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Cypress Semiconductor Corp CY7C1413KV18-250BZI

Part No.:
CY7C1413KV18-250BZI
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1413KV18-250BZI.pdf
Description:
IC SRAM 36MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,221

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Product details

Overview

CY7C1413KV18-250BZI from Cypress Semiconductor is a 2 M × 18, 36-Mbit QDR® II SRAM with four-word burst architecture, 250 MHz maximum operating frequency (400 Mbps DDR data rate), 1.8 V core supply, and 1.4–1.8 V I/O supply. It delivers concurrent read/write operations via independent ports and supports depth expansion using RPS/WPS controls in high-bandwidth networking buffers.

For engineers reviewing the CY7C1413KV18-250BZI datasheet, CY7C1413KV18-250BZI pinout, CY7C1413KV18-250BZI application, or CY7C1413KV18-250BZI equivalent, key selection criteria include 1.5-cycle read latency (DOFF = HIGH), echo clock (CQ) support for timing margin recovery, HSTL-compatible output drive, JTAG 1149.1 test access, and 165-ball FBGA (13 × 15 × 1.4 mm) package compatibility.

Technical Context

This SRAM implements true dual-port QDR II architecture: separate read (Q[17:0]) and write (D[17:0]) data paths eliminate bus turnaround delays. Address latching occurs on alternating rising edges of K/K clocks, enabling full concurrency without arbitration logic.

It integrates a PLL for precise DDR edge alignment, uses echo clocks (CQ/CQ) to compensate for PCB flight time skew, and supports programmable impedance via ZQ pin. The device operates in single-clock mode (K-only) or dual-clock mode (K/K + C/C), with DOFF pin selecting between 1-cycle (LOW) and 1.5-cycle (HIGH) read latency.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 36 Mbit (2 M × 18 organization)
Max Clock Frequency 250 MHz - enables 500 MT/s effective throughput per port
Data Rate DDR at 500 Mbps - transfers 4 words per cycle on both read/write ports
Core Supply 1.8 V ±0.1 V - defines internal timing margins and power consumption
I/O Supply Range 1.4 V to 1.8 V - supports HSTL Class I/II and SSTL-15 compatibility
Read Latency 1.5 cycles (DOFF = HIGH) - balances timing margin and pipeline efficiency
Package 165-ball FBGA (13 × 15 × 1.4 mm) - standard footprint for high-pin-count memory

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant Pb-free finish (BZI suffix).

Pin/Terminal Circuit Role Design Meaning
D[17:0] Write data inputs Synchronous to K/K rising edges; 18-bit parallel write path
Q[17:0] Read data outputs Synchronous to C/C rising edges; tristate-controlled, HSTL-compatible
K / K Input clocks Rising-edge-triggered for address/data capture; differential pair for jitter reduction
C / C Output clocks Source-synchronous with Q[17:0]; minimize skew vs. data flight time
CQ / CQ Echo clocks Replicate C/C timing at receiver; enable robust DDR capture in high-speed traces
WPS Write port select Active-low; gates write enable and D[17:0] sampling when asserted
RPS Read port select Active-low; enables Q[17:0] output drivers and read address decode
BWS[1:0] Byte write selects Active-low; control 9-bit byte groups (D[8:0], D[17:9]) for partial writes
DOFF Read latency mode HIGH → 1.5-cycle latency; LOW → 1-cycle latency (QDR I compatibility)
ZQ Impedance calibration Connects to external 240 Ω resistor for on-die termination tuning

Key Features

Feature Design Value
Independent read/write ports Enables simultaneous access without arbitration-critical for packet buffering in switches/routers
Four-word burst transfer Reduces address bus toggling by 75% vs. single-word access-lowers system EMI and routing complexity
Echo clock (CQ) support Allows receiver-side deskew without external delay lines-simplifies PCB layout for >400 Mbps links
JTAG 1149.1 boundary scan Enables production test coverage of interconnects and BGA solder joints-reduces board-level debug time
Programmable output drive strength Configurable via ZQ calibration-matches trace impedance across varying stackups and temperatures

Applications

High-Speed Packet Buffering Network Switch Fabric Memory

Use Scenario: Line-rate buffering of 10 GbE/40 GbE packet headers and metadata in L2/L3 switching ASICs.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as ingress/egress FIFO with zero-turnaround latency.

Use Value: Concurrent read/write eliminates arbitration stalls, sustaining 500 MT/s sustained bandwidth per port under real traffic loads.

Use Scenario: Shared memory pool for crossbar scheduler state and queue depth tracking in multi-stage switch fabrics.

IC Role / Device Role / Timing Role: QDR II SRAM providing deterministic 1.5-cycle read latency for scheduler decision loops.

Use Value: Echo clocks (CQ) ensure reliable data capture at 500 Mbps despite 80+ mm trace lengths on backplane PCBs.

