Cypress Semiconductor Corp CY7C1412KV18-250BZXC
- Part No.:
- CY7C1412KV18-250BZXC
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1412KV18-250BZXC.pdf
- Description:
- QDR SRAM, 2MX18, 0.45NS, CMOS, P
- Quantity:
- Payment:

- Shipping:

Inventory:558
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Product details
Overview
CY7C1412KV18-250BZXC from Cypress Semiconductor is a 2M × 18 (36-Mbit) QDR® II SRAM with two-word burst, DDR interfaces on independent read/write ports, 250 MHz clock operation (500 MT/s), 1.8 V core supply, and 1.4–1.8 V I/O supply - deployed in high-bandwidth packet buffering for network line cards.
For engineers reviewing the CY7C1412KV18-250BZXC datasheet, CY7C1412KV18-250BZXC pinout, CY7C1412KV18-250BZXC application, or CY7C1412KV18-250BZXC equivalent, key selection criteria include concurrent read/write capability, echo-clock–assisted data capture at 500 MT/s, DOFF-configurable 1-cycle vs. 1.5-cycle read latency, and FBGA-165 package compatibility with high-speed PCB layout constraints.
Technical Context
This QDR II SRAM implements fully synchronous, pipelined architecture with physically separate read and write data paths - enabling true concurrent access without bus turnaround. It uses dual input clocks (K/K) for address/data capture and dual output clocks (C/C) with echo clocks (CQ/CQ) to compensate for board-level skew.
The device supports programmable impedance via ZQ pin, JTAG 1149.1 boundary scan, and on-chip PLL for precise data placement. Read latency is configurable via DOFF pin: 1 cycle when LOW, 1.5 cycles when HIGH - directly impacting system timing closure in switch fabric designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 36 Mbit (2M × 18 organization) |
| Max Clock Frequency | 250 MHz - enables 500 MT/s DDR throughput per port |
| Read Latency | Configurable: 1 cycle (DOFF = LOW) or 1.5 cycles (DOFF = HIGH) |
| Core Supply Voltage | 1.8 V ±0.1 V - defines minimum power rail stability requirement |
| I/O Supply Range | 1.4 V to 1.8 V - supports interoperability with 1.5 V or 1.8 V logic families |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - requires controlled-impedance PCB stackup |
| Operating Temperature | 0 °C to +70 °C - validated for commercial-grade telecom infrastructure |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, 0.8 mm ball pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[17:0] | Write data inputs | 18-bit synchronous write bus sampled on rising edge of K clock |
| Q[17:0] | Read data outputs | 18-bit DDR read bus driven on rising edges of C and C clocks |
| RPS | Read port select | Active-LOW signal enabling read access; tristates Q[17:0] when deasserted |
| WPS | Write port select | Active-LOW signal initiating write; ignores D[17:0] when deasserted |
| BWS[1:0] | Byte write selects | Two active-LOW signals controlling four 9-bit byte lanes (D[8:0], D[17:9]) |
| K / K | Input clocks | Differential pair for address/data capture; only rising edges used for synchronization |
| C / C | Output clocks | Differential pair for read data strobing; used with CQ/CQ for deskewed capture |
| CQ / CQ | Echo clocks | Free-running copies of C/C, synchronized to output clock domain for controller timing margin |
| DOFF | Read latency control | Static pin setting read latency to 1 cycle (LOW) or 1.5 cycles (HIGH) |
| ZQ | Impedance calibration | Connects to 240 Ω reference resistor for HSTL output driver calibration |
Key Features
| Feature | Design Value |
|---|---|
| Independent read/write ports | Eliminates bus turnaround overhead - enables full-duplex memory access in packet processors |
| Two-word burst architecture | Guarantees two sequential 18-bit words per access - matches typical ATM/POS cell or Ethernet frame alignment |
| Echo clock support (CQ/CQ) | Enables source-synchronous data capture at 500 MT/s without complex fly-by routing |
| Programmable drive strength | HSTL-compliant output buffers calibrated via ZQ pin - reduces signal integrity tuning effort |
| JTAG 1149.1 test access | Supports boundary scan testing of high-density BGA interconnects - critical for production test coverage |
Applications
| Network Packet Buffering | Switch Fabric Memory |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and metadata in Layer 2/L3 switches with sub-100 ns latency requirements. IC Role / Device Role / Timing Role: Dual-port SRAM serving as shared buffer between ingress parser and egress scheduler, synchronized by K/K and C/C clocks. Use Value: Concurrent read/write eliminates arbitration delay - sustaining 500 MT/s sustained bandwidth across traffic bursts. |
Use Scenario: Implementing crossbar switch lookup tables and queue depth registers in modular chassis-based routers. IC Role / Device Role / Timing Role: High-speed memory node in distributed switching fabric, interfacing with SerDes PHYs via source-synchronous CQ/CQ timing. Use Value: Echo clocks reduce setup/hold margin dependency on trace length matching - simplifying multi-SRAM parallel interface layout. |
| Telecom Line Card Buffering | High-Speed Test Equipment Memory |
|
