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Cypress Semiconductor Corp CY7C1423KV18-250BZC

Part No.:
CY7C1423KV18-250BZC
Manufacturer:
Cypress Semiconductor Corp
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1423KV18-250BZC.pdf
Description:
IC SRAM 36MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,436

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Product details

Overview

CY7C1423KV18-250BZC from Cypress Semiconductor is a 36-Mbit (2M × 18) DDR II synchronous SRAM with separate I/O architecture, operating at 250 MHz clock frequency (500 MT/s effective data rate), 1.8 V core supply, and HSTL-compatible 1.4–1.8 V I/O voltage range. It supports two-word burst reads/writes, uses dual input clocks (K/K) for precise timing control, and delivers read latency of 1.5 cycles when DOFF = HIGH - deployed in high-speed packet buffering and network line-card memory subsystems.

For engineers reviewing the CY7C1423KV18-250BZC datasheet, CY7C1423KV18-250BZC pinout, CY7C1423KV18-250BZC application, or CY7C1423KV18-250BZC equivalent, key selection criteria include DDR II SIO interface compatibility, 165-ball FBGA (13 × 15 mm) mechanical fit, 250 MHz maximum clock frequency, and support for echo clocks (CQ/CQ) to simplify high-speed data capture in multi-device memory systems.

Technical Context

This SRAM implements a pipelined, synchronous DDR II SIO architecture with physically isolated read and write ports - eliminating bus turnaround delays. It uses dual-edge-synchronized address latching on K/K rising edges and supports both single-clock (K/K only) and dual-clock (C/C + CQ/CQ) operation modes for output data timing control.

The device integrates a PLL for accurate data placement, JTAG 1149.1 test access port, and programmable output impedance via ZQ calibration. Read latency is configurable: 1 cycle (DDR I mode, DOFF = LOW) or 1.5 cycles (DDR II mode, DOFF = HIGH), with all synchronous inputs registered on K/K and outputs registered on C/C (or K/K in single-clock mode).

Key Specifications

Parameter Value and Actual Design Meaning
Density 36 Mbit (2M × 18 organization), enabling compact high-bandwidth buffer storage without depth expansion
Max Clock Frequency 250 MHz - sets maximum sustained transaction rate at 250 million bursts/second
Data Rate 500 MT/s (DDR, double-data-rate on K/K) - delivers 9 Gbps aggregate bandwidth across 18-bit bus
Supply Voltage 1.8 V core (VDD), 1.4–1.8 V I/O (VDDQ) - supports mixed-voltage system integration with HSTL-18 or HSTL-15 interfaces
Read Latency 1.5 cycles (DOFF = HIGH) or 1 cycle (DOFF = LOW) - selectable timing behavior matching controller pipeline depth
Package 165-ball FBGA (13 × 15 × 1.4 mm, 0.8 mm pitch) - standard footprint for high-density PCB layouts with thermal and signal integrity optimization
Operating Temp 0 °C to +70 °C - commercial-grade temperature range suitable for enterprise networking and industrial compute applications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm body, 1.4 mm height, 0.8 mm ball pitch, RoHS-compliant Pb-free option available.

Pin/Terminal Circuit Role Design Meaning
D[17:0] Synchronous data input 18-bit write data bus sampled on rising edges of both K and K clocks; supports byte-write masking via BWS0/BWS1
Q[17:0] Synchronous data output 18-bit read data bus driven on rising edges of C/C (or K/K); automatically tristated when read port inactive
K / K Input clock pair Complementary clocks for address/control/data capture; all synchronous inputs registered on rising edges
C / C Output clock pair Complementary clocks for Q[17:0] output timing; enables flight-time deskewing across multiple SRAMs
CQ / CQ Echo clock pair Free-running output clocks synchronized to C/C; used by controller to latch Q[17:0] with zero setup/hold margin
DOFF Latency mode control Active-HIGH selects DDR II mode (1.5-cycle read latency); LOW enables DDR I mode (1-cycle latency)
ZQ Impedance calibration input Connects to external RQ resistor (to GND) to tune Q/CQ output impedance to 0.2 × RQ; or tie to VDDQ for min-impedance mode

Key Features

Feature Design Value
DDR II Separate I/O Architecture Eliminates bidirectional bus turnaround delay by dedicating D[17:0] for writes and Q[17:0] for reads - increases effective throughput by ~30% vs common-I/O SRAMs
Two-Word Burst Access Each address fetches two sequential 18-bit words per clock cycle - reduces address bus activity by 50% and simplifies controller address generation logic
Programmable Output Impedance ZQ-calibrated drive strength matches trace impedance (typically 50 Ω), minimizing signal reflections and improving eye diagram margin at 500 MT/s
Configurable Read Latency DOFF pin selects between 1-cycle (DDR I) and 1.5-cycle (DDR II) latency - allows tuning to match controller pipeline stages without firmware change
JTAG 1149.1 Boundary Scan Enables in-system testability and interconnect verification on dense PCBs - supports production test and debug without physical probe access

Applications

Telecom Packet Buffering Industrial Real-Time Controller Cache

Use Scenario: Storing ingress/egress Ethernet frames in Layer-2/Layer-3 switches before forwarding decision and egress scheduling.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM acting as first-level packet buffer with deterministic 1.5-cycle read response under DOFF = HIGH configuration.

Use Value: Enables full-line-rate 10G Ethernet processing with zero packet loss under bursty traffic, leveraging 500 MT/s bandwidth and burst-aligned addressing.

Use Scenario: Holding real-time motion control instruction sequences and sensor feedback buffers in CNC machine controllers.

IC Role / Device Role / Timing Role: Deterministic-access memory providing jitter-free data delivery to FPGA-based motion sequencers with sub-10 ns timing tolerance.

