Cypress Semiconductor Corp CY7C1412KV18-250BZC

Overview

CY7C1412KV18-250BZC from Cypress Semiconductor is a 2-Mbit × 18-bit (36-Mbit total), 1.8 V QDR® II SRAM with independent read/write ports, 250 MHz maximum clock frequency (K/K and C/C), DDR interfaces delivering 500 MT/s effective data rate, and 165-ball FBGA (13 × 15 × 1.4 mm) packaging. It enables high-throughput packet buffering in network line cards requiring concurrent access and strict timing coherency.

For engineers reviewing the CY7C1412KV18-250BZC datasheet, CY7C1412KV18-250BZC pinout, CY7C1412KV18-250BZC application, or CY7C1412KV18-250BZC equivalent, key selection criteria include dual-clock DDR timing, DOFF-configurable 1-cycle vs. 1.5-cycle read latency, HSTL-15/18 I/O compatibility, echo clock (CQ/CQ) support for source-synchronous capture, and JTAG 1149.1 testability.

Technical Context

This QDR II SRAM implements fully synchronous, pipelined architecture with physically separate read and write data paths-eliminating bus turnaround delays. It uses two independent input clock pairs (K/K for address/control/data capture; C/C for output timing) and echo clocks (CQ/CQ) aligned to C/C edges to simplify PCB layout and timing closure at 500 MT/s.

The device supports depth expansion via RPS/WPS and byte-write select (BWS[1:0]) for granular 9-bit sub-word writes. Internal self-timed write circuitry ensures deterministic write completion, while DOFF pin selects between 1-cycle (DOFF = LOW) and 1.5-cycle (DOFF = HIGH) read latency modes-matching legacy QDR I or optimizing for higher throughput respectively.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, JEDEC MO-270AC compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Compared with IDT72T3615L10BG and IS61WV102418B, CY7C1412KV18-250BZC uniquely balances 250 MHz deterministic performance, configurable latency, and echo-clock–assisted timing closure-making it optimal for FPGA-based systems where design margin and debugability outweigh raw speed.

Availability

CY7C1412KV18-250BZC is available at Aetrix Electronics and suitable for network infrastructure, high-speed test instrumentation, wireless baseband processing, and FPGA co-processor memory applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for CY7C1412KV18-250BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial systems, with emphasis on signal integrity and system-level timing robustness.

CY7C1412KV18 belongs to the QDR II SRAM product line, engineered specifically for deterministic, low-latency, concurrent-access memory subsystems in high-speed serial data infrastructure-prioritizing timing precision over density or cost.

FAQ

What is the function of the DOFF pin on CY7C1412KV18-250BZC?

The DOFF (Double-Off) pin configures read latency mode: when asserted HIGH, it enables 1.5-cycle read latency for optimized throughput; when LOW, it selects 1-cycle latency for QDR I compatibility. This setting is sampled synchronously on the rising edge of the K clock during initialization and remains latched until reset or power cycle.

Can CY7C1412KV18-250BZC operate with only a single clock domain?

Yes-by tying K to C and K to C, the device operates in single-clock mode where all timing references derive from K/K. In this configuration, Q[17:0] data is driven on rising edges of K/K instead of C/C, and CQ/CQ echo clocks track K/K instead of C/C. All functional behavior remains identical except for reduced clock routing complexity.

How does the BWS[1:0] signal control byte writes in the 18-bit interface?

BWS[1:0] provides two independent active-LOW byte-select lines: BWS0 enables writing to D[8:0], and BWS1 enables writing to D[17:9]. When either is deasserted, the corresponding 9-bit sub-word is masked and retains its prior value. Both signals are sampled synchronously with D[17:0] on the rising edge of K during write operations.

Is the 165-ball FBGA package of CY7C1412KV18-250BZC compatible with standard reflow profiles?

Yes-the 165-ball FBGA (package code BZC) is qualified for lead-free reflow per IPC/JEDEC J-STD-020D. Peak temperature must not exceed 260 °C, with time above 217 °C limited to 60–150 seconds. Thermal pad under the die is not electrically connected and may be left floating or grounded per board thermal design requirements.