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Cypress Semiconductor Corp CY7C1415KV18-250BZC

Part No.:
CY7C1415KV18-250BZC
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1415KV18-250BZC.pdf
Description:
IC SRAM 36MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:225

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Product details

Overview

CY7C1415KV18 from Cypress Semiconductor is a 1 M × 36, 36-Mbit QDR® II SRAM with four-word burst architecture, 250 MHz maximum operating frequency (400 Mbps per pin), 1.8 V core supply, and 1.4–1.8 V I/O supply. It features separate read/write ports, echo clocks (CQ/CQ), and PLL-based DDR timing for high-bandwidth networking buffer applications.

For engineers reviewing the CY7C1415KV18 datasheet, CY7C1415KV18 pinout, CY7C1415KV18 application, or CY7C1415KV18 equivalent, key selection criteria include concurrent read/write throughput, 1-cycle vs. 1.5-cycle read latency (DOFF-controlled), FBGA-165 package compatibility, and HSTL-15/18 I/O drive support in high-speed packet buffering systems.

Technical Context

This QDR II SRAM implements dual independent DDR interfaces: read data transfers on rising edges of C/C clocks at 500 Mbps (250 MHz × 2), while write data latches on K/K clock rising edges. Address bus is multiplexed and sampled synchronously on K clock rising edges for both ports.

The device uses internal self-timed writes and supports programmable read latency (1 or 1.5 cycles) via DOFF pin. Echo clocks CQ/CQ are phase-aligned with output data to simplify capture in FPGA-based line cards, and the PLL ensures precise data placement relative to system clocks.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 36 Mbit (1 M × 36 organization)
Max Clock Frequency 250 MHz - enables 500 Mbps per data pin (DDR)
Read Latency Configurable: 1 cycle (DOFF = LOW) or 1.5 cycles (DOFF = HIGH)
Core Supply (VDD) 1.8 V ±0.1 V - defines internal logic voltage and power envelope
I/O Supply (VDDQ) 1.4 V to 1.8 V - supports HSTL-15 or HSTL-18 interface standards
Package 165-ball FBGA (13 × 15 × 1.4 mm) - industry-standard footprint for high-pin-count memory
Burst Length Four-word burst - reduces address bus toggling frequency by 4× vs. single-word access

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
D[35:0] Write data inputs 36-bit synchronous input bus latched on K/K rising edges; supports byte-level write masking via BWS[3:0]
Q[35:0] Read data outputs 36-bit DDR output bus driven on C/C rising edges; echo clocks CQ/CQ align with valid data windows
K, K Write/read address & control clock inputs Dual complementary clocks - only rising edges used for all synchronous inputs (address, WPS, RPS, BWS)
C, C Read data output clocks Dual complementary clocks driving Q[35:0] and CQ/CQ; minimize skew between data and capture clock
CQ, CQ Echo clocks Output-only copies of C/C, phase-matched to Q[35:0] for simplified FPGA input capture without deskew logic
WPS, RPS Port select controls Active-low enables for independent write/read port activation - essential for depth expansion and port arbitration
BWS[3:0] Byte write selects Four active-low signals enabling/disabling 9-bit byte lanes (D[8:0], D[17:9], D[26:18], D[35:27]) during writes
DOFF Read latency mode control High = 1.5-cycle latency (pipelined read); Low = 1-cycle latency (QDR I compatibility mode)

Key Features

Feature Design Value
Separate read/write data paths Eliminates bus turnaround delay - enables true concurrent read+write at full bandwidth
Four-word burst architecture Reduces effective address bus frequency by 75%, easing PCB routing and timing closure in 250 MHz systems
HSTL-compatible I/O buffers Programmable drive strength supports 1.5 V or 1.8 V VDDQ - interoperable with Stratix IV/V, Virtex-6, and ASIC memory controllers
JTAG 1149.1 test access port Enables boundary-scan testing of interconnects in dense FBGA layouts without physical probe access
On-chip PLL for data alignment Compensates for internal clock-to-output delay variations across voltage/temperature - ensures consistent setup/hold margins

Applications

Telecom Line Card Buffer Network Packet Processor Cache

Use Scenario: High-speed packet buffering in 10G/40G Ethernet line cards where ingress/egress traffic must be decoupled with minimal latency.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as first-level shared buffer between MAC and switch fabric, synchronized to 250 MHz system clock with echo-clock–assisted data capture.

Use Value: Concurrent 500 Mbps read + 500 Mbps write throughput eliminates serialization bottlenecks in full-duplex traffic flow.

Use Scenario: Temporary storage for packet headers and metadata in multi-core network processors requiring low-latency random access.

IC Role / Device Role / Timing Role: QDR II SRAM serving as instruction/data cache for packet classification engines, configured with DOFF = LOW for 1-cycle read latency.

Use Value: Four-word burst delivers header blocks in one cycle - reducing average memory access time by 4× versus single-word SRAM.

Baseband Digital Front-End Test Equipment Pattern Memory

Use Scenario: Real-time buffering of IQ samples between ADC/DAC and DSP in LTE/5G baseband units operating at 200+ MSPS.