Use Scenario: Deep buffering of OC-192/STM-64 payload streams in SONET/SDH framer modules. IC Role / Device Role / Timing Role: Burst-mode SRAM absorbing variable-rate traffic from framer ASICs using DOFF-configured 1-cycle latency mode. Use Value: 1-cycle latency minimizes pipeline stalls during real-time cell processing - meeting strict jitter budgets. |
Use Scenario: Capturing high-fidelity digital waveforms in automated test equipment (ATE) pattern generators. IC Role / Device Role / Timing Role: Synchronous memory staging data between FPGA pattern sequencer and DAC interface. Use Value: Independent RPS/WPS allows deterministic interleaving of stimulus and response data streams without contention. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T3615L10BG | 36-Mbit QDR II+, 100 MHz max clock (200 MT/s), no echo clocks, 3.3 V I/O | Limited to lower-speed backplane interfaces; lacks CQ/CQ for high-speed capture | Select only if system clock ≤100 MHz and legacy 3.3 V I/O compatibility required |
| ISSI IS61WV102418BLL-15BLI | 18-Mbit sync SRAM, single-port, 15 ns async access, no DDR or burst | Cannot support concurrent read/write; unsuitable for full-duplex packet buffering | Only viable for low-bandwidth control-plane storage where latency >15 ns is acceptable |
Compared with IDT72T3615L10BG and IS61WV102418BLL-15BLI, CY7C1412KV18-250BZXC delivers 2.5× higher throughput, echo-clock–assisted timing closure, and true dual-port concurrency - making it the sole fit for 500 MT/s packet buffer applications requiring zero bus turnaround.
Availability
CY7C1412KV18-250BZXC is available at Aetrix Electronics and suitable for network packet buffering, switch fabric memory, and telecom line card buffering requiring stable component supply across extended production lifecycles.
Supply support for CY7C1412KV18-250BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial systems.
CY7C1412KV18 belongs to the QDR II SRAM product line, engineered specifically for deterministic, low-latency, concurrent-access memory subsystems in high-speed communications infrastructure.
FAQ
What is the function of the DOFF pin on CY7C1412KV18-250BZXC?
The DOFF (Data Output OFFset) pin configures read latency: when asserted LOW, the device operates with 1-cycle read latency; when HIGH, it uses 1.5-cycle latency. This setting is sampled at power-up and remains static during operation - enabling system-level timing optimization without runtime reconfiguration.
How does the ZQ pin calibrate output drive strength?
The ZQ pin connects to an external 240 Ω resistor to ground, allowing internal circuitry to calibrate HSTL output drivers for consistent impedance matching. Calibration occurs automatically at power-up and can be triggered manually via JTAG - ensuring signal integrity across voltage and temperature variations.
Can CY7C1412KV18-250BZXC operate with only a single clock domain?
Yes - the device supports single-clock mode where K and C are tied together (and K and C likewise), eliminating need for separate clock trees. In this mode, data is clocked using K/K for both input and output, and CQ/CQ derive from K/K - reducing PCB routing complexity at the cost of reduced deskew capability.
What is the purpose of BWS[1:0] in CY7C1412KV18-250BZXC?
BWS[1:0] are two active-LOW byte write select signals controlling four 9-bit lanes: BWS0 enables D[8:0], BWS1 enables D[17:9]. When a BWS bit is deasserted, corresponding data bytes are ignored during write - preserving existing memory contents in non-targeted lanes without requiring read-modify-write sequences.
CY7C1412KV18-250BZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 36Mbit
- Memory Organization:
- 2M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 250 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1412KV18-250BZXC FAQ
1.How can I place an order for CY7C1412KV18-250BZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1412KV18-250BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1412KV18-250BZXC reliable?
The price and inventory of CY7C1412KV18-250BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1412KV18-250BZXC is usually 5 days.
3.What payment methods are accepted for CY7C1412KV18-250BZXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1412KV18-250BZXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1412KV18-250BZXC?
CY7C1412KV18-250BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1412KV18-250BZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1412KV18-250BZXC?
For technical support, including CY7C1412KV18-250BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1412KV18-250BZXC requirements.
6.How does Aetrix verify that CY7C1412KV18-250BZXC is sourced from the original manufacturer or authorized distributors?
All CY7C1412KV18-250BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1412KV18-250BZXC meets industry standards.
7.What is the process for return or replacement of CY7C1412KV18-250BZXC?
All CY7C1412KV18-250BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1412KV18-250BZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1412KV18-250BZXC part is unused and in its original packaging.
Return procedure for CY7C1412KV18-250BZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1412KV18-250BZXC Tags

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