Baseband Digital Front-End Test Equipment Pattern Memory

Use Scenario: Real-time storage of IQ samples during LTE/5G uplink/downlink channel estimation and precoding.

IC Role / Device Role / Timing Role: High-throughput buffer interfacing directly with FPGA-based DSP pipelines.

Use Value: 1.4–1.8 V I/O flexibility allows direct connection to 1.5 V FPGA I/O banks without level shifters.

Use Scenario: Vector pattern storage in automated test equipment (ATE) for high-speed digital IC validation.

IC Role / Device Role / Timing Role: Deterministic-access memory delivering stimulus/response data at 500 Mbps DDR rates.

Use Value: JTAG boundary scan enables full interconnect testability-critical for ATE reliability certification.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72T3615L10BG 36-Mbit QDR II+, 100 MHz max clock (200 Mbps DDR); no echo clocks; 1.5 V only I/O Limited to lower-speed test equipment or legacy telecom systems requiring pin-for-pin replacement Select only if system clock < 125 MHz and echo clock functionality is unused
ISSI IS61QW25636A-250BQI 256K × 36 QDR II, same 250 MHz/500 Mbps spec; lacks JTAG; different BGA pinout (165-ball but non-compatible mapping) Requires PCB redesign; suitable for cost-sensitive industrial controllers where boundary scan is not required Choose when JTAG testability is unnecessary and layout flexibility permits new footprint

Compared with IDT72T3615L10BG and IS61QW25636A-250BQI, CY7C1413KV18-250BZI uniquely combines 250 MHz operation, echo clock support, and JTAG 1149.1 compliance in a single 165-ball FBGA-enabling higher-speed, testable, and layout-stable designs.

Availability

CY7C1413KV18-250BZI is available at Aetrix Electronics and suitable for high-speed packet buffering, network switch fabric memory, baseband digital front-end, and test equipment pattern memory requiring stable component supply across extended product lifecycles.

Supply support for CY7C1413KV18-250BZI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications, with emphasis on signal integrity and system-level integration.

CY7C1413KV18 belongs to the QDR® II SRAM product line, engineered specifically for deterministic, low-latency, concurrent-access memory subsystems in packet-switched infrastructure and high-speed instrumentation.

FAQ

What is the function of the DOFF pin on CY7C1413KV18-250BZI?

The DOFF (Data Output OFF) pin configures read latency mode: when asserted HIGH, it enables 1.5-cycle read latency for improved timing margin in high-speed layouts; when LOW, it reverts to 1-cycle latency for QDR I compatibility. This setting is sampled synchronously on the K clock and affects all subsequent read operations until changed.

How does the ZQ pin enable impedance calibration?

The ZQ pin connects to an external 240 Ω precision resistor to ground, allowing the device to calibrate its output driver and termination impedances dynamically. This ensures consistent HSTL signal integrity across voltage, temperature, and process variations-critical for maintaining eye opening at 500 Mbps DDR rates.

Can CY7C1413KV18-250BZI operate with only one clock input?

Yes-it supports single-clock domain operation using only the K clock for both address latching and data capture. In this mode, C/C clocks are unused, and Q[17:0] outputs are synchronized to K instead of C/C. This simplifies clock tree design but forfeits echo clock benefits and may reduce timing margin at maximum speed.

What is the purpose of BWS[1:0] in CY7C1413KV18-250BZI?

BWS[1:0] (Byte Write Select) pins control partial writes to the 18-bit data bus: BWS0 enables D[8:0], BWS1 enables D[17:9]. Both must be LOW to write full 18-bit words; asserting either HIGH masks its corresponding 9-bit byte, preserving existing memory contents. This enables efficient protocol header updates without full-word overwrites.

CY7C1413KV18-250BZI Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
36Mbit
Memory Organization:
2M x 18
Memory Interface:
Parallel
Clock Frequency:
250 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1413KV18-250BZI FAQ

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Please submit a Request for Quotation (RFQ) for CY7C1413KV18-250BZI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1413KV18-250BZI reliable?

The price and inventory of CY7C1413KV18-250BZI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1413KV18-250BZI is usually 5 days.

3.What payment methods are accepted for CY7C1413KV18-250BZI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1413KV18-250BZI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1413KV18-250BZI?

CY7C1413KV18-250BZI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1413KV18-250BZI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1413KV18-250BZI?

For technical support, including CY7C1413KV18-250BZI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1413KV18-250BZI requirements.

6.How does Aetrix verify that CY7C1413KV18-250BZI is sourced from the original manufacturer or authorized distributors?

All CY7C1413KV18-250BZI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1413KV18-250BZI meets industry standards.

7.What is the process for return or replacement of CY7C1413KV18-250BZI?

All CY7C1413KV18-250BZI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1413KV18-250BZI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1413KV18-250BZI part is unused and in its original packaging.

Return procedure for CY7C1413KV18-250BZI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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