IC Role / Device Role / Timing Role: Synchronous pipelined memory interfacing directly to FPGA fabric with CQ/CQ echo clocks aligned to sample clock domain.

Use Value: 1.8 V core + 1.4 V I/O reduces dynamic power by ~22% vs. 2.5 V QDR I parts while maintaining 500 Mbps per pin bandwidth.

Use Scenario: Vector pattern storage in high-speed ATE systems requiring deterministic read/write timing and glitch-free address transitions.

IC Role / Device Role / Timing Role: Deterministic latency SRAM used for stimulus/response storage, leveraging self-timed writes and DOFF-configurable read pipeline.

Use Value: JTAG boundary scan enables in-system verification of all 165-ball interconnects - critical for production test repeatability.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72T36120L10BG 36-Mbit QDR II+, 167-ball FBGA, 333 MHz max, 1.5 V core/I/O Higher speed but requires 1.5 V only; no DOFF latency toggle - fixed 1.5-cycle read Choose when system clock > 250 MHz and 1.5 V supply is standardized; avoid if 1-cycle latency or mixed VDDQ needed.
ISSI IS61WV102436B 36-Mbit QDR II, 165-ball FBGA, 200 MHz max, 1.8 V core, 1.5 V I/O Lower max frequency; lacks echo clocks and PLL - requires external capture clock deskew Choose for cost-sensitive designs with ≤200 MHz bandwidth and FPGA I/O with built-in IDELAY/ISERDES.

Compared with IDT72T36120L10BG and IS61WV102436B, CY7C1415KV18 uniquely supports configurable 1/1.5-cycle read latency and 1.4–1.8 V VDDQ flexibility - critical for mixed-voltage FPGA platforms and latency-critical packet buffering.

Availability

CY7C1415KV18 is available at Aetrix Electronics and suitable for telecom line card buffer, network packet processor cache, and baseband digital front-end applications requiring stable component supply, long-lifecycle support, and traceable sourcing.

Supply support for CY7C1415KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial systems, with focus on signal integrity and timing precision.

CY7C1415KV18 belongs to the QDR® II SRAM product line, engineered specifically for deterministic, high-throughput buffering in packet-switched infrastructure where concurrent read/write and sub-ns timing control are mandatory.

FAQ

What is the function of the DOFF pin on CY7C1415KV18?

The DOFF (Data Output OFFset) pin configures read latency mode: when asserted HIGH, it enables 1.5-cycle read latency (QDR II mode); when LOW, it selects 1-cycle latency (QDR I compatibility). This setting is sampled synchronously on the K clock rising edge at power-up or during operation, and affects all subsequent read transactions until changed.

Can CY7C1415KV18 operate with only a single clock domain (K = C)?

Yes - CY7C1415KV18 supports single-clock mode where K and C are tied together (and K and C likewise). In this configuration, data is latched and driven on the same clock edges, simplifying timing but reducing maximum achievable bandwidth compared to dual-clock operation with optimized skew management.

How many address bits does CY7C1415KV18 require, and how are they used?

CY7C1415KV18 requires 18 address bits (A[17:0]) to access its 1 M × 36 array. These are multiplexed for both read and write operations and sampled on the rising edge of the K clock. The internal four-array structure (256 K × 36 each) allows full addressing with fewer pins than discrete parallel SRAMs.

What is the purpose of the BWS[3:0] signals, and how do they map to data bits?

BWS[3:0] are active-low byte write select signals controlling 9-bit lanes: BWS0 → D[8:0], BWS1 → D[17:9], BWS2 → D[26:18], BWS3 → D[35:27]. When a BWS bit is deasserted (HIGH), the corresponding 9-bit byte is masked and unchanged during write cycles - enabling partial-word updates without read-modify-write overhead.

CY7C1415KV18-250BZC Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Bulk
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
36Mbit
Memory Organization:
1M x 36
Memory Interface:
Parallel
Clock Frequency:
250 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1415KV18-250BZC FAQ

1.How can I place an order for CY7C1415KV18-250BZC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1415KV18-250BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1415KV18-250BZC reliable?

The price and inventory of CY7C1415KV18-250BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1415KV18-250BZC is usually 5 days.

3.What payment methods are accepted for CY7C1415KV18-250BZC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1415KV18-250BZC transactions.

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4.How is shipping managed for CY7C1415KV18-250BZC?

CY7C1415KV18-250BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1415KV18-250BZC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1415KV18-250BZC?

For technical support, including CY7C1415KV18-250BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1415KV18-250BZC requirements.

6.How does Aetrix verify that CY7C1415KV18-250BZC is sourced from the original manufacturer or authorized distributors?

All CY7C1415KV18-250BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1415KV18-250BZC meets industry standards.

7.What is the process for return or replacement of CY7C1415KV18-250BZC?

All CY7C1415KV18-250BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1415KV18-250BZC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1415KV18-250BZC part is unused and in its original packaging.

Return procedure for CY7C1415KV18-250BZC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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