Cypress Semiconductor Corp CY7C1413KV18-250BZI
- Part No.:
- CY7C1413KV18-250BZI
- Manufacturer:
- Cypress Semiconductor Corp
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1413KV18-250BZI.pdf
- Description:
- IC SRAM 36MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1413KV18-250BZI from Cypress Semiconductor is a 2 M × 18, 36-Mbit QDR® II SRAM with four-word burst architecture, 250 MHz maximum operating frequency (400 Mbps DDR data rate), 1.8 V core supply, and 1.4–1.8 V I/O supply. It delivers concurrent read/write operations via independent ports and supports depth expansion using RPS/WPS controls in high-bandwidth networking buffers.
For engineers reviewing the CY7C1413KV18-250BZI datasheet, CY7C1413KV18-250BZI pinout, CY7C1413KV18-250BZI application, or CY7C1413KV18-250BZI equivalent, key selection criteria include 1.5-cycle read latency (DOFF = HIGH), echo clock (CQ) support for timing margin recovery, HSTL-compatible output drive, JTAG 1149.1 test access, and 165-ball FBGA (13 × 15 × 1.4 mm) package compatibility.
Technical Context
This SRAM implements true dual-port QDR II architecture: separate read (Q[17:0]) and write (D[17:0]) data paths eliminate bus turnaround delays. Address latching occurs on alternating rising edges of K/K clocks, enabling full concurrency without arbitration logic.
It integrates a PLL for precise DDR edge alignment, uses echo clocks (CQ/CQ) to compensate for PCB flight time skew, and supports programmable impedance via ZQ pin. The device operates in single-clock mode (K-only) or dual-clock mode (K/K + C/C), with DOFF pin selecting between 1-cycle (LOW) and 1.5-cycle (HIGH) read latency.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 36 Mbit (2 M × 18 organization) |
| Max Clock Frequency | 250 MHz - enables 500 MT/s effective throughput per port |
| Data Rate | DDR at 500 Mbps - transfers 4 words per cycle on both read/write ports |
| Core Supply | 1.8 V ±0.1 V - defines internal timing margins and power consumption |
| I/O Supply Range | 1.4 V to 1.8 V - supports HSTL Class I/II and SSTL-15 compatibility |
| Read Latency | 1.5 cycles (DOFF = HIGH) - balances timing margin and pipeline efficiency |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - standard footprint for high-pin-count memory |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant Pb-free finish (BZI suffix).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[17:0] | Write data inputs | Synchronous to K/K rising edges; 18-bit parallel write path |
| Q[17:0] | Read data outputs | Synchronous to C/C rising edges; tristate-controlled, HSTL-compatible |
| K / K | Input clocks | Rising-edge-triggered for address/data capture; differential pair for jitter reduction |
| C / C | Output clocks | Source-synchronous with Q[17:0]; minimize skew vs. data flight time |
| CQ / CQ | Echo clocks | Replicate C/C timing at receiver; enable robust DDR capture in high-speed traces |
| WPS | Write port select | Active-low; gates write enable and D[17:0] sampling when asserted |
| RPS | Read port select | Active-low; enables Q[17:0] output drivers and read address decode |
| BWS[1:0] | Byte write selects | Active-low; control 9-bit byte groups (D[8:0], D[17:9]) for partial writes |
| DOFF | Read latency mode | HIGH → 1.5-cycle latency; LOW → 1-cycle latency (QDR I compatibility) |
| ZQ | Impedance calibration | Connects to external 240 Ω resistor for on-die termination tuning |
Key Features
| Feature | Design Value |
|---|---|
| Independent read/write ports | Enables simultaneous access without arbitration-critical for packet buffering in switches/routers |
| Four-word burst transfer | Reduces address bus toggling by 75% vs. single-word access-lowers system EMI and routing complexity |
| Echo clock (CQ) support | Allows receiver-side deskew without external delay lines-simplifies PCB layout for >400 Mbps links |
| JTAG 1149.1 boundary scan | Enables production test coverage of interconnects and BGA solder joints-reduces board-level debug time |
| Programmable output drive strength | Configurable via ZQ calibration-matches trace impedance across varying stackups and temperatures |
Applications
| High-Speed Packet Buffering | Network Switch Fabric Memory |
|---|---|
|
Use Scenario: Line-rate buffering of 10 GbE/40 GbE packet headers and metadata in L2/L3 switching ASICs. IC Role / Device Role / Timing Role: Dual-port SRAM acting as ingress/egress FIFO with zero-turnaround latency. Use Value: Concurrent read/write eliminates arbitration stalls, sustaining 500 MT/s sustained bandwidth per port under real traffic loads. |
Use Scenario: Shared memory pool for crossbar scheduler state and queue depth tracking in multi-stage switch fabrics. IC Role / Device Role / Timing Role: QDR II SRAM providing deterministic 1.5-cycle read latency for scheduler decision loops. Use Value: Echo clocks (CQ) ensure reliable data capture at 500 Mbps despite 80+ mm trace lengths on backplane PCBs. |
| Baseband Digital Front-End | Test Equipment Pattern Memory |
|
Use Scenario: Real-time storage of IQ samples during LTE/5G uplink/downlink channel estimation and precoding. IC Role / Device Role / Timing Role: High-throughput buffer interfacing directly with FPGA-based DSP pipelines. Use Value: 1.4–1.8 V I/O flexibility allows direct connection to 1.5 V FPGA I/O banks without level shifters. |