Use Value: Guarantees <100 ns worst-case read-to-output delay (including CQ echo clock alignment), meeting hard real-time loop deadlines.

Test Equipment Pattern Memory Medical Imaging Data Pipeline

Use Scenario: Storing stimulus/response vectors in automated test equipment (ATE) for semiconductor wafer probing.

IC Role / Device Role / Timing Role: High-reliability SRAM with JTAG boundary scan supporting production test coverage and post-deployment diagnostics.

Use Value: Achieves >99.99% fault coverage for interconnect testing, reducing field failure escapes and enabling in-system repair validation.

Use Scenario: Temporary storage of raw ultrasound or MRI pixel streams during on-the-fly compression and DICOM packaging.

IC Role / Device Role / Timing Role: Low-power, thermally stable memory interfacing directly to ADC/DSP chains with HSTL-18 signaling compatibility.

Use Value: Maintains 1.8 V core operation while supporting 1.5 V I/O swing - reduces EMI and improves SNR in sensitive analog front-end environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
AS7C336200B-25BIN 36-Mbit (2M × 18), 250 MHz, but uses common I/O (not SIO) and lacks echo clocks (CQ/CQ) and ZQ calibration Requires bus turnaround management and external termination; unsuitable for systems needing zero-skew DDR capture Select only if board layout constraints prohibit separate I/O routing and echo clock fanout
IS61WV102418BLL-25BLI 18-Mbit (512K × 36), 250 MHz, single-ended LVCMOS I/O, no DDR, no PLL, no JTAG Limited to lower density and non-DDR timing; requires simpler controller but sacrifices bandwidth and timing precision Choose when cost sensitivity outweighs bandwidth needs and system clocking infrastructure is minimal

Compared with AS7C336200B-25BIN and IS61WV102418BLL-25BLI, CY7C1423KV18-250BZC uniquely delivers DDR II SIO architecture with echo clocks and ZQ calibration - essential for deterministic, high-fidelity data capture in 10G+ systems where timing margin is constrained to <100 ps.

Availability

CY7C1423KV18-250BZC is available at Aetrix Electronics and suitable for telecom packet buffering, industrial real-time controller cache, and test equipment pattern memory requiring stable component supply, long-lifecycle support, and guaranteed FBGA package consistency.

Supply support for CY7C1423KV18-250BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for demanding embedded and communications applications, with focus on signal integrity, timing precision, and system-level reliability.

CY7C1423KV18 belongs to Cypress's DDR II SIO SRAM product line, engineered specifically for applications requiring deterministic low-latency memory access with zero bus turnaround overhead - targeting network infrastructure, test instrumentation, and real-time control systems.

FAQ

What is the function of the DOFF pin on CY7C1423KV18-250BZC?

The DOFF (Data Output OFF) pin configures read latency mode: when asserted HIGH, it enables DDR II operation with 1.5-cycle read latency and optimized burst timing; when LOW, it reverts to DDR I behavior with 1-cycle latency. This pin does not disable outputs - it only modifies internal pipeline staging. The setting must be stable before initialization and remain unchanged during operation.

Can CY7C1423KV18-250BZC operate without C and C clocks?

Yes - the device supports single-clock mode using only K and K for both input sampling and output timing. In this mode, Q[17:0] is driven on rising edges of K/K, and CQ/CQ are generated relative to K/K instead of C/C. However, echo clock functionality and flight-time deskew capability are lost, limiting maximum reliable data rate in multi-device configurations.

How is output impedance calibrated using the ZQ pin?

ZQ connects to an external precision resistor (RQ) tied to ground; the device measures RQ and configures its output drivers to deliver 0.2 × RQ impedance on Q[17:0] and CQ/CQ pins. For example, a 240 Ω RQ yields ~48 Ω driver impedance. Alternatively, tying ZQ to VDDQ enables minimum-impedance mode (~25 Ω), useful for short-trace, low-capacitance interfaces.

Is CY7C1423KV18-250BZC pin-compatible with other speeds in the same family?

Yes - CY7C1423KV18-250BZC shares identical 165-ball FBGA pinout and signal mapping with CY7C1423KV18-300BZC and CY7C1423KV18-333BZC. Speed grade differences affect only AC timing parameters (tCK, tAC, etc.), not DC characteristics or pin functions. System-level timing margin analysis is required when upgrading speed grades.

CY7C1423KV18-250BZC Specifications

Product attributes
Attribute value
Manufacturer:
Cypress Semiconductor Corp
Series:
-
Package/Case:
165-LBGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, DDR II
Memory Size:
36Mbit
Memory Organization:
2M x 18
Memory Interface:
Parallel
Clock Frequency:
250 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1423KV18-250BZC FAQ

1.How can I place an order for CY7C1423KV18-250BZC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1423KV18-250BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1423KV18-250BZC reliable?

The price and inventory of CY7C1423KV18-250BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1423KV18-250BZC is usually 5 days.

3.What payment methods are accepted for CY7C1423KV18-250BZC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1423KV18-250BZC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1423KV18-250BZC?

CY7C1423KV18-250BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1423KV18-250BZC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1423KV18-250BZC?

For technical support, including CY7C1423KV18-250BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1423KV18-250BZC requirements.

6.How does Aetrix verify that CY7C1423KV18-250BZC is sourced from the original manufacturer or authorized distributors?

All CY7C1423KV18-250BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1423KV18-250BZC meets industry standards.

7.What is the process for return or replacement of CY7C1423KV18-250BZC?

All CY7C1423KV18-250BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1423KV18-250BZC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1423KV18-250BZC part is unused and in its original packaging.

Return procedure for CY7C1423KV18-250BZC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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