compatible with other devices in the CY7C14xxKV18 family?
No-while all variants share the same 165-ball FBGA package and core pinout (K, C, CQ, RPS, WPS, etc.), data bus width differs: CY7C1411KV18 uses D[7:0]/Q[7:0], whereas CY7C1426KV18 uses D[8:0]/Q[8:0], and CY7C1413KV18 uses D[17:0]/Q[17:0]. Nibble/byte write select pins also vary by configuration and are not interchangeable.
CY7C1411KV18-300BZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 36Mbit
- Memory Organization:
- 4M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- 300 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1411KV18-300BZC FAQ
1.How can I place an order for CY7C1411KV18-300BZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1411KV18-300BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1411KV18-300BZC reliable?
The price and inventory of CY7C1411KV18-300BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1411KV18-300BZC is usually 5 days.
3.What payment methods are accepted for CY7C1411KV18-300BZC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1411KV18-300BZC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1411KV18-300BZC?
CY7C1411KV18-300BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1411KV18-300BZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1411KV18-300BZC?
For technical support, including CY7C1411KV18-300BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1411KV18-300BZC requirements.
6.How does Aetrix verify that CY7C1411KV18-300BZC is sourced from the original manufacturer or authorized distributors?
All CY7C1411KV18-300BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1411KV18-300BZC meets industry standards.
7.What is the process for return or replacement of CY7C1411KV18-300BZC?
All CY7C1411KV18-300BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1411KV18-300BZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1411KV18-300BZC part is unused and in its original packaging.
Return procedure for CY7C1411KV18-300BZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1411KV18-300BZC Tags

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