Use Scenario: Vector pattern storage in automated test equipment (ATE) for high-speed digital IC validation. IC Role / Device Role / Timing Role: Deterministic-access memory delivering stimulus/response data at 500 Mbps DDR rates. Use Value: JTAG boundary scan enables full interconnect testability-critical for ATE reliability certification. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T3615L10BG | 36-Mbit QDR II+, 100 MHz max clock (200 Mbps DDR); no echo clocks; 1.5 V only I/O | Limited to lower-speed test equipment or legacy telecom systems requiring pin-for-pin replacement | Select only if system clock < 125 MHz and echo clock functionality is unused |
| ISSI IS61QW25636A-250BQI | 256K × 36 QDR II, same 250 MHz/500 Mbps spec; lacks JTAG; different BGA pinout (165-ball but non-compatible mapping) | Requires PCB redesign; suitable for cost-sensitive industrial controllers where boundary scan is not required | Choose when JTAG testability is unnecessary and layout flexibility permits new footprint |
Compared with IDT72T3615L10BG and IS61QW25636A-250BQI, CY7C1413KV18-250BZI uniquely combines 250 MHz operation, echo clock support, and JTAG 1149.1 compliance in a single 165-ball FBGA-enabling higher-speed, testable, and layout-stable designs.
Availability
CY7C1413KV18-250BZI is available at Aetrix Electronics and suitable for high-speed packet buffering, network switch fabric memory, baseband digital front-end, and test equipment pattern memory requiring stable component supply across extended product lifecycles.
Supply support for CY7C1413KV18-250BZI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications, with emphasis on signal integrity and system-level integration.
CY7C1413KV18 belongs to the QDR® II SRAM product line, engineered specifically for deterministic, low-latency, concurrent-access memory subsystems in packet-switched infrastructure and high-speed instrumentation.
FAQ
What is the function of the DOFF pin on CY7C1413KV18-250BZI?
The DOFF (Data Output OFF) pin configures read latency mode: when asserted HIGH, it enables 1.5-cycle read latency for improved timing margin in high-speed layouts; when LOW, it reverts to 1-cycle latency for QDR I compatibility. This setting is sampled synchronously on the K clock and affects all subsequent read operations until changed.
How does the ZQ pin enable impedance calibration?
The ZQ pin connects to an external 240 Ω precision resistor to ground, allowing the device to calibrate its output driver and termination impedances dynamically. This ensures consistent HSTL signal integrity across voltage, temperature, and process variations-critical for maintaining eye opening at 500 Mbps DDR rates.
Can CY7C1413KV18-250BZI operate with only one clock input?
Yes-it supports single-clock domain operation using only the K clock for both address latching and data capture. In this mode, C/C clocks are unused, and Q[17:0] outputs are synchronized to K instead of C/C. This simplifies clock tree design but forfeits echo clock benefits and may reduce timing margin at maximum speed.
What is the purpose of BWS[1:0] in CY7C1413KV18-250BZI?
BWS[1:0] (Byte Write Select) pins control partial writes to the 18-bit data bus: BWS0 enables D[8:0], BWS1 enables D[17:9]. Both must be LOW to write full 18-bit words; asserting either HIGH masks its corresponding 9-bit byte, preserving existing memory contents. This enables efficient protocol header updates without full-word overwrites.
CY7C1413KV18-250BZI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Cypress Semiconductor Corp
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 36Mbit
- Memory Organization:
- 2M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 250 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1413KV18-250BZI FAQ
1.How can I place an order for CY7C1413KV18-250BZI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1413KV18-250BZI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1413KV18-250BZI reliable?
The price and inventory of CY7C1413KV18-250BZI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1413KV18-250BZI is usually 5 days.
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CY7C1413KV18-250BZI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1413KV18-250BZI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1413KV18-250BZI?
For technical support, including CY7C1413KV18-250BZI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1413KV18-250BZI requirements.
6.How does Aetrix verify that CY7C1413KV18-250BZI is sourced from the original manufacturer or authorized distributors?
All CY7C1413KV18-250BZI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1413KV18-250BZI meets industry standards.
7.What is the process for return or replacement of CY7C1413KV18-250BZI?
All CY7C1413KV18-250BZI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1413KV18-250BZI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1413KV18-250BZI part is unused and in its original packaging.
Return procedure for CY7C1413KV18-250BZI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1413KV18-250BZI Tags

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