Cypress Semiconductor Corp CY7C1418KV18-333BZC

Overview

CY7C1418KV18-333BZC from Cypress Semiconductor is a 36-Mbit (2M × 18) DDR II synchronous SRAM with two-word burst architecture, 333 MHz clock frequency, 1.8 V core supply, HSTL I/O, and 165-ball FBGA package. It delivers 666 MT/s data transfer via double data rate interface and supports configurable read latency (1 or 1.5 cycles) via DOFF pin for high-bandwidth networking buffer applications.

For engineers reviewing the CY7C1418KV18-333BZC datasheet, CY7C1418KV18-333BZC pinout, CY7C1418KV18-333BZC application, or CY7C1418KV18-333BZC equivalent, key selection criteria include DDR-II timing compliance, echo clock (CQ/CQ) synchronization capability, burst-addressed 18-bit data width, and JTAG 1149.1 test port support in high-speed memory subsystems.

Technical Context

This SRAM implements a synchronous pipelined architecture with internal burst counter driven by A0, latching addresses on alternate rising edges of complementary K/K clocks. Write data is registered on both K and K edges, while read data is output-synchronized to C/C clocks (or K/K in single-clock mode), enabling precise timing control in multi-device DDR systems.

The device integrates a PLL for accurate data placement, supports variable-drive HSTL outputs (1.4 V to VDD), and uses ZQ pin for on-die impedance calibration against external RQ resistor. DOFF pin selects between 1-cycle (DDR-I-like) and 1.5-cycle (DDR-II) read latency modes, directly affecting system timing budget allocation.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, with 0.8 mm ball pitch and standard JEDEC MO-270AC footprint.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR II SRAM applications.

Compared with AS7C362000B-333BIN and IS61WV102418BLL-333T, CY7C1418KV18-333BZC uniquely provides echo clocks for simplified high-speed capture, programmable latency, and on-die impedance matching-critical for new DDR-II memory subsystems demanding >300 MHz operation with minimal timing margin risk.

Availability

CY7C1418KV18-333BZC is available at Aetrix Electronics and suitable for high-bandwidth packet buffering, baseband processing, industrial motion control, and automated test equipment requiring stable component supply and long-term obsolescence management.

Supply support for CY7C1418KV18-333BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable solutions for industrial, automotive, and communications markets.

CY7C1418KV18 belongs to Cypress's DDR II SRAM product line, designed specifically for high-throughput, low-latency memory buffering in networking, test, and signal processing systems where precise timing control and signal integrity are critical.

FAQ

What is the function of the DOFF pin on CY7C1418KV18-333BZC?

The DOFF pin selects read latency mode: when asserted LOW, it configures the device for 1-cycle DDR-I–compatible latency; when HIGH, it enables 1.5-cycle DDR-II latency. This setting directly affects the timing relationship between address load and valid data output, and must be held stable during operation. The pin is sampled synchronously on the K clock edge at initialization.

Can CY7C1418KV18-333BZC operate without external C and C clocks?

Yes - the device supports single-clock mode where K and K serve as both input and output data clocks. In this configuration, C and C pins are unused, and read data is driven on K/K edges. However, echo clocks (CQ/CQ) remain functional and phase-aligned to K/K, preserving their utility for data capture timing even without dedicated C/C routing.

How does ZQ pin calibration affect signal integrity?

ZQ connects to an external precision resistor (typically 240 Ω) to ground, enabling on-die calibration of DQ and CQ output driver impedance to ~48 Ω (0.2 × RQ). This matches common PCB trace impedances, minimizing reflections and improving eye diagram margins. Leaving ZQ unconnected or tying it to GND disables calibration and forces minimum drive strength, degrading signal fidelity at 333 MHz.

Is CY7C1418KV18-333BZC pin-compatible with CY7C1420KV18-333BZC?

No - although both share the same 165-ball FBGA package and many signal names, pin assignments differ significantly. For example, CY7C1418KV18 uses DQ[17:0] and BWS[1:0], while CY7C1420KV18 uses DQ[35:0] and BWS[3:0]; their address and byte-select layouts are incompatible. Board-level replacement requires redesign of signal routing and firmware addressing logic.